ETC UPD161661

PRELIMINARY PRODUCT INFORMATION
MOS INTEGRATED CIRCUIT
µPD161661
POWER SUPPLY FOR TFT-LCD DRIVER
DESCRIPTION
The µPD161661 is a power supply IC for TFT-LCD driver. This ICs can generate the levels which TFT-LCD driver
need, from single voltage input.
FEATURES
• To generate 3 levels from single voltage input
• To integrate regulator circuit for source driver
ORDERING INFORMATION
Part number
Package
µPD161661P/W
Chip/Wafer
Remark
Purchasing the above chip entails the exchange of documents such as a separate memorandum or
product quality, so please contact one of our sales representative.
The information contained in this document is being issued in advance of the production cycle for the
device. The parameters for the device may change before final production or NEC Corporation, at its own
discretion, may withdraw the device prior to its production.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
S15917EJ1V0PM00 (1st edition)
Date Published January 2002 NS CP(K)
Printed in Japan
©
2002
µPD161661
1. BLOCK DIAGRAM/SYSTEM DIAGRAM
VDC
C1+
VSS
C1−
C2+
DCON
CR Oscillator
C2−
C3+
FS
LFS
DC/DC
Converter
Contorl
Divider
DC/DC Converter
LPM
RGONP
EXRVS
C3−
C4+
C4−
C5+
VDC x3
Regulator
Control
RC1
VDC x6
C5−
RC2
RSEL
VO
VREG
0 V (VSS)
VREF
VDD1
VDD2
VREFSEL
VREF
VEE
VS
MVS
RC1
RC1
ACS
LACS
TESTIN1TESTIN3
TESTOUT
RC2
Remark /xxx indicates active low signal.
2
Preliminary Product Information S15917EJ1V0PM
µPD161661
2. PIN CONFIGURATION (Pad Layout)
Chip size: X = 3.60 mm, Y = 3.40 mm
2
Pad size : 100 x 100 µm TYP.
(1) Alignment mark
T.B.D.
24
DUMMY
DUMMY
C1−
C1+
C2−
C2+
C3−
C3+
C4−
C4+
C5−
C5+
DUMMY
(2) Arrangement
13
25
12
Chip Surface
VDD1
DUMMY
VDC
(Bump size)
VSS
DUMMY
VO
VDD2
VS
DUMMY
Y
MVS
DUMMY
X
DUMMY
DUMMY
TESTIN1
DUMMY
TESTIN2
DCON
TESTIN3
RGONP
LPM
TESTOUT
36
D161661
1
DUMMY
DUMMY
VREF
VSS
LACS
VREFSEL
ACS
RSEL
FS
LFS
48
EXRVS
DUMMY
37
DUMMY
DUMMY
Remark T.B.D. : To be determined.
Preliminary Product Information S15917EJ1V0PM
3
µPD161661
Table 2-1. Pad Layout
Pad No.
Pad name
X[mm]
Y[mm]
Pad No.
Pad name
X[mm]
Y[mm]
1
DUMMY
1632
−1237.5
37
DUMMY
−1237.5
−1532
2
LPM
1632
−1012.5
38
EXRVS
−1012.5
−1532
3
RGONP
1632
−787.5
39
LFS
−787.5
−1532
4
DCON
1632
−562.5
40
FS
−562.5
−1532
5
DUMMY
1632
−337.5
41
RSEL
−337.5
−1532
6
DUMMY
1632
−112.5
42
ACS
−112.5
−1532
7
MVS
1632
112.5
43
VREFSEL
112.5
−1532
8
VS
1632
337.5
44
LACS
337.5
−1532
9
VDD2
1632
562.5
45
VSS
562.5
−1532
10
VSS
1632
787.5
46
VREF
787.5
−1532
11
VDC
1632
1012.5
47
DUMMY
1012.5
−1532
12
DUMMY
1632
1237.5
48
DUMMY
1237.5
−1532
13
DUMMY
1237.5
1532
−
1012.5
1532
+
787.5
1532
−
562.5
1532
+
337.5
1532
−
112.5
1532
19
C3
+
−112.5
1532
20
C4−
−337.5
1532
21
+
−562.5
1532
−
−787.5
1532
+
−1012.5
1532
14
15
16
17
18
22
4
C1
C1
C2
C2
C3
C4
C5
23
C5
24
DUMMY
−1237.5
1532
25
DUMMY
−1632
1237.5
26
VDD1
−1632
1012.5
27
DUMMY
−1632
787.5
28
VO
−1632
562.5
29
DUMMY
−1632
337.5
30
DUMMY
−1632
112.5
31
DUMMY
−1632
−112.5
32
TESTIN1
−1632
−337.5
33
TESTIN2
−1632
−562.5
34
TESTIN3
−1632
−787.5
35
TESTOUT
−1632
−1012.5
36
DUMMY
−1632
−1237.5
Preliminary Product Information S15917EJ1V0PM
µPD161661
3. PIN FUNCTIONS
(1/2)
Symbol
Pin Name
VDC
Power supply
VSS
Ground
Pad No.
