AMI 0ICAB-001-XTP

AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
1.0 General Description
The AMIS-42671 CAN transceiver with autobaud is the interface between a controller area network (CAN) protocol controller and the
physical bus. It may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and
differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS42671 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission
(EME) is achieved by the excellent matching of the output signals.
The AMIS-42671 is primarily intended for industrial network applications where long network lengths are mandatory. Examples are
elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be low.
AMIS-42671 allows low transmit data rates down 10 Kbit/s or lower. The autobaud function allows the CAN controller to determine the
incoming baud rate without influencing the CAN communication on the bus.
2.0 Key Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Fully compatible with the ISO 11898-2 standard
Autobaud function
Wide range of bus communication speed (0 up to 1 Mbit/s)
Allows low transmit data rate in networks exceeding 1 km
Ideally suited for 12V and 24V industrial and automotive applications
Low electromagnetic emission (EME) common-mode choke is no longer required
Differential receiver with wide common-mode range (+/- 35V) for high EMS
No disturbance of the bus lines with an un-powered node
Thermal protection
Bus pins protected against transients
Silent mode in which the transmitter is disabled
Short circuit proof to supply voltage and ground
Logic level inputs compatible with 3.3V devices
ESD protection for CAN bus at ± 8 kV
3.0 Technical Characteristics
Table 1: Technical Characteristics
Symbol
Parameter
VCANH
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
Vi(dif)(bus_dom)
Differential bus output voltage in dominant state
tpd(rec-dom)
Propagation delay TxD to RxD
tpd(dom-rec)
Propagation delay TxD to RxD
CM-range
Input common-mode range for comparator
VCM-peak
VCM-step
Common-mode peak
Common-mode step
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
42.5Ω < RLT < 60Ω
See Figure 8
See Figure 8
Guaranteed differential receiver threshold and
leakage current
See Figure 9 and Figure 10 (Notes)
See Figure 9 and Figure 10 (Notes)
Min.
-45
-45
1.5
70
100
-35
Max.
+45
+45
3
245
245
+35
Unit
V
V
V
ns
ns
V
-500
-150
500
150
mV
mV
Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.
4.0 Ordering Information
Ordering Code (Tubes)
0ICAB-001-XTD
Ordering Code (Tape)
0ICAB-001-XTP
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
Marketing Name
AMIS 42671AGA
1
Package
SOIC-8 GREEN
Temp. Range
-40°C…125°C
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
5.0 Block Diagram
VCC
AUTB
8
3
Thermal
shutdown
VCC
TxD
Slope
Control
1
7
Driver
control
6
Autobaud
Control
RxD
4
CANH
CANL
AMIS-42671
COMP
Ri(cm)
Vcc/2
+
VREF
5
Ri(cm)
2
GND
PC20070930.2
Figure 1: Block Diagram
6.0 Typical Application
6.1 Application Schematic
VBAT
IN
5V-reg
60 Ω
OUT
VCC
CAN
controller
47 nF
VCC
AUTB
RxD
TxD
3
8
4
7
AMIS42671
5
6
1
GND
PC20071001.1
Figure 2: Application Diagram
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Specifications subject to change without notice
2
CANH
VREF
CAN
BUS
CANL
60 Ω
2
AMI Semiconductor – Oct. 07, Rev. 1.0
60 Ω
GND
60 Ω
47 nF
AMIS-42671 High-Speed CAN Transceiver
For Long Networks
6.2 Pin Description
6.2.1. Pin Out (Top View)
1
GND
2
VCC
3
RxD
4
AMIS42671
TxD
8
AUTB
7
CANH
6
CANL
5
VREF
PC20070929.1
Figure 3: Pin Configuration
6.3 Pin Description
Table 2: Pin Out
Pin
Name
1
TxD
2
GND
3
VCC
4
RxD
5
VREF
6
CANL
7
CANH
8
AUTB
Description
Transmit data input; low input → dominant driver; internal pull-up current
Ground
Supply voltage
Receive data output; dominant transmitter→ low output
Reference voltage output
Low-level CAN bus line (low in dominant mode)
High-level CAN bus line (high in dominant mode)
Autobaud mode control input; internal pull-down current
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
3
Data Sheet
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
7.0 Functional Description
7.1 Operating Modes
The behavior of AMIS-42671 under various conditions is illustrated in Table 3 below. In case the device is powered, one of two
operating modes can be selected through pin AUTB.
