WINSEMI STN1A80

STN1A80
Logic Level
Bi-Directional Triode Thyristor
Features
■ Repetitive Peak off-State Voltage: 800V
■ R.M.S On-State Current(IT(RMS)=1A
■ Low on-state voltage: VTM=1.2(typ.)@ ITM
■ Low reverse and forward blocking current:
IDRM=500uA@TC=125℃
■ Low holding current: IH=4mA (typ.)
■ High Commutation dV/dt.
General Description
General purpose switching and phase control applications.
These devices are intended to be interfaced directly to
microcontrollers,logic integrated circuits and other low power
gate trigger circuits such as fan speed and temperature
modulation control, lighting control and static switching relay.
Absolute Maximum Ratings (TJ=25℃ unless otherwise specified)
Symbol
Parameter
VDRM
Peak Repetitive Forward Blocking Voltage(gate open) (Note 1)
T(RMS)
Forward Current RMS (All Conduction Angles, TL=50℃)
ITSM
Peak Forward Surge Current, (full Cycle, Sine Wave, 50/60 Hz)
Circuit Fusing Considerations (tp= 10 ms)
PGM
PG(AV)
Value
Units
800
V
1
A
9.1/10
A
0.41
Peak Gate Power — Forward, (Tc = 58°C,Pulse with≤1.0us)
Average Gate Power — Forward, (Over any 20ms period)
5
W
0.1
W
50
A/μs
Critical rate of rise of on-state current
dI/dt
TJ=125℃
ITM = 1.5A; IG = 200mA; dIG/dt = 200mA/ms
IFGM
Peak Gate Current — Forward, Tj = 125°C (20 μs, 120 PPS)
0.5
A
VRGM
Peak Gate Voltage — Reverse, Tj = 125°C (20 μs, 120 PPS)
6
V
TJ,
Junction Temperature
-40 ~ 125
℃
Tstg
Storage Temperature
-40~150
℃
2
g
mass
Note1: .Although not recommended, off-state voltages up to 800V may be applied without damage, but the TRIAC may
switch to the on-state. The rate of rise of current should not exceed 3A/us.
Thermal Characteristics
Value
Typ
Max
Symbol
Parameter
RQJC
Thermal Resistance, Junction-to-Case
-
-
60
℃/W
RQJA
ThermalResistance,Junction-to-Ambient
-
-
120
℃/W
Min
Units
1 /5
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STN1A80
Electrical Characteristics (TJ = 25°C unless otherwise specified)
Symbol
Characteristics
Peak Forward or Reverse Blocking Current
Min
Typ.
Max
TJ=25℃
-
-
5
TJ=125℃
-
-
500
(Note2)
-
1.2
1.5
-
0.4
5
-
1.3
5
-
1.4
5
-
3.8
7
-
-
1.2
-
-
1.2
-
-
1.2
-
-
1.5
0.2
-
-
10
20
-
1.3
5
-
1.2
5
T2+G-
-
4.0
8
T2-G-
-
1.0
5
-
2.5
8
-
-
420
IDRM
μA
(VD= VDRM/VRRM,gate open)
VTM
Unit
Forward “On” Voltage (ITM = 1.5 A)
V
T2+G+
IGT
Gate Trigger Current (Continuous dc)
T2+G-
(VD = 12 Vdc, RL = 33 Ω)
T2-G-
mA
T2-G+
T2+G+
VGT
Gate Trigger Voltage (Continuous dc)
T2+G-
(VD =12 Vdc, RL = 33 Ω)
T2- G-
V
T2-G+
VGD
Gate threshold voltage(TJ=125℃, VD=VDRM,RL=3.3KΩ)
Critical rate of rise of commutation Voltage
V
-
dV/dt
V/μs
(VD=0.67VDRM,gate open)
IH
Holding Current (VD =12 V, IGT = 100 mA)
mA
T2+G+
IL
latching current (VD = 12 V; IGT = 100 mA)
T2-G+
Rd
Dynamic resistance (TJ=125℃)
mA
mΩ
Note 2. Forward current applied for 1 ms maximum duration, duty cycle
2 /5
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STN1A80
Fig.1 Maximum permissible non-repetitive
Peak on-state current ITSM versus number of
Cycles,for sinusoidal currents,f=50Hz.
Fig.3 Maximum permissible repetitive rms
On-state current IT(RMS),versus surge duration,
For sinusoidal currents,f=50HZ;Tlead≤66℃
Fig.2 Maximum permissible non-repetitive
Peak on-state current ITSM,versus pulse
width tp for sinusoidal currents,tp≤20ms
Fig.4 Maximum permissible rms current
IT(RMS), versus lead temperature Tlead
VT(V)
Fig.5 Typical and maximum on-state
characteristic
IR(RMS) A
Fig.6 Maximum on-state dissipation,Ptot
versus rms on-state current,IT(RMS) where
α=conduction angle.
3 /5
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STN1A80
Fig.7 Normalised gate trigger current IGT(Ti)/
IGT(25℃),versus junction temperature Ti-
Fig.9 Normalised holding current IH(Tj)/IH(25℃)
Versus junction temperature Ti-
Fig.8 Normalised gate trigger voltage VGT(Tj)/
VGT(25℃),versus junction temperature Tj-
Fig.10 Transient thermal impedance Zth
j-lead,versus pulse width tp-
Fig.11 Gate Trigger Characteristics Test Circuit
4 /5
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STN1A80
TO-92 Package Dimension
Unit: mm
X-X
5 /5
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