High Linearity DP4T Antenna Switch for GSM/UMTS/CDMA CXM3540XR Description The CXM3540XR is a high power and high linearity DP4T antenna switch for GSM/UMTS/CDMA applications. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. The Integrated logic decoder reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital base band control lines with the CMOS logic levels. Sony GaAs JPHEMT MMIC Process is used. (Applications: GSM/UMTS GSM/CDMA dual mode handsets, CDMA handsets, UMTS handsets) Features Low insertion loss: 0.30dB (typ.) @34dBm (Cellular Band) 0.35dB (typ.) @32dBm (PCS Band) High linearity: IIP3 = 70dBm Low voltage operation VDD = 2.5V No DC blocking capacitors Lead-Free and RoHS compliant Package Small package 22-pin XQFN (2.4mm × 3.3mm × 0.35mm) (Typ.) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08653 CXM3540XR Absolute Maximum Ratings Bias voltage VDD 4 V (Ta = 25°C) Control voltage Vctl 4 V (Ta = 25°C) Input power Max. 35.5 dBm (824 to 915MHz, Ta = 25°C) [Duty cycle = 12.5% to 50%] 34 dBm (1710 to 1910MHz, Ta = 25°C) [Duty cycle = 12.5% to 50%] 32 dBm (1920 to 1980MHz, Ta = 25°C) Operating temperature –35 to +85 °C Storage temperature –65 to +150 °C Maximum power dissipation *1 PD 500 mW *1 25mm × 25mm × t: 0.8mm Mounted on standard board (FR-4) -2- CXM3540XR Block Diagram RF5 RF1 F1 F9 F5 RF2 F2 F10 F6 RF3 F3 F11 F7 RF4 F4 RF6 F12 F8 GND RF1 GND RF2 Pin Configuration 11 10 9 8 GND 12 7 GND RF6 13 6 RF3 GND 14 5 GND GND 15 4 RF4 RF5 16 3 GND GND 17 2 GND GND 18 1 CTLD 20 21 22 CTLB CTLC VDD 19 CTLA XQFN-22P PKG (2.4mm × 3.3mm × 0.4mm Max.) Top View -3- CXM3540XR Pin Description Pin No. Symbol Pin No. Symbol 1 CTLD 12 GND 2 GND 13 RF6 3 GND 14 GND 4 RF4 15 GND 5 GND 16 RF5 6 RF3 17 GND 7 GND 18 GND 8 RF2 19 VDD 9 GND 20 CTLA 10 RF1 21 CTLB 11 GND 22 CTLC Truth Table State CTLA CTLB CTLC CTLD 1 L 2 L 3 L 4 H 5 L H L L H H H L L 6 Active path F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 RF5-RF1 ON OFF OFF OFF OFF OFF OFF OFF OFF ON ON ON OFF ON H RF5-RF2 OFF ON OFF OFF OFF OFF OFF OFF ON OFF ON ON OFF ON L RF5-RF3 OFF OFF ON OFF OFF OFF OFF OFF ON ON OFF ON OFF ON H L RF5-RF4 OFF OFF OFF ON OFF OFF OFF OFF ON ON L L L RF6-RF1 OFF OFF OFF OFF ON OFF OFF OFF OFF ON ON ON ON OFF L L L H RF6-RF2 OFF OFF OFF OFF OFF ON OFF OFF ON OFF ON ON ON OFF 7 L H L L RF6-RF3 OFF OFF OFF OFF OFF OFF ON OFF ON ON OFF ON ON OFF 8 H L L L RF6-RF4 OFF OFF OFF OFF OFF OFF OFF ON ON DC Bias Condition (Ta = 25°C) Item Min. Typ. Max. Vctl (H) 1.5 1.8 3.2 Vctl (L) 0 — 0.3 2.5 2.8 3.2 VDD Unit V -4- ON ON OFF OFF ON ON OFF ON OFF CXM3540XR Electrical Characteristics (Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V) Item Insertion loss Isolation VSWR Symbol IL ISO. Path Condition RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 VSWR Typ. Max. *1 0.30 0.45 1575.42MHz 0.30 0.45 *2 0.35 0.50 *3 0.40 0.55 *1 25 38 1575.42MHz 24 36 *2 22 35 *3 21 30 824 to 2170MHz 2fo Harmonics Min. — –60 –36 3fo –45 –36 2fo –60 –36 –45 –36 –95 –75 3fo –90 –75 2fo –95 –75 –90 –75 3fo 2fo *2 RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 *9 *10 3fo dB dB 1.1 *1 Unit dBm dBc P0.2dB compression input power P0.2dB RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 IMD3 RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 *4, *8 IMD3 –110 *5, *8 –110 IIP3 RF5 - RF1, 2, 3, 4 RF6 - RF1, 2, 3, 4 *6, *8 Input IP3 65 70 *7, *8 65 70 Control current Ictl Vctl = 1.8V 0.005 10 μA Supply current Idd VDD = 2.8V 0.15 0.3 mA Switching speed Swt VDD = 2.8V, Vctl = 0V/1.8V 2 5 μs 824 to 930MHz 35.5 1710 to 1980MHz 33.5 dBm Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 *2 *3 *4 *5 *6 *7 *8 *9 *10 Pin = 34dBm, f = 824 to 960MHz Pin = 32dBm, f = 1710 to 1990MHz Pin = 10dBm, f = 2110 to 2170MHz Ptx = 21.5dBm, Pjam = –15dBm, ftx = 835MHz, fjam = 790MHz, fim = 880MHz Ptx = 21.5dBm, Pjam = –15dBm, ftx = 1950MHz, fjam = 1760MHz, fim = 2140MHz Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 × Pout – IM3)/2 + Loss Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 × Pout – IM3)/2 + Loss Measured with recommended circuit Pin = 25dBm, f = 890 to 930MHz Pin = 25dBm, f = 1920 to 1980MHz -5- dBm dBm CXM3540XR 11 GND C2 RF6 10 RF2 GND RF1 GND Recommended Circuit 9 8 12 7 13 6 14 5 GND RF3 L2 GND GND C1 RF5 XQFN-22P PKG (2.4mm × 3.3mm × 0.4mm Max.) Top View 15 4 16 3 17 2 18 1 GND RF4 GND L1 20 CTLA VDD 19 21 22 CTLC GND CTLB GND Note) 1. No DC blocking capacitors are required on all RF ports. 2. DC levels of all RF ports are GND. 3. L1, L2, C1 and C2 are recommended on Ant port for ESD protection. -6- GND CTLD CXM3540XR Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL -7- SPEC. COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm Sony Corporation