ASMT-Rx45-xxxxx 0.45mm Leadframe-Based Surface Mount ChipLED Data Sheet Description Features Avago Technologies’ ultra-thin ASMT-Rx45 ChipLEDs were developed based on the industrial standard ChipLED 0603 platform which requires less board space. These ChipLEDs provide a wide viewing angle of 130 degrees to improve visibility in bright sunlight. • Industrial 0603 platform – 1.6 x 0.8 x 0.45mm In addition to the high-brightness and compact size, Avago’s ASMT-Rx45 ChipLEDs provide two significant advantages in the production environment: They can be easily soldered using IR solder reflow process, and the package is qualified to a Joint Electronic Device Engineering Council (JEDEC) moisture sensitive level (MSL) rating of 2a. For manufacturers, this rating means that these ChipLEDs can be kept in the open air (30 degrees C, 60 percent relative humidity) for up to four weeks after being removed from its sealed package without the need to remove absorbed moisture. • Robust Operating Temperature from - 40 to +100 °C Avago’s ultra-thin Leadframe ChipLED available in Red, Orange, Yellow Green and Amber colors, the ASMT-Rx45 series is ideal for use by lighting designers developing backlighting for dashboards and entertainment consoles in automobiles, backlighting of industrial switches and buttons, and small pixel indoor signs. • Automotive qualified • Super wide 130 deg viewing angle • JEDEC MSL 2a. • Junction Temperature Tj = 110 °C • RoHS & IR Reflow compatible Applications 1. Interior Automotive • Navigation backlighting • Audio panel backlighting • Push Button backlighting 2. Office Automation, home appliances and industrial equipment • Front panel backlighting • Push Button backlighting • LCD backlighting • Switches backlighting • Navigation backlighting CAUTION: ASMT-Rx45 LEDs are Class 1C ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions 0.45 Cathode Side 0.4 1.1 1.6 LED Die Lead Frame 0.6 0.8 Resin Device Selection Guide Package Dimension (mm) Die Technology Colors Parts per Reel Package Description 1.6 (L) x 0.8 (W) x 0.45 (H) AlInGaP Red 4000 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.45 (H) AlInGaP Orange 4000 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.45 (H) AlInGaP Yellow Green 4000 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.45 (H) AlInGaP Amber 4000 Untinted, Diffused Part Numbering System A S M T - R X1 45 - X2 X3 X4 X5 X6 Packaging Option Color Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color Absolute Maximum Ratings at TA = 25°C Parameter ASMT-Rx45 Units DC Forward Current [1] 20 mA Power Dissipation 48 mW Reverse Voltage (IR = 100mA) 5 V LED Junction Temperature 110 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Applies when single LED is lit up. Electrical Characteristics at TA = 25°C Forward Voltage, VF (Volts) [1] @ IF =20mA Reverse Breakdown VR (Volts) @ IR = 100mA Thermal Resistance RqJ-PIN (°C/W) Part Number Min Typ Max Min Typical ASMT-RR45 1.6 2.0 2.4 5 246 ASMT-RJ45 1.6 2.0 2.4 5 246 ASMT-RF45 1.6 2.0 2.4 5 246 ASMT-RA45 1.6 2.0 2.4 5 246 Notes: 1. VF Tolerance: ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Part Number Color ASMT-RR45 Peak Wavelength lpeak (nm) Dominant Wavelength ld [2] (nm) Viewing Angle 2q1/2 [3] (Degrees) Min. Typ. Typical Typical Typical Red 50 120 636 622 145 ASMT-RJ45 Orange 50 130 612 605 145 ASMT-RF45 Yellow Green 36 60 574 573 145 ASMT-RA45 Amber 40 90 593 591 145 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Individual reel will contain parts from one half bin only X3 Min IV Bin X4 Intensity (mcd) Bin ID Min. Max. A1 0.11 0.14 A2 0.14 0.18 0 Full Distribution B1 0.18 0.23 2 2 half bins starting from X31 B2 0.23 