SPECIFICATION (preliminary) ITEM NEW WHITE SIDE VIEW LED MODEL SZAF0B CUSTOMER Customer Approved by Approved by Approved by / / / Supplier Drawn by Checked by Approved by / / / SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B Contents 1. Features 02 2. Application 02 3. Absolute Maximum Ratings 03 4. Electro-Optical Characteristics 03 5. CIE Chromaticity Diagram 04 6. Characteristic Diagram 05 7. Reliability 08 8. Precautions 09 9. Soldering Profile 10 10. Outline Dimension 11 11. Packing 12 12. Reel Packing Structure 13 13. History 14 SSC-QP-7-03-44(갑) 1 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 1. Features The High Gamut LED Package: SMT Solderability Dimension : 3.7 × 0.9 × 0.4 (mm) Low Thermal Resistance RoHS Compliant, Lead Free Suitable for Small Applications Own Patent Reserved SZAF0B is Very Useful Side View LED in Back Light Unit Application 2. Applications Flat Backlighting (LCD, Display) Mobile Phone, Camera, PDA, Notebook Coupling into Light Guide Panel AV Systems SSC-QP-7-03-44(갑) 2 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 3. Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Value Unit Power Dissipation Pd*1 120 mW IF 30 mA IFM*2 100 mA V Forward Current Peak Forward Current *1 *2 Reverse Voltage VR 5 Operating Temperature Topr -30 ~ +85 ° Storage Temperature Tstg -40 ~ +100 ° Junction Temperature Tj 125 ° C C C Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. IFM conditions : Pulse width TW ≤ 0.1ms, Duty ratio ≤ 1/10 4. Electro-Optical Characteristics Item (Ta = 25°C) Symbol Condition Rank Y Rank Z Forward Voltage VF IF = 20 mA Rank A Reverse Current IR VR = 5 V Rank I8 Luminous Intensity*1 Rank I9 Rank J0 IV IF = 20 mA Rank J1 Viewing Angle 2θ1/2 *2 Color Coordinates Rank b y Typ Max 2.7 - 3.0 3.0 - 3.3 3.3 - 3.7 - - 50 800 - 900 900 - 1000 1000 - 1100 1100 - 1200 IF = 20 mA x *3 Min IF = 20 mA y 120 Unit V µA mcd ˚ 0.264 - 0.295 0.248 - 0.295 0.276 - 0.315 - *1 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. *3 Measurement Uncertainty of the Color Coordinates ±0.01 Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor. SSC-QP-7-03-44(갑) 3 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 5. CIE Chromaticity Diagram 0.9 0.7 y Coord. 0.6 0.5 0.4 0.3 0.2 0.34 0.32 y Coord. 0.8 0.36 520 515 525530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 610 620 490 630 830 0.0 0.0 480 475 470 460 0.1 0.30 e 0.28 b 0.26 485 0.1 f 0.24 0.2 0.3 0.4 0.5 0.6 0.7 0.22 0.24 0.8 0.26 0.28 x Coor d. 0.30 0.32 0.34 0.36 x Coor d. Luminous Intensity Ranking by Color Coordinates b Ranking by Luminous Intensity * RANK Min Max I8 800 900 I9 900 1000 J0 1000 1100 J1 1100 1200 e f Unit √ √ mcd √ √ The Checked ranks are available Color Rank (IF = 20 mA, Ta = 25°C) b e f x y x y x y 0.264 0.280 0.296 0.287 0.267 0.248 0.276 0.295 0.296 0.311 0.307 0.287 0.276 0.294 0.315 0.295 0.311 0.330 0.330 0.307 0.294 0.318 0.339 0.315 SSC-QP-7-03-44(갑) 4 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 6. Characteristic Diagram Forward Current vs. Forward Voltage Intensity vs. Forward Current 1600 Ta = 25 C O 1200 10 1 1000 800 600 400 200 0 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 0 5 10 15 20 25 30 35 Forward Current [mA] Forward Voltage [V ] Forward Current vs. Ambient Temperature Radiation Diagram 30 1.0 x Coord. y Coord. 