ETC HM5164805ATT-7

HM5164805A Series
HM5165805A Series
64M EDO DRAM (8-Mword × 8-bit)
8k refresh/4k refresh
ADE-203-458B (Z)
Rev. 2.0
Oct. 30, 1997
Description
The Hitachi HM5164805A Series, HM5165805A Series are CMOS dynamic RAMs organized 8,388,608word × 8-bit. They employ the most advanced CMOS technology for high performance and low power.
The HM5164805A Series, HM5165805A Series offer Extended Data Out (EDO) Page Mode as a high
speed access mode. They have the package variation of standard 400-mil 32-pin plastic SOJ and standard
400-mil 32-pin plastic TSOPII.
Features
• Single 3.3 V supply: 3.3 V +0.3 V/–0.15 V (HM5165805A-5R)
3.3 V ± 0.3 V (HM5164805A Series, HM5165805A/AL-6/7)
• Access time: 50 ns/60 ns/70 ns (max)
• Power dissipation
 Active mode : TBD/414 mW/360 mW (max) (HM5164805A Series)
: 702 mW/594 mW/522 mW (max) (HM5165805A Series)
 Standby mode : 7.2 mW (max)
:
1.08 mW (L-version)
• EDO page mode capability
• Refresh cycle
 RAS-only refresh
8192 cycles/64 ms (HM5164805A)
/128 ms (HM5164805AL) (L-version)
4096 cycles/64 ms (HM5165805A)
/128 ms (HM5165805AL) (L-version)
 CBR/Hidden refresh
4096 cycles/64 ms (HM5164805A, HM5165805A)
/128 ms (HM5164805AL, HM5165805AL) (L-version)
• 4 variations of refresh
 RAS-only refresh
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Datasheet Title
 CAS-before-RAS refresh
 Hidden refresh
 Self refresh (L-version)
• Battery backup operation (L-version)
Ordering Information
Type No.
Access time
Package
HM5164805AJ-6
HM5164805AJ-7
60 ns
70 ns
400-mil 32-pin plastic SOJ
(CP-32DC)
HM5164805ALJ-6
HM5164805ALJ-7
60 ns
70 ns
HM5165805AJ-6
HM5165805AJ-7
60 ns
70 ns
HM5165805ALJ-6
HM5165805ALJ-7
60 ns
70 ns
HM5164805ATT-6
HM5164805ATT-7
60 ns
70 ns
HM5164805ALTT-6
HM5164805ALTT-7
60 ns
70 ns
HM5165805ATT-5R
HM5165805ATT-6
HM5165805ATT-7
50 ns
60 ns
70 ns
HM5165805ALTT-6
HM5165805ALTT-7
60 ns
70 ns
2
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400-mil 32-pin plastic TSOP II
(TTP-32DC)
Datasheet Title
Pin Arrangement
HM5164805AJ/ALJ Series
VCC
1
I/O0
2
HM5164805ATT/ALTT Series
32
VSS
31
I/O7
I/O0
32
VSS
2
31
I/O7
I/O1
3
30
I/O6
VCC
1
I/O1
3
30
I/O6
I/O2
4
29
I/O5
I/O2
4
29
I/O5
I/O3
5
28
I/O4
I/O3
5
28
I/O4
NC
6
27
VSS
NC
6
27
VSS
VCC
7
26
CAS
VCC
7
26
CAS
WE
8
25
OE
WE
8
25
OE
RAS
9
24
A12
RAS
9
24
A12
A0
10
23
A11
A0
10
23
A11
A1
11
22
A10
A1
11
22
A10
A2
12
21
A9
A2
12
21
A9
A3
13
20
A8
A3
13
20
A8
A4
14
19
A7
A4
14
19
A7
A5
15
18
A6
A5
15
18
A6
VCC
16
17
VSS
VCC
16
17
VSS
(Top view)
(Top view)
Pin Description
Pin name
Function
A0 to A12
Address input
— Row/Refresh address A0 to A12
— Column address
A0 to A9
I/O0 to I/O7
Data input/Data output
RAS
Row address strobe
CAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
3
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Datasheet Title
Pin Arrangement
HM5165805AJ/ALJ Series
VCC
1
I/O0
2
HM5165805ATT/ALTT Series
32
VSS
31
I/O7
I/O0
32
VSS
2
31
I/O7
I/O1
3
30
I/O6
VCC
1
I/O1
3
30
I/O6
I/O2
4
29
I/O5
I/O2
4
29
I/O5
I/O3
5
28
I/O4
I/O3
5
28
I/O4
NC
6
27
VSS
NC
6
27
VSS
VCC
7
26
CAS
VCC
7
26
CAS
WE
8
25
OE
WE
8
25
OE
RAS
9
24
NC
RAS
9
24
NC
A0
10
23
A11
A0
10
23
A11
A1
11
22
A10
A1
11
22
A10
A2
12
21
A9
A2
12
21
A9
A3
13
20
A8
A3
13
20
A8
A4
14
19
A7
A4
14
19
A7