0.29 3 3 half bins starting from X31 C1 0.29 0.36 4 4 half bins starting from X31 C2 0.36 0.45 5 5 half bins starting from X31 D1 0.45 0.57 6 2 half bins starting from X32 D2 0.57 0.72 7 3 half bins starting from X32 E1 0.72 0.90 8 4 half bins starting from X32 E2 0.90 1.10 9 5 half bins starting from X32 F1 1.10 1.41 F2 1.41 1.80 G1 1.80 2.24 G2 2.24 2.80 H1 2.80 3.55 H2 3.55 4.50 J1 4.50 5.70 J2 5.70 7.20 K1 7.20 9.00 K2 9.00 11.20 L1 11.20 14.20 L2 14.20 18.00 M1 18.00 22.50 M2 22.50 28.00 N1 28.00 36.00 N2 36.00 45.00 P1 45.00 57.00 P2 57.00 71.50 Q1 71.50 90.00 Q2 90.00 113.00 R1 113.00 142.00 R2 142.00 180.00 S1 180.00 227.00 S2 227.00 285.00 Tolerance: ±15% Color Bin Select (X5) Color Bin Limits Individual reel will contain parts from one full bin only. Yellow Green Color Bin Dominant Wavelength (nm) X5 0 Full Distribution Min. Max. 564.5 567.5 Z A and B only E Y B and C only F 567.5 570.5 W C and D only G 570.5 573.5 V D and E only H 573.5 576.5 U E and F only T F and G only S G and H only Q A, B and C only P B, C and D only N C, D and E only M D, E and F only L E, F and G only K F, G and H only J Special Color Bin 1 A, B, C and D only 2 E, F, G and H only 3 B, C, D and E only Bin ID Min Max 4 C, D, E and F only A 597.0 600.0 5 A, B, C, D and E only B 600.0 603.0 6 B, C, D, E, and F only C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 Yellow/Amber Color Bin Dominant Wavelength (nm) Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Dominant Wavelength (nm) Option Test Current Package Type Reel Size 2 20 mA Top Mount 7 Inch H 2 mA Top Mount 7 Inch K 5 mA Top Mount 7 Inch Red Color Bin Dominant Wavelength (nm) Bin ID Min. Max. Full Distribution 620.0 635.0 Tolerance: ±1nm Forward Voltage (VF) Bin Limits Forward Voltage (V) Bin ID Minimum Maximum 1 1.60 1.80 2 1.80 2.00 3 2.00 2.20 4 2.20 2.40 Tolerance: ±0.1V Bin ID Orange Color Bin Packaging Option (X6) Bin ID 0.9 RELATIVE INTENSITY 0.8 RED YELLOW GREEN 0.7 100 ORANGE AMBER IF - FORWARD CURRENT - mA 1 0.6 0.5 0.4 0.3 0.2 AMBER/ ORANGE YELLOW GREEN RED 10 0.1 0 380 430 480 530 580 630 680 730 1 0.00 780 WAVELENGTH-nm 2.00 2.50 3.00 1.20 1.00 0.80 0.60 0.40 0.20 0 5 10 15 20 25 30 IF - FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. 20 15 10 5 0 0 20 40 60 80 100 AMBIENT TEMPERATURE - °C Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110°C, RqJA = 465°C/W 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Radiation pattern. Figure 6. Recommended soldering land pattern. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. 3.50 25 MAX. FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 1.50 Figure 2. Forward current vs. forward voltage. 1.40 RELATIVE INTENSITY 1.00 V F - FORWARD VOLTAGE - V Figure 1. Relative intensity vs. wavelength. 0.00 0.50 120 10 to 30 SEC. o 240 oC/ MAX. 3 oC/SEC. MAX. 100-150 oC TEMPERATURE TEMPERATURE 20 SEC. MAX. 183 oC -6 oC/SEC. MAX. 3 oC/SEC. MAX. 120 SEC. MAX. o 217 C 200 oC 255 - 260 C 3 oC/SEC. MAX. 6 oC/SEC. MAX. 150 oC 3 oC/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 60-150 SEC. TIME TIME (Acc. to J-STD-020C) Figure 7b. Recommended Pb-free reflow soldering profile. Figure 7a. Recommended reflow soldering profile. Notes: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 4.00 DIM. C [0.157] [SEE TABLE 1] 1.50 0.254 +/- 0.02 [0.059] 4.00 [0.01 +/- 0.001] [0.157] 1.75 [0.069] 3.50 +/- 0.05 [0.14 +/- 0.002] DIM. A 8.00 +/- 0.30 [0.315 +/- 0.012] [SEE TABLE] CARRIER TAPE Diam. 0.60 +/- 0.05 DIM. B USER FEED DIRECTION [SEE TABLE] Figure 8. Tape Dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling Orientation. COVER TAPE This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0378EN - August 29, 2007