AOSMD AO4752

AO4752
30V N-Channel AlphaMOS
General Description
Product Summary
• Latest Trench Power AlphaMOS (αMOS LV) technology
• Integrated Schottky Diode (SRFET)
• Very Low RDS(on) at 4.5VGS
• Low Gate Charge
• High Current Capability
• RoHS and Halogen-Free Compliant
Application
• DC/DC Converters in Computing, Servers, and POL
• Isolated DC/DC Converters in Telecom and Industrial
VDS
30V
15A
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
< 8.8mΩ
RDS(ON) (at VGS=4.5V)
< 15.5mΩ
100% UIS Tested
100% Rg Tested
SOIC-8
Top View
D
D
D
Bottom View
SRFETTM
Soft Recovery MOSFET:
Integrated Schottky Diode
D
D
G
G
S
S
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
C
Units
V
±20
V
15
ID
TA=70°C
Maximum
30
12
A
IDM
102
Avalanche Current C
IAS
22
A
Avalanche energy L=0.05mH C
EAS
12
mJ
VDS Spike
VSPIKE
36
V
Pulsed Drain Current
Power Dissipation B
100ns
TA=25°C
PD
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 0: April 2012
3.1
TJ, TSTG
Symbol
t ≤ 10s
Steady-State
Steady-State
W
2
RθJA
RθJL
-55 to 150
Typ
31
59
16
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°C
Max
40
75
24
Units
°C/W
°C/W
°C/W
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AO4752
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=10mA, VGS=0V
Gate-Body leakage current
VDS=0V, VGS=±20V
Gate Threshold Voltage
VDS=VGS, ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
100
1.5
VGS=10V, ID=15A
TJ=125°C
VGS=4.5V, ID=10A
gFS
Forward Transconductance
VDS=5V, ID=15A
VSD
Diode Forward Voltage
IS=0.2A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
tD(on)
VGS=10V, VDS=15V, ID=15A
1
Units
V
0.5
TJ=55°C
VGS(th)
Max
30
VDS=30V, VGS=0V
IGSS
Coss
Typ
2
±100
nA
2.5
V
7.2
8.8
10.2
12.5
12.3
15.5
71
0.45
mA
mΩ
mΩ
S
0.65
V
4
A
605
pF
275
pF
36.5
pF
2
3
Ω
11
15
nC
5.5
8
nC
2
nC
Gate Drain Charge
2.6
nC
Turn-On DelayTime
5
ns
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
2.5
ns
17
ns
tf
Turn-Off Fall Time
3
ns
trr
Body Diode Reverse Recovery Time
Qrr
IF=15A, dI/dt=500A/µs
11.5
Body Diode Reverse Recovery Charge IF=15A, dI/dt=500A/µs
12.5
ns
nC
VGS=10V, VDS=15V, RL=1Ω,
RGEN=3Ω
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 0: April 2012
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Page 2 of 6
AO4752
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
80
80
10V
7V
VDS=5V
5V
4.5V
60
4V
40
ID(A)
ID (A)
60
40
125°C
20
20
3.5V
25°C
VGS=3V
0
0
0
1
2
3
4
0
5
18
2
3
4
5
6
1.6
Normalized On-Resistance
16
VGS=4.5V
14
RDS(ON) (mΩ
Ω)
1
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
12
10
8
6
VGS=10V
4
2
VGS=10V
ID=15A
1.4
1.2
VGS=4.5V
ID=10A
1
0.8
0
0
5
0
10
15
20
25
30
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
25
1.0E+01
ID=15A
1.0E+00
20
125°C
40
IS (A)
RDS(ON) (mΩ
Ω)
1.0E-01
125°C
15
1.0E-02
25°C
10
1.0E-03
5
25°C
1.0E-04
1.0E-05
0
2
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev 0: April 2012
4
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0.0
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO4752
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
1800
1400
Capacitance (pF)
VGS (Volts)
1600
VDS=15V
ID=15A
8
6
4
Ciss
1200
1000
800
600
Coss
400
2
200
0
Crss
0
0
5
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
15
0
5
10
15
20
VDS (Volts)
Figure 8: Capacitance Characteristics
25
1ms
1000.0
TA=25°C
100.0
TA=100°C
10.0
ID (Amps)
IAR (A) Peak Avalanche Current
100.0
TA=150°C
10.0
1ms
1.0
TJ(Max)=150°C
TA=25°C
0.1
TA=125°C
10µs
100µs
RDS(ON)
limited
10s
DC
0.0
1.0
1
10
100
0.01
1000
Time in avalanche, tA (µ
µs)
Figure 9: Single Pulse Avalanche capability (Note C)
0.1
1
VDS (Volts)
10
100
Figure 10: Maximum Forward Biased
Safe Operating Area (Note F)
10000
TA=25°C
Power (W)
1000
100
10
1
1E-05
0.001
0.1
10
1000
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)
Rev 0: April 2012
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Page 4 of 6
AO4752
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=75°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
Rev 0: April 2012
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Page 5 of 6
AO4752
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
+ Vdd
DUT
Vgs
VDC
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
E AR = 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds Isd
Vgs
Ig
Rev 0: April 2012
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 6 of 6