Information
TAPING SPECIFICATIONS OF 6 PIN
MINI MOLD SEMICONDUCTORS FOR
HIGH FREQUENCY USE
Document No. P11062EJ3V0IF00 (3rd edition)
Date Published March 1998 N CP(K)
©
1994
Printed in Japan
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or of others.
M4A 96. 10
2
CONTENTS
1.
DESCRIPTION..................................................................................................................................
5
2.
SPECIFICATIONS ............................................................................................................................
2.1 TAPE DIMENSIONS...............................................................................................................
2.2 REEL DIMENSIONS AND MARKING..................................................................................
2.3 TAPING INFORMATION ........................................................................................................
6
6
8
9
2.3.1
LEADER AND TRAILER ..........................................................................................................
9
2.3.2
QUANTITY .................................................................................................................................
10
2.3.3
MISSING DEVICE .....................................................................................................................
10
2.3.4
SPLICING...................................................................................................................................
10
2.3.5
TAKING PACKAGED DEVICE OUT OF THE TAPE ............................................................
10
2.3.6
STORAGE ENVIRONMENT......................................................................................................
10
PACKAGED DEVICE ORIENTATION ..................................................................................
DIMENSIONS OF 6 PIN MINI MOLD PACKAGE .............................................................
11
11
3.
MECHANICAL DATA ......................................................................................................................
12
4.
PACKING..........................................................................................................................................
12
5.
ORDERING INFORMATION ............................................................................................................
12
2.4
2.5
3
[MEMO]
4
1.
DESCRIPTION
This information sheet is intended to cover standards on tape packaging for NEC subminiature high frequency
semiconductors “6 PINS MINI MOLD”.
All the dimensions and taping method are specified in accordance with the standard specification “JIS C 0806”
issued by EIAJ (Electronic Industries Association - Japan).
5
2.
2.1
SPECIFICATIONS
TAPE DIMENSIONS
t
H
δ
A
E
δ
J
K0
K1
K
6
G
F
W
B
θ θ
C
D
D1
Length Unit: mm, Angle Unit: deg.
ITEM
SYMBOL
SIZE
Length
A
3.18
+0.1
–0.1
Opening size
Width
B
3.40
+0.1
–0.1
Opening size
Depth
K0
1.4±0.1
Inner size
Pitch
F
4.0±0.1
+0.1
Accumulated Tolerance –0.3 MAX./10 Pitch
Diameter
J
φ1.5
Pitch
H
4.0±0.1
Position
E
1.75±0.1
Length
Direction
G
2.0±0.05
Width
Direction
D
3.5±0.05
Width
W
5.5
Width
C
8.0±0.2
Thickness
t
0.3±0.05
Diameter
D1
φ1.0
Depth
K1
1.6±0.1
Pocket
Perforation
Distance
Between
Center-line
Cover Tape
Carrier Tape
Mini Mold
Device
Overall Thickness
REMARKS
Outline
Tilt
+0.1
–0.05
+0.3
–0
Accumulated Tolerance
+0.1
MAX./10 Pitch
–0.3
Thickness: 0.1 Max.
Bend: δ 0.3 Max.
+0.2
–0.05
Dimentions of 6 pin Mini Mold package
θ
20° MAX.
K
1.65±0.1
See the product specification
7
2.2
REEL DIMENSIONS AND MARKING
θ1
A
C
B
θ2
TYPE
CLASS
label
W
Length Unit: mm, Angle Unit: deg.
ITEM
SYMBOL
SIZE
Diameter
A
φ178 ± 2
Space Between Flanges
W
9 ± 0.5
Outer Diameter
B
φ60 ± 1
Slit Location
θ1
90°
Spindle Hole Diameter
C
φ13 ± 0.5
Key Slit Location
θ2
120°
Flange
Hub
Marking
REMARKS
Type no., quantity and lot code are marked or labeled.
Note There are the case of delivery old figure outline on reel, for NEC stock.
8
2.3
TAPING INFORMATION
2.3.1
LEADER AND TRAILER
TRAILER
LEADER
COVER
TAPE
LABEL
ITEM
Leader
Trailer
SPECIFICATION
REMARKS
Cover Tape
Cover tape without carrier; 200 mm MIN.
Tip taped to rool
Carrier Tape
Empty pockets; 20 to 50
Take up direction as the above
400 to 600 mm
Length of cover tape + empty carrier tape
Carrier Tape
Emtpy pockets; 17 to 20
9
2.3.2
QUANTITY
3 000 pcs/reel
2.3.3
MISSING DEVICE
ITEM
SPEC
REMARKS
Consective
None
Within 40 mm to carrier except leader and trailer
Sporadic
0.2 % max/reel
Except leader and trailer
Others
Taping with wrong orientation, up side down and wrong device are not allowed
2.3.4
SPLICING
No carrier or cover tape should be spliced.
2.3.5
2.3.6
TAKING PACKAGED DEVICE OUT OF THE TAPE
1)
Packaged devices should not adhere to the cover tape.
2)
Excess Epoxy mold should not affect on taking the device out.
STORAGE ENVIRONMENT
Taping products should be stored with the following conditions.
10
•
Ambient Temperature ;
TA = −10 to +40 °C
•
Humidity
80 % MAX.
;
2.4
PACKAGED DEVICE ORIENTATION
1 PIN
C2H
C2H
C2H
C2H
C2H
C2H
1 PIN
“–E4”
“–E3”
Two taping orientations are specified as -E3 and -E4 in above drawing. In the drawing,
marking is an example. (As for markings, please refer to the data sheet of each product.)
Either -E3 or -E4 must be included in the part number. (see page 10.)
DIMENSIONS OF 6 PIN MINI MOLD PACKAGE
+ 0.1
0.3 – 0.05
0.13 ± 0.1
3
+ 0.2
2
1.5 – 0.1
+ 0.2
1
2.8 – 0.3
2.5
0 to 0.1
6
5
4
0.95
0.95
1.9
0.8
+ 0.2
1.1 – 0.1
2.9 ± 0.2
Device weight: approx. 13 mg (for reference)
11
3.
MECHANICAL DATA
ITEM
Cover tape adhesion
DATA
REMARKS
10˚
20 to 70 gf
direction of tape.
Tape bend strength
4.
F
(30 mm/minute)
carrier tape
When the tape is bent with 15.0 mm radius, no device should pop out
PACKING
10 reels are packed in corrugated cardbord box.
The part number including orientation symbol, rank, quantity, lot code and company are indicated on the box.
5.
ORDERING INFORMATION
In the case of order placement, please order with the following procedure.
<1> Part Number
<2> Orientation
<3> Rank
<4> quantity
<Example>
{
{
µPC2771T – E3 KB 30,000 pcs
Quantity (3,000 pcs × N)
Rank
Orientation
Part Number
12
[MEMO]
13
[MEMO]
14
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Tel.
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