I/O
11
−
10, 45
−
Description
Power supply for logic circuit and DC/DC converter.
Ground for logic circuit and DC/DC converter power
supply.
VDD1
DC/DC converter output
26
−
x6 voltage boost output of DC/DC converter.
Outputs a potential that is VDC boosted to six times the
original level.
Use this pin connected to a voltage stabilization capacitor.
VDD2
DC/DC converter output
9
−
x3 voltage boost output of DC/DC converter.
Outputs a potential that is VDC boosted to three times the
original level.
Use this pin connected to a voltage stabilization
capacitor.
VO
Rectangle signal output for
28
−
negative boost
Rectangle signal output for negative boost.
A potential that is VDC boosted to five times the original
level is used for the VO voltage range. A negative power
supply can be created for gate IC bottom output by
connecting an external component to this pin.
VS
Regulator output
8
−
Regulator output for source driver. Use this pin
connected to a voltage stabilization capacitor.
VREF
Reference voltage input/output
46
I/O
Reference voltage input/output of VS regulator.
The internal reference supply voltage is used when
VREFSEL = L. At this time, this pin can also be used as
the reference voltage output of the negative power supply
regulator incorporated in the gate driver, etc. When
VREFSEL = H, the external reference voltage can be input
as the regulator reference voltage.
DCON
DC/DC converter control
4
I
DC/DC converter ON/OFF control.
Use this pin connected to DC/DC converter control pin
(DCON) of source driver or the control port output of
CPU.
DCON = H : DC/DC converter ON
DCON = L : DC/DC converter OFF
RGONP
Regulator control
3
I
Regulator ON/OFF control for source driver voltage (VS).
Use this pin connected to the regulator control pin
(RGONP) of the source driver or the control port output of
CPU.
RGONP = H : Regulator ON
RGONP = L : Regulator OFF
EXRVS
VS regulating resistor selection
38
I
This pin selects whether to use the internal feedback
resistor or connect an external resistor for the VS
regulator amplifier.
When external resistor connection is selected, configure
a feedback circuit between the MVS, VS, and VSS pins by
connecting an external resistor.
EXRVS = H: External resistor connection
EXRVS = L: Internal feedback resistor used.
Preliminary Product Information S15917EJ1V0PM
5
µPD161661
(2/2)
Symbol
MVS
Pin Name
VS regulator input
Pad No.
I/O
Description
7
−
Feedback input (+) of the regulator amplifier for VS output.
This pin is used as follows according to the setting of
EXRVS.
EXRVS = H : To connect external resistor.
EXRVS = L : Leave it open.
RSEL
Internal resistor selection for
41
I
regulator
This pin selects the internal resistor for the regulator and
sets the source driver supply voltage output from the VS
pin as follows. Note that this pin setting is valid when
EXRVS = L.
RSEL = H: 5.0 V VS output voltage
RSEL = L: 4.0 V VS output voltage
VREFSEL
Regulator reference voltage
43
I
input selection
This pin selects external or internal reference voltage of
VS regulator. When external reference is selected, input
reference voltage from VREF pin.
VREFSEL = H : External reference voltage is selected.
VREFSEL = L : Internal reference voltage is selected.
LPM
Low power mode signal
2
I
Control signal for low power mode.
LPM = H : Low power mode
LPM = L : Normal mode
The settings made by the LACS and LFS pins are valid in
the low power mode, and settings made by the ACS and
FS pins are valid in the normal mode.
Connect to low power mode setting pin (LPMP) of source
driver or control port output of CPU.
ACS
Amp current selection
42
I
To select Amp current in normal mode.
For detail, refer to 4. MODE DESCRIPTION.
LACS
Amp current selection
44
I
To select Amp current in low power mode.
For detail, refer to 4. MODE DESCRIPTION.
FS
OSC frequency selection
40
I
To select OSC frequency for DC/DC converter when in
normal mode.
For detail, refer to 4. MODE DESCRIPTION.
LFS
Low power mode
39
I
OSC frequency selection
To select OSC frequency for DC/DC converter in low
power mode.
For detail, refer to 4. MODE DESCRIPTION.
+
−
+
−
+
−
+
−
+
−
C1 , C1
C2 , C2
Capacitor connect pin for
15, 14
boost
17, 16
C3 , C3
C4 , C4
C5 , C5
−
Capacitor connect pin for boost of DC/DC converter.
+
19, 18
The capacitance and tolerance of each capacitor are
21, 20
shown below.
23, 22
Capacitance : 1 µF
Tolerance : 10 V
TESTIN1 to
Test
32 to 34
I
TESTIN3
IC test mode pin.
Normally, leave it open.
TESTOUT
TEST output
35
O
DUMMY
Dummy pin
1, 5, 6, 12,
−
IC test mode pin.