A5
15
18
A6
A5
15
18
A6
VCC
16
17
VSS
VCC
16
17
VSS
(Top view)
Pin Description
Pin name
Function
A0 to A11
Address input
— Row/Refresh address A0 to A11
— Column address
A0 to A10
I/O0 to I/O7
Data input/Data output
RAS
Row address strobe
CAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
4
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(Top view)
Datasheet Title
Block Diagram (HM5164805A Series)
RAS
CAS
WE
OE
Timing and control
Column decoder
A0
Column
A1
to
•
•
•
8M array
address
8M array
buffers
A9
•
•
•
Row
address
buffers
A10
to
A12
Row decoder
8M array
8M array
8M array
I/O buffers
I/O0
to
I/O7
8M array
8M array
8M array
5
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Datasheet Title
Block Diagram (HM5165805A Series)
RAS
CAS
WE
OE
Timing and control
Column decoder
A0
Column
A1
to
•
•
•
8M array
address
8M array
buffers
A10
•
•
•
Row
Row decoder
8M array
address
8M array
8M array
I/O0
to
I/O7
I/O buffers
8M array
8M array
buffers
8M array
A11
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–0.5 to VCC + 0.5 (≤ 4.6 V (max))
V
Supply voltage relative to VSS
VCC
–0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
6
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Datasheet Title
Recommended DC Operating Conditions (Ta = 0 to +70˚C)
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Supply voltage
VSS
0
0
0
V
2
VCC (HM5165805A-5R)
3.15
3.3
3.6
V
1, 2
VCC (HM5164/65805A/AL-6/7)
3.0
3.3
3.6
V
1, 2
Input high voltage
VIH
2.0
—
VCC + 0.3
V
1
Input low voltage
VIL
–0.3
—
0.8
V
1
Note:
1. All voltage referred to VSS .
2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS
pins must be on the same level.
7
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Datasheet Title
DC Characteristics
(Ta = 0 to +70˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM5164805A Series)
HM5164805A
-5R
Parameter
-6
-7
Symbol Min Max Min Max Min Max Unit Test conditions
Operating current* , * 2
I CC1
—
TBD —
115 —
100 mA
t RC = min
Standby current
I CC2
—
TBD —
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
TBD —
1
—
1
mA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
TBD —
300 —
300 µA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
TBD —
115 —
100 mA
t RC = min
Standby current*
I CC5
—
TBD —
5
5
RAS = VIH, CAS = VIL
Dout = enable
CAS-before-RAS refresh
current
I CC6
—
TBD —
140 —
120 mA
t RC = min
EDO page mode current*1, * 3
I CC7
—
TBD —
110 —
95
t HPC = min
Battery backup current*
(Standby with CBR refresh)
(L-version)
I CC10
—
TBD —
650 —
650 µA
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 31.3 µs
t RAS ≤ 0.3 µs
Self refresh mode current
(L-version)
I CC11
—
TBD —
500 —
500 µA
CMOS interface
RAS, CAS ≤ 0.2 V
Dout = High-Z
Input leakage current
I LI
TBD TBD –10 10
–10 10
µA
0 V ≤ Vin ≤ VCC + 0.3 V
Output leakage current
I LO
TBD TBD –10 10
–10 10
µA
0 V ≤ Vout ≤ VCC
Dout = disable
Output high voltage
VOH
TBD TBD 2.4
VCC 2.4
VCC V
High Iout = –2 mA
Output low voltage
VOL
TBD TBD 0
0.4
0.4
Low Iout = 2 mA
1
Standby current
(L-version)
RAS-only refresh current* 2
1
4
—
0
mA
mA
V
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less within one page mode cycle tHPC .
4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V.
