HI-SINCERITY Spec. No. : HE200501 Issued Date : 2005.06.01 Revised Date : 2006.07.04 Page No. : 1/5 MICROELECTRONICS CORP. HMJE13007A NPN EPITAXIAL PLANAR TRANSISTOR Description • High Voltage, High Speed Power Switch • Switch Regulators • PWM Inverters and Motor Controls • Solenoid and Relay Drivers • Deflection Circuits TO-220 Absolute Maximum Ratings (TA=25°C) • Maximum Temperatures Storage Temperature ........................................................................................................................... -50 ~ +150 °C Junction Temperature ..................................................................................................................... 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (TC=25°C) .................................................................................................................... 80 W • Maximum Voltages and Currents (TA=25°C) VCBO Collector to Emitter Voltage ...................................................................................................................... 700 V VCEO Collector to Emitter Voltage ...................................................................................................................... 400 V VEBO Emitter to Base Voltage ................................................................................................................................ 9 V IC Collector Current ........................................................................................................................... Continuous 8 A IB Base Current .................................................................................................................................. Continuous 4 A Electrical Characteristics (TA=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 700 - - V IC=1mA, VBE(off)=1.5V BVCEO 400 - - V IC=10mA IEBO - - 100 uA VEB=9V ICEX - - 100 uA VCE=700V, VBE(off)=1.5V *VCE(sat)1 - - 1 V IC=2A, IB=0.4A *VCE(sat)2 - - 2 V IC=5A, IB=1A *VCE(sat)3 - - 3 V IC=8A, IB=2A *VBE(sat) - - 1.2 V IC=2A, IB=0.4A *VBE(sat) - - 1.6 V IC=5A, IB=1A *hFE1 15 - - *hFE2 15 - 25 IC=2A, VCE=5V *hFE3 13 - - IC=4A, VCE=5V IC=0.5A, VCE=5V *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HMJE13007A HSMC Product Specification HI-SINCERITY Spec. No. : HE200501 Issued Date : 2005.06.01 Revised Date : 2006.07.04 Page No. : 2/5 MICROELECTRONICS CORP. Characteristics Curve Saturation Voltage & Collector Current Current Gain & Collector Current 100 10000 VCE(sat) @ IB=5IB o 75 C o Saturation Voltage (mV) 125 C hFE o 25 C 10 hFE @ VCE=5V 1 1000 o 75 C o 125 C o 25 C 100 10 1 10 100 1000 10000 1 10 Collector Current-IC (mA) 1000 10000 Saturation Voltage & Collector Current Saturation Voltage & Collector Current 10000 10000 VCE(s at) @ IC=4IB VBE(sat) @ IC=5IB Saturation Voltage (mV) Saturation Voltage (mV) 100 Collector Current-IC (mA) 1000 o 125 C o 25 C 100 o o 75 C 1000 o 25 C o 125 C 75 C 100 10 1 10 100 1000 1 10000 Collector Current-IC (mA) 10 100 1000 10000 Collector Current-IC (mA) Switchange Time & Collector Current Collector Output Capacitance 10 1000 Tstg Capacitance (pF) Switching Time (uS)... VCC=125V, IC=5IB1, IC=2IB2 1 Ton 100 Cob 10 Tf 0.1 1 0.1 1 Collector Current-IC (A) HMJE13007A 10 0.1 1 10 100 Collector Base Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE200501 Issued Date : 2005.06.01 Revised Date : 2006.07.04 Page No. : 3/5 Safe Operating Area Collector Current-IC (mA) 10000 1000 1mS 100mS 100 1S 10 1 1 10 100 1000 Forward Voltage-V CE (V) HMJE13007A HSMC Product Specification HI-SINCERITY Spec. No. : HE200501 Issued Date : 2005.06.01 Revised Date : 2006.07.04 Page No. : 4/5 MICROELECTRONICS CORP. TO-220AB Dimension DIM A B C D E F G H I J K L M N O P Marking: A F B Pb Free Mark Pb-Free: " . " (Note) Normal: None H E MJ E 13007A C D Date Code H M I K 3 G N 2 1 Tab O P Control Code Note: Green label is used for pb-free packing Pin Style: 1.Base 2.Collector 3.Emitter Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 J L Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package HSMC Package Code: E Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMJE13007A HSMC Product Specification HI-SINCERITY Spec. No. : HE200501 Issued Date : 2005.06.01 Revised Date : 2006.07.04 Page No. : 5/5 MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) 60~150 sec 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time Pb devices. 245 C ±5 C 10sec ±1sec Pb-Free devices. 260 C ±5 C 10sec ±1sec Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature o 60~150 sec 240 C +0/-5 C Peak Temperature (TP) o 3. Flow (wave) soldering (solder dipping) Products HMJE13007A o o o o HSMC Product Specification