Normally, leave it open.
Dummy pin. Leave it open.
13, 24, 25,
27, 29 to 31,
36, 37, 47,
48
6
−
Connect these pins between each Cn and Cn .
Preliminary Product Information S15917EJ1V0PM
µPD161661
4. MODE DESCRIPTION
DC/DC converter control
DCON
H
DC/DC converter ON
L
DC/DC converter OFF
H
Regulator ON
L
Regulator OFF (VS output : High impedance)
Regulator control
RGONP
VS regulating resistor
EXRVS
H
External resistor
L
Internal resistor
Regulator reference voltage input selection
VREFSEL
H
VREF : External reference voltage input
L
VREF : Internal reference voltage output
VS regulator selection
VS
RSEL
H
5.0 V
L
4.0 V
Amp current selection
ACS, LACS
Note
Note
VS
Source current
Sink current
H
3 mA >
0.5 µA
1 µA
L
3 mA >
5 µA
10 µA
ACS
: Selection of current during normal driving
LACS
: Selection of current in low power mode
Amp current
OSC frequency selection
FS, LFS
Note
Note
OSC
H
fOSC/8
L
fOSC/2
FS
: Selection of current during normal driving
LFS : Selection of current in low power mode
Preliminary Product Information S15917EJ1V0PM
7
µPD161661
Low power mode selection
LPM
Drive mode
H
Low power mode
The settings made by LACS and LFS are valid.
L
Normal mode
The settings made by AC and FS are valid.
8
Preliminary Product Information S15917EJ1V0PM
µPD161661
Figure 4-1. Example of Internal/External resistor for the regulator
<Internal resistor [EXRVS = L]>
VREG
VREF
VREFSEL
VREF
VS
MVS
<External resistor [EXRVS = L]>
VREG
VREF
VREFSEL
VREF
VS
MVS
Rb
VS
Ra
Remark VS = (1+Rb/Ra) VREF
Preliminary Product Information S15917EJ1V0PM
9
µPD161661
5. POWER ON/OFF SEQUENCE
5.1 Power ON Sequence
T.B.D.
10
Preliminary Product Information S15917EJ1V0PM
µPD161661
5.2 Power OFF Sequence
T.B.D.
Preliminary Product Information S15917EJ1V0PM
11
µPD161661
6. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°°C, VSS = 0 V)
Parameter
Symbol
Supply Voltage
VDC
Input Voltage
VI
Input Current
II
Output Voltage
VDD1
Output Current
IO
Rating
Unit
–0.5 to + 6.0
V
−0.5 to VDC + 0.5
V
±10
mA
–0.5 to +38
V
±10
mA
Operating Ambient Temperature TA
−30 to +85
°C
Storage Temperature
−55 to +125
°C
Tstg
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions (TA = –30 to +85°°C, VSS = 0 V)
Parameter
Symbol
Supply Voltage
VDC
Input Voltage
VI
Condition
MIN.
TYP.
MAX.
Unit
2.50
2.85
3.60
V
VDC
V
0
Electrical Characteristics (Unless otherwise specified, TA = –30 to +85°°C, VDC = 2.5 to 3.6 V, VSS = 0 V)
Parameter
Symbol
High Level Input Voltage
VIH
Low Level Output Voltage
VIL
Boost Voltage
VDD1
Boost Voltage
VDD1
Condition
MIN.
TYP.
MAX.
0.7 VDC
ACS (LACS) = H, FS (LFS) = L,
Unit
V
0.3 VDC
V
5 VDC
6 VDC
V
5 VDC
6 VDC
V
IDD1 = 100 µA
ACS (LACS) = H, FS (LFS) = H,
IDD1 = 100 µA
Output Voltage
VS1
Rsel = H, FS (LFS) = L,
4.5
5
5.5
V
3.5
4
4.5
V
T.B.D.
µA
T.B.D.
µA
2.75
V
IS = 3.0 mA
Output Voltage
VS2
Rsel = L, FS (LFS) = L,
IS = 3.0 mA
VDC Static Current Consumption VDC1
ACS (LACS) = H, FS (LFS) = L,
IDD1 = IS = 0.0 mA
VDC Static Current Consumption Ivdcd
ACS (LACS) = H, FS (LFS) = L,
IDD1 = IS = 0.0 mA
VREF Voltage
12
2.25
Preliminary Product Information S15917EJ1V0PM
2.50
µPD161661
[MEMO]
Preliminary Product Information S15917EJ1V0PM
13
µPD161661
[MEMO]
14
Preliminary Product Information S15917EJ1V0PM
µPD161661
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Preliminary Product Information S15917EJ1V0PM
15
µPD161661
• The information contained in this document is being issued in advance of the production cycle for the
device. The parameters for the device may change before final production or NEC Corporation, at its own
discretion, may withdraw the device prior to its production.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M5 98. 8