Table 3: Functional table of AMIS-42671 when not connected to the bus; X = don’t care
VCC
pin TxD
pin AUTB
pin CANH
pin CANL
Bus state
pin RxD
4.75 to 5.25.V
4.75 to 5.25.V
4.75 to 5.25.V
VCC<PORL (unpowered)
PORL<VCC<4.75V
0
X
1 (or floating)
X
>2V
0 (or floating)
1
X
X
X
High
VCC/2
VCC/2
0V<CANH<VCC
0V<CANH<VCC
Low
VCC/2
VCC/2
0V<CANL<VCC
0V<CANL<VCC
Dominant
Recessive
Recessive
Recessive
Recessive
0
1
1
1
1
7.1.1. High-Speed Mode
If pin AUTB is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The
signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized
to give extremely low electromagnetic emissions.
7.1.2. Autobaud Mode
If pin AUTB is pulled high, AMIS-42671 is in Autobaud mode. The transmitter is disabled while the receiver remains active. All other IC
functions also continue to operate. Normal bus activity can be monitored at the RxD pin and transmit data on TxD is looped back to
RxD without influencing the CAN communication.
TxD
CANH
CANL
RxD
AUTB
PC20071002.4
Figure 4: Simplified Schematic Diagram of Autobaud Function
In Autobaud mode the local CAN controller is able to detect the used communication speed of other transmitting network nodes. Bus
communication is received and via the RxD pin sent to the CAN controller. If the CAN controller operates at the wrong baud rate, it will
transmit an error frame. This message will be looped back to the CAN controller which will increment its error counter. The CAN
controller will be reset with another baud rate. When an error-free message is received, the correct baud rate is detected. A logic low
may now be applied to pin AUTB, returning to the High-Speed Mode.
7.2 Over-temperature Detection
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of
approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is
reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection
circuit is particularly necessary when a bus line short-circuits.
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
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AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
7.3 High Communication Speed Range
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.
But also high speed communication is possible up to 1Mbit/s.
7.4 Fail-safe Features
A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or
negative supply voltage, although power dissipation increases during this fault condition.
The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 5). Pin TxD is
pulled high internally should the input become disconnected.
8.0 Electrical Characteristics
8.1 Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;
sourcing current means the current is flowing out of the pin.
8.2 Absolute Maximum Ratings
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Parameter
VCC
Supply voltage
VCANH
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
VTxD
DC voltage at pin TxD
VRxD
DC voltage at pin RxD
VAUTB
DC voltage at pin AUTB
VREF
DC voltage at pin VREF
Vtran(CANH)
Transient voltage at pin CANH
Vtran(CANL)
Transient voltage at pin CANL
Vesd
Electrostatic discharge voltage at all pins
Latch-up
Tstg
Tamb
Tjunc
Static latch-up at all pins
Storage temperature
Ambient temperature
Maximum junction temperature
Notes:
1.
2.
3.
4.
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
Note 1
Note 1
Note 2
Note 4
Note 3
Min.
-0.3
-45
-45
-0.3
-0.3
-0.3
-0.3
-150
-150
-4
-500
-55
-40
-40
Max.
+7
+45
+45
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
+150
+150
+4
+500
100
+155
+125
+150
Unit
V
V
V
V
V
V
V
V
V
kV
V
mA
°C
°C
°C
Value
150
45
Unit
K/W
K/W
Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).
Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.
Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.
Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
8.3 Thermal Characteristics
Table 5: Thermal Characteristics
Symbol
Parameter
Rth(vj-a)
Thermal resistance from junction to ambient in SO8 package
Rth(vj-s)
Thermal resistance from junction to substrate of bare die
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
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Conditions
In free air
In free air
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
8.4 DC and Timing Characteristics
VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise.