25 20 Intensity Forward current [mA] Ta = 25 C 1400 Intensity [mcd] Forward Current [mA] O 15 0.5 10 5 0 -30 -15 0 0.0 15 30 45 60 75 90 -100 -80 -60 -40 -20 o Ambient temperature [ C] SSC-QP-7-03-44(갑) 0 20 40 60 80 100 Theta 5 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B Color Coordinate vs. Forward Current Spectrum 0.266 Ta = 25 C O 30 mA O Ta = 25 C IF = 20 mA y Coord. Intensity [%] 0.265 0.264 1 mA 0.263 0.274 0.276 0.278 0.280 400 500 Forward Voltage vs. Ambient Temperature 800 0.280 IF = 20 mA o IF = 20 mA 1.04 -30 C 0.278 1.02 y Coord. O 700 Color Coordinate vs. Ambient Temperature 1.06 VF / VF [25 C] 600 Wavelength [nm] x Coord. 1.00 0.276 o 25 C 0.274 0.98 0.272 0.96 o 85 C 0.94 -45 -30 -15 0 15 30 45 60 75 0.270 90 o 0.284 0.286 0.288 0.290 x Coord. Ambient Temperature [ C] SSC-QP-7-03-44(갑) 0.282 6 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B Relative Luminosity vs. Ambient Temperature Allowable Forward Current vs. Duty Ratio 120 Allowable Forward Current [mA] 1.1 o Iv / Iv [25 C] 1.2 1.0 0.9 0.8 0.7 -30 -15 0 15 30 45 60 o 75 90 Ambient Temperature [ C] SSC-QP-7-03-44(갑) Ta = 25 C O 100 80 60 40 20 1 10 100 Duty Ratio [%] 7 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 7. Reliability (1) TEST ITEMS AND RESULTS TEST ITEM Test conditions Note Number of Damaged Reference EIAJ ED-4701 100 101 EIAJ ED-4701 100 101 EIAJ ED-4701 300 307 Life Test 1 Ta = 25°C; IF = 20 mA 1000 hrs. 0/20 Life Test 2 Ta = 25°C; IF = 30 mA 500 hr 0/20 -30°C ~ 85°C 20 cycle 0/50 High Temperature Life Test Ta = 85°C; IF = 5 mA 1000 hrs. 0/20 - Low Temperature Life Test Ta = - 30°C; IF = 20 mA 1000 hrs. 0/20 - High Temperature Storage Ta = 100°C 1000 hrs. 0/50 Low Temperature Storage Ta = - 40°C 1000 hrs. 0/50 Ta = 60°C; RH = 90%, IF = 20 mA 500 hrs. 0/20 Ta = 60°C; RH = 90% 1000 hrs. 0/50 2 times 0/50 1 time over 95% 0/50 100 cycle 0/50 10 cycle 0/50 Thermal Shock (30 min) (30 min) High Humidity Heat Life Test*1 Humidity Heat Load Resistance to Soldering Heat Solder ability (Reflow Soldering) Tsld = 260°C, 10 sec Pre treatment; 30°C, 70%, 168 hr Tsld = 215±5°C, 3 sec (Lead Solder) - 40°C ~ 25°C ~ 100°C ~ 25°C Temperature Cycle (30 min) Moisture Resistance Cycle (5 min) (30 min) (5 min) 25°C ~ 65°C ~ - 10°C RH = 90%, 24 hr / 1 cycle EIAJ ED-4701 200 201 EIAJ ED-4701 200 202 EIAJ ED-4701 100 102 EIAJ ED-4701 100 103 EIAJ ED-4701 301 302 EIAJ ED-4701 303 EIAJ ED-4701 100 105 EIAJ ED-4701 200 203 (2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Condition Criteria for Judgment Min. Max. Forward Voltage VF IF = 20 mA - U.S.L × 1.2 Reverse Current IR VR = 5 V - U.S.L × 2.0 Luminous Intensity IV IF = 20 mA L.S.L × 0.5 - U.S.L. : Upper Standard Level, SSC-QP-7-03-44(갑) L.S.L. : Lower Standard Level, 8 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 8. Precautions (1) Storage conditions Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH. In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas. (2) After opening the package When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5°C to 40°C and the humidity at less than 30%. Soldering should be done within 7 days after opening the desiccant package. If the product has been exposed for more than 7 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 60°C and 65°C for 10 to 12 hours. An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. (3) Precautions for use Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling. The product should not be mounted on a distorted part of PCB. Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. (4) Miscellaneous Radiation resistance is not considered. When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used. When using the product, operating current should be settled in consideration of the maximum ambient temperature. Its appearance or specification for improvement is subject to change without notice. SSC-QP-7-03-44(갑) 9 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 9. Soldering Profile The LED can be soldered in place using the reflow soldering method. (1) Lead solder Preliminary heating to be at maximum 210°C for maximum 2 minutes. Soldering heat to be at maximum 240°C for maximum 10 seconds. o Device Surface Temperature [ C] 280 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (2) Lead-free solder Preliminary heating to be at maximum 220°C for maximum 2 minutes. Soldering heat to be at maximum 260°C for maximum 10 seconds. o Device Surface Temperature [ C] 280 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (3) Hand Soldering conditions Not more than 5 seconds @MAX 300°C, under Soldering iron. SSC-QP-7-03-44(갑) 10 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 10. Outline Dimension ( Tolerance : ±0.2, Unit : mm ) MOLD GATE <Bottom View> Cathode Anode Recommended solder Pattern SSC-QP-7-03-44(갑) 11 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 11. Packing ( Tolerance : ±0.2, Unit : mm ) Cathode Anode SECTION B-B' 180 15.4 ±1.0 +0 -3 13 +0.2 -0 60 +1 -0 2 ±0.2 22 13 ±0.3 Label (1) Quantity: 3500 pcs / Reel (2) Cumulative Tolerance : Cumulative Tolerance / 10 pitches to be ±0.2 mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1 - 0.7 N when the cover tape is turned off from the carrier tape at 10° angle to be the carrier tape (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-7-03-44(갑) 12 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 12. Reel Packing Structure Reel Aluminum Vinyl Bag Desiccant Humidity indicator Barcode Label RANK : Outer Box Structure XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXX SSC PART NUMBER : XXXXXXXX SEOUL TUV 142 (mm) MADE IN KOREA Acriche SZAF0B X Material : Paper(SW3B(B)) RoHS 245 (mm) SIZE (mm) a c b 245 220 142 7inch 245 220 80 TYPE Semiconductor EcoLight 220 (mm) Lot Number The lot number is composed of the following characters; SZAF0B ○□□◎◎ ◇◇◇ Symbol Meaning ○ Year □□ Month ◎◎ Day ◇◇◇ Number SSC-QP-7-03-44(갑) Example 8 for 2008, 9 for 2009 ‥‥ 01 for Jan., 02 for Feb., ‥‥ 12 for Dec. 01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31 001, 002, 003, 004, 005, 006, 007 ‥‥ 13 SEOUL SEMICONDUCTOR CO., LTD. Rev. 1.00 SZAF0B 13. History Rev. No. 1.00 Contents - The institution of New Spec. Date 2008.06.03 Published by SEOUL SEMICONDUCTOR CO., LTD. http://www.seoulsemicon.com 148-29, Gasan-Dong, Geumcheon-Gu, Seoul, 153-801. South Korea © All Right Reserved. SSC-QP-7-03-44(갑) 14 SEOUL SEMICONDUCTOR CO., LTD.