TI TCA9509DGKR

TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
www.ti.com
2
LEVEL-TRANSLATING I C/SMBUS BUS REPEATER
Check for Samples: TCA9509
FEATURES
1
•
•
•
•
•
•
•
•
•
•
Two-Channel Bidirectional Buffer
I2C Bus and SMBus Compatible
Operating Supply Voltage Range of
2.7 V to 5.5 V on B side
Operating Voltage Range of 0.9 V to VCCB – 1V
on A Side
Voltage-Level Translation From
0.9 V to (VCCB - 1V) and 2.7 V to 5.5 V
Active-High Repeater-Enable Input
Requires no external pull-up resistors on
lower-voltage port-A
Open-Drain I2C I/O
5.5-V Tolerant I2C and Enable Input Support
Mixed-Mode Signal Operation
Lockup-Free Operation
•
•
•
•
•
•
•
Accommodates Standard Mode and Fast Mode
I2C Devices and Multiple Masters
Supports Arbitration and Clock Stretching
Across Repeater
Powered-Off High-Impedance I2C bus pins
Supports 400-kHz Fast I2C Bus operating
speeds
Available in
– 1.6mm x 1.6mm, 0.4mm height, 0.5mm pitch
QFN pkg
– 3mm x 3mm industry standard MSOP pkg
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
RVH PACKAGE
(TOP VIEW)
VCCA
1
8
VCCB
DGK PACKAGE
(TOP VIEW)
6
7
SCLB
6
SDAB
VCCA
1
8
VCCB
SCLA
2
7
SCLB
SDAA
3
6
SDAB
GND
4
5
EN
TCA9509
3
5
EN
GND
SDAA
2
4
SCLA
DESCRIPTION/ORDERING INFORMATION
This TCA9509 integrated circuit is an I2C bus/SMBus Repeater for use in I2C/SMBus systems. It can also provide
bidirectional voltage-level translation (up-translation/down-translation) between low voltages (down to 0.9 V) and
higher voltages (2.7 V to 5.5 V) in mixed-mode applications. This device enables I2C and similar bus systems to
be extended, without degradation of performance even during level shifting.
The TCA9509 buffers both the serial data (SDA) and the serial clock (SCL) signals on the I2C bus, thus allowing
400-pF bus capacitance on the B-side. This device can also be used to isolate two halves of a bus for voltage
and capacitance.
The TCA9509 has two types of drivers – A-side drivers and B-side drivers. All inputs and B-side I/O’s are
overvoltage tolerant to 5.5V. The A-side I/O’s are overvoltage tolerant to 5.5V when the device is unpowered
(VCCB and/or VCCA=0V).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
www.ti.com
ORDERING INFORMATION
TA
ORDERABLE PART
NUMBERS
PACKAGES (1)
(2)
TOP-SIDE MARKING
–40°C to 85°C
TCA9509RVHR
RVH - QFN
Tape and reel
7K
–40°C to 85°C
TCA9509DGKR
DGK - MSOP
Tape and reel
7KQ
(1)
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The bus port B drivers are compliant with SMBus I/O levels, while the A side uses a current sensing mechanism
to detect the input or output LOW signal which prevents bus lock-up. The A side uses a 1 mA current source for
pull-up and a 200 Ω pull-down driver. This results in a LOW on the A side accommodating smaller voltage
swings. The output pull-down on the A side internal buffer LOW is set for approximately 0.2 V, while the input
threshold of the internal buffer is set about 50 mV lower than that of the output voltage LOW. When the A side
I/O is driven LOW internally, the LOW is not recognized as a LOW by the input. This prevents a lock-up condition
from occurring. The output pull-down on the B side drives a hard LOW and the input level is set at 0.3 of SMBus
or I2C-bus voltage level which enables B side to connect to any other I2C-bus devices or buffer.
The TCA9509 drivers are not enabled unless VCCA is above 0.8 V and VCCB is above 2.5 V. The enable (EN) pin
can also be used to turn the drivers on and off under system control. Caution should be observed to only change
the state of the EN pin when the bus is idle.
an
2
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
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TERMINAL FUNCTIONS
NO.
NAME
DESCRIPTION
1
VCCA
A-side supply voltage (0.9V to VCCB - 1V)
2
SCLA
Serial clock bus, A side.
3
SDAA
Serial data bus, A side.
4
GND
Supply ground
5
EN
6
SDAB
Serial data bus, B side. Connect to VCCB through a pullup resistor.
7
SCLB
Serial clock bus, B side. Connect to VCCB through a pullup resistor.