Table 6: DC and Timing Characteristics
Symbol
Parameter
Supply (Pin VCC)
ICC
Supply current
Transmitter Data Input (Pin TxD)
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
IIL
Low-level input current
Ci
Input capacitance
Mode Select (Pin AUTB)
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
IIL
Low-level input current
Receiver Data Output (Pin RxD)
VOH
High-level output voltage
VOL
Low-level output voltage
Reference Voltage Output (Pin VREF)
VREF
Reference output voltage
VREF_CM
Reference output voltage for full common
mode range
Bus Lines (Pins CANH and CANL)
Vo(reces)(CANH)
Recessive bus voltage at pin CANH
Vo(reces)(CANL)
Recessive bus voltage at pin CANL
Io(reces) (CANH)
Recessive output current at pin CANH
Io(reces) (CANL)
Recessive output current at pin CANL
Vo(dom) (CANH)
Vo(dom) (CANL)
Vi(dif) (bus)
Dominant output voltage at pin CANH
Dominant output voltage at pin CANL
Differential bus input voltage
(VCANH - VCANL)
Io(sc) (CANH)
Io(sc) (CANL)
Vi(dif)(th)
Short circuit output current at pin CANH
Short circuit output current at pin CANL
Differential receiver threshold voltage
Vihcm(dif) (th)
Differential receiver threshold voltage for
high common-mode
Vi(dif) (hys)
Differential receiver input voltage hysteresis
Ri(cm)(CANH)
Common-mode input resistance at pin
CANH
Common-mode input resistance at pin
CANL
Matching between pin CANH and pin CANL
common-mode input resistance
Differential input resistance
Matching between pin CANH and pin CANL
common-mode input resistance
Differential input resistance
Ri(cm) (CANL)
Ri(cm)(m)
Ri(dif)
Ri(cm)(m)
Ri(dif)
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Specifications subject to change without notice
Conditions
Min.
Typ.
Max.
Unit
25
2
45
4
65
8
mA
mA
Output recessive
Output dominant
VTxD = VCC
VTxD = 0V
Not tested
2.0
-0.3
-1
-75
-
0
-200
5
VCC+0.3
+0.8
+1
-350
10
V
V
µA
µA
pF
Autobaud mode
High-speed mode
VS =2V
VS =0.8V
2.0
-0.3
20
15
30
30
VCC+0.3
+0.8
50
45
V
V
µA
µA
0.6 x VCC
0.75 x
VCC
0.25
Dominant; VTXD = 0V
Recessive; VTXD = VCC
IRXD = - 10mA
IRXD = 6mA
V
0.45
V
0.50 x
VCC
0.50 x
VCC
0.55 x VCC
V
0.60 x VCC
V
2.0
2.0
-2.5
2.5
2.5
-
3.0
3.0
+2.5
V
V
mA
-2.5
-
+2.5
mA
3.0
0. 5
1.5
3.6
1.4
2.25
4.25
1.75
3.0
V
V
V
-120
0
+50
mV
-45
45
0.5
-70
70
0.7
-95
120
0.9
mA
mA
V
0.25
0.7
1.05
V
50
70
100
mV
15
25
37
KΩ
15
25
37
KΩ
VCANH =VCANL
-3
0
+3
%
VCANH =VCANL
25
-3
50
0
75
+3
KΩ
%
25
50
75
KΩ
-50µA < IVREF < +50µA
0.45 x VCC
-35V <VCANH< +35V;
-35V <VCANL< +35V
0.40 x VCC
VTxD = VCC; no load
VTxD = VCC; no load
-35V <VCANH< +35V;
0V <VCC < 5.25V
-35V <VCANL < +35V;
0V <VCC < 5.25V
VTxD = 0V
VTxD = 0V
VTxD = 0V; dominant;
42.5 Ω < RLT < 60 Ω
VTxD =VCC; recessive;
No load
VCANH = 0V; VTxD = 0V
VCANL = 36V; VTxD = 0V
-5V <VCANL < +10V;
-5V <VCANH < +10V;
See Figure 6
-35V <VCANL < +35V;
-35V <VCANH < +35V;
See Figure 6
-5V <VCANL < +10V;
-5V <VCANH < +10V;
See Figure 6
6
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
Table 7: DC and Timing Characteristics (continued)
Symbol
Parameter
Ci(CANH)
Input capacitance at pin CANH
Ci(CANL)
Input capacitance at pin CANL
Ci(dif)
Differential input capacitance
ILI(CANH)
Input leakage current at pin CANH
ILI(CANL)
Input leakage current at pin CANL
VCM-peak
Common-mode peak during transition from
dom → rec or rec → dom
VCM-step
Difference in common-mode between
dominant and recessive state
Power-on-Reset (POR)
PORL
POR level
Conditions
VTxD = VCC; not tested
VTxD = VCC; not tested
VTxD = VCC; not tested
VCC = 0V; VCANH = 5V
VCC = 0V; VCANL = 5V
See Figure 9 and Figure 10
Min.
