PANASONICBATTERY DB3X207K

DB3X207K
Silicon epitaxial planar type
Unit: mm
For high frequency amplification
 Features
 Low forward voltage VF
 Forward current (Average) IF(AV) = 1 A rectification is possible
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)

Marking Symbol: 3F
 Packaging
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
 Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
VR
20
V
Repetitive peak reverse voltage
VRRM
20
V
Forward current (Average) *1
IF(AV)
1
A
Non-repetitive peak forward surge current *2
IFSM
3
A
Junction temperature
Tj
125
°C
Storage temperature
Tstg
–55 to +125
°C
Reverse voltage
1: Anode
2: N.C.
3: Cathode
Panasonic
JEITA
Code
Mini3-G3-B
SC-59A
TO-236AA/SOT-23
3
Note) *1: Mounted on an alumina PC board
*2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
1
2
 Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Forward voltage
VF
IF = 1.0 A
0.4
V
Reverse current
IR
VR = 6 V
1.5
mA
Terminal capacitance
Ct
VR = 10 V, f = 1 MHz
43
pF
Reverse recovery time *1
trr
IF = IR = 100 mA, Irr = 10 mA, RL = 100 Ω
12
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage
of current from the operating equipment.
3. Absolute frequency of input and output is 400 MHz
*1: trr measurement circuit
Input Pulse
Bias Application Unit (N-50BU)
tp
tr
10%
A
Pulse Generator
(PG-10N)
Rs = 50 Ω
Publication date: January 2013
VR
Ver. BED
t
IF
trr
90%
tp = 2 µs
tr = 0.35 ns
δ = 0.05
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
Output Pulse
IF = 100 mA
IR = 100 mA
RL = 100 Ω
t
Irr = 10 mA
1
DB3X207K
DB3X207_ IR-VR
DB3X207_ IF-VF
1
10−1
Reverse current IR (A)
Forward current IF (A)
10−5
85°C
10−3
25°C
10−7
−30°C
0.1
0.2
−30°C
10−6
10−4
0
25°C
10−4
100°C
10−2
0.3
0.4
10−8
0.5
0
4
Forward voltage VF (V)
tp / T
(2)
(3)
10
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
(50 mm × 50 mm × 0.8 mm)
Solder in : 2 mm × 2 mm
10
Time t (s)
103
Forward current (Average) IF(AV) (A)
Thermal resistance Rth (°C/W)
100
50
0
20
0
5
IF
DC
1.00
tp
T
Sine Wave
0.50
1/4
0.25
0
0
25
50
75 100 125 150 175
Lead temperature Tl (°C)
Ver. BED
15
20
PF(AV)  IF(AV)
VR = 10 V
Tj = 125°C
0.75 1/2
10
Reverse voltage VR (V)
DB3X207K_ PF(AV)-IF(AV)
1.25
(1)
10−1
16
150
IF(AV)  Tl
102
1
10−3
12
200
DB3X207K_ IF(AV)-Tl
Rth  t
Rth(j-l) = 70°C/W
8
250
Reverse voltage VR (V)
DB3X207K_Rth-t
103
Ta = 25°C
85°C
10−3
10−1
10−5
Ta = 100°C
10−2
Ta = 125°C
Ct  VR
300
Forward power dissipation (Average) PF(AV) (A)
10
DB3X207_Ct-VR
IR  VR
Terminal capacitance Ct (pF)
IF  VF
0.5
IF
0.4
tp
T
DC
0.3
Sine Wave 1/2
1/4
0.2
0.1
0
0
0.25
0.50
0.75
1.00
1.25
Forward current (Average) IF(AV) (Α)
2
DB3X207K
Mini3-G3-B
Unit: mm
 Land Pattern (Reference) (Unit: mm)
Ver. BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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