8
VCCB
B-side and device supply voltage (2.7 V to 5.5 V)
Active-high repeater enable input
Table 1. FUNCTION TABLE
INPUT
EN
FUNCTION
L
Outputs disabled
H
SDAA = SDAB
SCLA = SCLB
Figure 1. FUNCTIONAL BLOCK DIAGRAM
VCCA
VCCB
1
8
VCCA
1 mA
6
3
SDAA
SDAB
VCCA
1 mA
7
2
SCLA
SCLB
5
EN
4
GND
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCB
Supply voltage range
–0.5
6
V
VCCA
Supply voltage range
–0.5
6
V
VI
Enable input voltage range (2)
–0.5
6
V
VI/O
I2C bus voltage range (2)
–0.5
6
V
IIK
Input clamp current
VI < 0
–20
IOK
Output clamp current
VO < 0
–20
Pd
Max power dissipation
Tstg
Storage temperature range
(1)
(2)
–65
mA
100
mW
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL IMPEDANCE
over operating free-air temperature range (unless otherwise noted)
UNIT
Package thermal impedance (1)
θJA
(1)
RVH package
208.99
°C/W
DGK package
222.9
°C/W
MIN
MAX
UNIT
0.9 (1)
VCCB - 1
V
V
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VCCA
Supply voltage, A-side bus
VCCB
Supply voltage, B-side bus
VIH
VIL
High-level input voltage
Low-level input voltage
IOL
Low-level output current
TA
Operating free-air temperature
(1)
4
2.7
5.5
SDAA, SCLA
0.7 × VCCA
VCCA
SDAB, SCLB
0.7 × VCCB
5.5
EN
0.7 × VCCA
5.5
SDAA, SCLA
–0.5
0.3
SDAB, SCLB
–0.5
0.3 × VCCB
EN
–0.5
0.3 × VCCA
V
V
SDAA, SCLA
10
µA
SDAB, SCLB
6
mA
85
°C
–40
Low-level supply voltage
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
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ELECTRICAL CHARACTERISTICS
VCCB = 2.7 V to 5.5 V, VCCA = 0.9 V to (VCCB-1), TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
II = –18 mA
Input clamp voltage
VOL
SDAA, SCLA
IOL = 10 μA,
VILA = VILB = 0 V,
VCCA = 0.9 to 1.2V
SDAA, SCLA
IOL = 20 μA,
VILA = VILB = 0 V,
1.2V < VCCA <= (VCCB - 1V)
Low-level output voltage
VOL – VILc
Low-level input voltage
below low-level output
voltage
SDAA, SCLA
VILc
SDA and SCL low-level
input voltage contention
SDAA, SCLA
VOLB
Low-level output voltage
SDAB, SCLB
ICC
Quiescent supply current for VCCA
ICC
Quiescent supply current for VCCB
SDAB, SCLB
II
Input leakage current
SDAA, SCLA
EN
MIN
TYP
–1.5
0.18
MAX
UNIT
–0.5
V
0.25
V
0.2
0.3
50
mV
–0.5
0.15
0.1
0.2
All port A Static high
0.25
0.45
0.9
All port A Static low
1.25
3
5
All port B Static high
0.5
0.9
1.1
IOL = 6 mA
V
VI = VCCB
±1
VI = 0.2 V
10
VI = VCCA
±1
VI = 0.2 V
10
VI = VCCB
±1
VI = 0.2 V
–10
mA
mA
μA
IOH
High-level output leakage
current
SDAB, SCLB
CIOA
I/O capacitance of A-side
SCLA, SDAA
VI = 0 V
6
6.5
7
pF
CIOB
I/O capacitance of B-side
SCLB, SDAB
VI = 0 V
5.5
6
6.2
pF
MAX
UNIT
SDAA, SCLA
10
V
VO = 3.6 V
10
μA
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted)
MIN
tsu
Setup time, EN high before Start condition
th
Hold time, EN high after Stop condition (1)
(1)
(1)
100
ns
100
ns
EN should change state only when the global bus and the repeater port are in an idle state.
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
www.ti.com
I2C INTERFACE TIMING REQUIREMENTS
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Propagation
delay
tPHL
Propagation
delay
tPLH
trise
Transition time
tfall
Transition time
tPLH2
Propagation
delay 50% of
initial low on
Port A to 1.5 V
on Port B
fMAX
Maximum
switching
frequency
(1)
VCCA
(INPUT)
VCCB
(OUTPUT)
1.9 V
5.0 V
TEST CONDITIONS
MIN
TYP (1) MAX UNIT
123.1
127.2
132.
8
port B to port A
88.1
88.8
89.8
port A to port B
122.6
125.7
131.
7
123.0
124.1
126.
9
40.1
40.9
41.9
57.3
57.5
58.4
14.5
16.4
17.9
18.7
19.4
20.2
176.0
177.3
178.
0
port A to port B
1.9 V
EN High
5.0 V
EN High
port B to port A
port A
port B
port A
port B
port A to port B
1.9 V
5.0 V
EN High
1.9 V
5.0 V
EN High
1.9 V
5.0 V
400
ns
ns
ns
ns
ns
KHz
Typical values were measured with VCCA = VCCB = 2.7 V at TA = 25°C, unless otherwise noted.