See Figure 9 and Figure 10
-150
CANH, CANL, Vref in tristate below POR level
Thermal Shutdown
Tj(sd)
Shutdown junction temperature
Timing Characteristics (see Figure 7 and Figure 8)
td(TxD-BUSon)
Delay TxD to bus active
td(TxD-BUSoff)
Delay TxD to bus inactive
td(BUSon-RxD)
Delay bus active to RxD
td(BUSoff-RxD)
Delay bus inactive to RxD
tpd(rec-dom)
Propagation delay TxD to RxD from
recessive to dominant
td(dom-rec)
Propagation delay TxD to RxD from
dominant to recessive
Typ.
7.5
7.5
3.75
170
170
10
10
-500
V
150
160
180
°C
40
30
25
65
70
Vs = 0V
100
VCC
7
1 nF
AMIS42671
RxD
CANH
1
5
Transient
Generator
1 nF
4
6
2
8
20 pF
VREF
AUTB
CANL
PC20071002.1
GND
Figure 5: Test Circuit for Transients
VRxD
High
Low
Hysteresis
PC20040829.7
0,9
0,5
Figure 6: Hysteresis of the Receiver
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
7
mV
4.7
+5 V
TxD
150
3.5
Vs = 0V
Vs = 0V
Vs = 0V
Vs = 0V
Vs = 0V
3
Unit
pF
pF
pF
µA
µA
mV
2.2
8.5 Measurement Set-ups and Definitions
100 nF
Max.
20
20
10
250
250
500
Vi(dif)(hys)
85
60
55
100
130
105
105
135
245
ns
ns
ns
ns
ns
245
ns
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
+5 V
100 nF
VCC
3
TxD
7
1
AMIS42671
RxD
4
RLT
VREF
CLT
100 pF
60 Ω
6
CANL
2
8
20 pF
5
CANH
AUTB
GND
PC20071002.3
Figure 7: Test Circuit for Timing Characteristics
HIGH
LOW
TxD
CANH
CANL
dominant
Vi(dif) =
VCANH - VCANL
0,9V
0,5V
recessive
RxD
td(TxD-BUSon)
tpd(rec-dom)
0,7 x VCC
0,3 x VCC
td(TxD-BUSoff)
td(BUSon-RxD)
tpd(dom-rec)
Figure 8: Timing Diagram for AC Characteristics
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Specifications subject to change without notice
8
td(BUSoff-RxD)
PC20040829.6
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
+5 V
100 nF
VCC
3
TxD
7
Active Probe
AMIS42671
CANL
6
6.2 kΩ
4
5
2
8
20 pF
10 nF
1
Generator
RxD
6.2 kΩ
CANH
AUTB
30 Ω
VREF
Spectrum Anayzer
30 Ω
47 nF
GND
PC20071002.2
Figure 9: Basic Test Set-up for Electromagnetic Measurement
CANH
CANL
recessive
Vi(com) =
VCANH + VCANL
VCM-step
VCM-peak
VCM-peak
PC20040829.7
Figure 10: Common-mode Voltage Peaks (see measurement set-up Figure 9)
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AMIS-42671 High-Speed CAN Transceiver
For Long Networks
9.0 Package Outline
SOIC-8: Plastic small outline; eight leads; body width 150mil
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Data Sheet
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
10.0 Soldering
10.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount
ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,
soldering and cooling) vary between 100 and 200 seconds, depending on heating method.
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept
below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high
component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used, the following conditions must be observed for optimal results:
• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the
printed-circuit board.
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to ten seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C.
Table 8: Soldering
Soldering Method
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes:
1.
2.
3.
4.
5.
Reflow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
11
AMIS-42671 High-Speed CAN Transceiver
Data Sheet
For Long Networks
11.0 Company or Product Inquiries
For more information about AMI Semiconductor’s high-speed Industrial CAN transceivers, visit our Web site at: http://www.amis.com
12.0 Document History
Date
October 2007
Revision
1.0
Change
Initial release
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not
recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.
AMI Semiconductor – Oct. 07, Rev. 1.0
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Specifications subject to change without notice
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