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
1.35 kW
DUT
IN
OUT
Input
6
CL
PIN
CL
SCLA, SDAA (A
side)
50 pF
SDAB, SCLB (B
side)
50 pF
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1 MW
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SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
www.ti.com
VCC
Input
50%
50%
0V
Output
70%
30%
70%
30%
tf
VCC
VOL
tr
A.
RT termination resistance should be equal to ZOUT of pulse generators.
B.
CL includes probe and jig capacitance.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate
≥ 1 V/ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
tPLH and tPHL are the same as tpd.
Figure 2. Test Circuit and Voltage Waveforms
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
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APPLICATION INFORMATION
A typical application is shown in Figure 3. In this example, the system master is running on a 1.1-V I2C bus, and
the slave is connected to a 3.3-V bus. Both buses run at 400 kHz. Master devices can be placed on either bus.
The TCA9509 is 5-V tolerant, so it does not require any additional circuitry to translate between 0.9-V to 5.5-V
bus voltages and 2.7-V to 5.5-V bus voltages.
When the B side of the TCA9509 is pulled low by a driver on the I2C bus and the falling edge goes below 0.3
VCCB, it causes the internal driver on the A side to turn on, causing the A side to pull down to about 0.2 V. When
the A side of the TCA9509 falls, first a comparator detects the falling edge and causes the internal driver on the
B side to turn on and pull the B-side pin down to ground. In order to illustrate what would be seen in a typical
application, refer to Figure 4 and Figure 5. If the bus master in Figure 3 were to write to the slave through the
TCA9509, waveforms shown in Figure 4 would be observed on the B bus. This looks like a normal I2C bus
transmission, except that the high level may be as low as 0.9 V, and the turn on and turn off of the acknowledge
signals are slightly delayed.
On the A-side bus of the TCA9509, the clock and data lines would have a positive offset from ground equal to
the VOL of the TCA9509. After the eighth clock pulse, the data line is pulled to the VOL of the master device,
which is very close to ground in this example. At the end of the acknowledge, the level rises only to the low level
set by the driver in the TCA9509 for a short delay, while the B-bus side rises above 0.3 VCCB and then continues
high. It is important to note that any arbitration or clock stretching events require that the low level on the A-bus
side at the input of the TCA9509 (VIL) be at or below 0.15 V to be recognized by the TCA9509 and then
transmitted to the B-bus side.
3.3 V
1.1 V
VCCA
SDA
BUS
MASTER
400 kHz
SCL
1.1 V
10 kW
VCCB
10 kW
SDAA SDAB
SDA
SCLA SCLB
TCA9509
SCL
SLAVE
400 kHz
10 kW
EN
BUS A
BUS B
Figure 3. Typical Application
0.5 V/DIV
9th CLOCK PULSE — ACKNOWLEDGE
SCL
SDA
Figure 4. Bus A (0.9-V to 5.5-V Bus) Waveform
8
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SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
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2 V/DIV
9th CLOCK PULSE — ACKNOWLEDGE
SCL
SDA
VOL OF TCA9509
VOL OF SLAVE
Figure 5. Bus B (2.7-V to 5.5-V Bus) Waveform
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TCA9509
SCPS225B – AUGUST 2011 – REVISED JANUARY 2012
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REVISION HISTORY
Changes from Original (August 2011) to Revision A
Page
•
Corrected VCCA operating voltage lower limit, to 0.9V at multiple instances in document. ................................................... 1
•
Changed Operating Supply Voltage Range value error in FEATURES for B side. Changed from (0.9 V to 5.5 V on B
side) to (2.7 V to 5.5 V on B side). ....................................................................................................................................... 1
•
Changed Operating Voltage Range value error in FEATURES for A side. Changed (2.7 V to VCCB – 1 V on A side)
to (0.9 V to VCCB – 1 V on A side). ........................................................................................................................................ 1
Changes from Revision A (October 2011) to Revision B
•
10
Page
Added DGK package and package information to datasheet. ............................................................................................. 1
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PACKAGE OPTION ADDENDUM
www.ti.com
20-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TCA9509DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
7KQ
TCA9509RVHR
ACTIVE
X2QFN
RVH
8
5000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
7K
CU NIPDAU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.4
1.4
8.0
12.0
Q1
TCA9509DGKR
VSSOP
DGK
8
2500
330.0
12.4
TCA9509RVHR
X2QFN
RVH
8
5000
180.0
8.4
1.8
1.8
0.5
4.0
8.0
Q3
TCA9509RVHR
X2QFN
RVH
8
5000
180.0
9.5
1.73
1.73
0.72
4.0
8.0
Q2
Pack Materials-Page 1
5.3
B0
(mm)
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TCA9509DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
TCA9509RVHR
X2QFN
RVH
8
5000
202.0
201.0
28.0
TCA9509RVHR
X2QFN
RVH
8
5000
180.0
180.0
30.0
Pack Materials-Page 2
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