8
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Datasheet Title
DC Characteristics
(Ta = 0 to +70°C, VCC = 3.3 V +0.3 V/–0.15 V, VSS = 0 V) (HM5165805A-5R)
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM5165805A/AL-6/7)
HM5165805A
-5R
Parameter
-6
-7
Symbol Min Max Min Max Min Max Unit
Test conditions
Operating current* , * 2
I CC1
—
195 —
165 —
145 mA
t RC = min
Standby current
I CC2
—
2
—
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
1
—
1
—
1
mA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
TBD —
300 —
300 µA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
195 —
165 —
145 mA
t RC = min
Standby current*
I CC5
—
5
5
5
RAS = VIH, CAS = VIL
Dout = enable
CAS-before-RAS refresh
current
I CC6
—
170 —
140 —
120 mA
t RC = min
EDO page mode current*1, * 3
I CC7
—
150 —
125 —
110 mA
t HPC = min
Battery backup current*
(Standby with CBR refresh)
(L-version)
I CC10
—
TBD —
650 —
650 µA
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 31.3 µs
t RAS ≤ 0.3 µs
Self refresh mode current
(L-version)
I CC11
—
TBD —
500 —
500 µA
CMOS interface
RAS, CAS ≤ 0.2 V
Dout = High-Z
Input leakage current
I LI
–10 10
–10 10
–10 10
µA
0 V ≤ Vin ≤ VCC + 0.3 V
Output leakage current
I LO
–10 10
–10 10
–10 10
µA
0 V ≤ Vout ≤ VCC
Dout = disable
Output high voltage
VOH
2.4
VCC 2.4
VCC 2.4
VCC V
High Iout = –2 mA
Output low voltage
VOL
0
0.4 0
0.4 0
0.4 V
Low Iout = 2 mA
1
Standby current
(L-version)
RAS-only refresh current*2
1
4
—
—
mA
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less within one page mode cycle tHPC .
4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V.
9
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Datasheet Title
Capacitance
(Ta = 25°C, VCC = 3.3 V +0.3 V/–0.15 V) (HM5165805A-5R)
(Ta = 25°C, VCC = 3.3 V ± 0.3 V) (HM5164805A Series, HM5165805A/AL-6/7)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. RAS and CAS = VIH to disable Dout.
AC Characteristics*1, *2 , *17
(Ta = 0 to +70°C, VCC = 3.3 V +0.3 V/–0.15 V, VSS = 0 V) (HM5165805A-5R)
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM5164805A Series,
HM5165805A/AL-6/7)
Test Conditions
•
•
•
•
•
Input rise and fall time: 2 ns
Input levels: 0 V, 3.0 V
Input timing reference levels: 0.8 V, 2.0 V
Output timing reference levels: 0.8 V, 2.0 V
Output load:1 TTL gate + C L (50 pF) (Including scope and jig) (HM5165805A-5R)
1 TTL gate + CL (100 pF) (Including scope and jig) (HM5164805A Series,
HM5165805A/AL-6/7)
10
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Datasheet Title
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min
Max
Min Max
Unit Notes
Random read or write cycle time
t RC
84
—
104
—
124 —
ns
RAS precharge time
t RP
30
—
40
—
50
—
ns
CAS precharge time
t CP
8
—
10
—
13
—
ns
RAS pulse width
t RAS
50
10000
60
10000
70
10000
ns
CAS pulse width
t CAS
8
10000
10
10000
13
10000
ns
Row address setup time
t ASR
0
—
0
—
0
—
ns
Row address hold time
t RAH
8
—
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
0
—
ns
Column address hold time
t CAH
8
—
10
—
13
—
ns
RAS to CAS delay time
t RCD
12
37
20
45
20
52
ns
3
RAS to column address delay time
t RAD
10
25
14
30
14
35
ns
4
RAS hold time
t RSH
13
—
15
—
18
—
ns
CAS hold time
t CSH
40
—
48
—
58
—
ns
CAS to RAS precharge time
t CRP
5
—
5
—
5
—
ns
OE to Din delay time
t OED
13
—
15
—
18
—
ns
5
OE delay time from Din
t DZO
0
—
0
—
0
—
ns
6
CAS delay time from Din
t DZC
0
—
0
—
0
—
ns
6
Transition time (rise and fall)
tT
2
50
2
50
2
50
ns
7
21
11
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Datasheet Title
Read Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min
Max
Min Max
Unit Notes
Access time from RAS
t RAC
—
50
—
60
—
70
ns
8, 9
Access time from CAS
t CAC
—
13
—
15
—
18
ns
9, 10,
16
Access time from address
t AA
—
25
—
30
—
35
ns
9, 11,
16
Access time from OE
t OEA
—
13
—
15
—
18
ns
9
Read command setup time
t RCS
0
—
0
—
0
—
ns
Read command hold time to CAS
t RCH
0
—
0
—
0
—
ns
Read command hold time from RAS
t RCHR
50
—
60
—
70
—
ns
Read command hold time to RAS
t RRH
5
—
0
—
0
—
ns
Column address to RAS lead time
t RAL
25
—
30
—
35
—
ns
Column address to CAS lead time
t CAL
15
—
18
—
23
—
ns
CAS to output in low-Z
t CLZ
0
—
0
—
0
—
ns
Output data hold time
t OH
3
—
3
—
3
—
ns
Output data hold time from OE
t OHO
3
—
3
—
3
—
ns
Output buffer turn-off time
t OFF
—
15
—
15
—
15
ns
13, 20
Output buffer turn-off to OE
t OEZ
—
13
—
15
—
15
ns
13
CAS to Din delay time
t CDD
13
—
15
—
18
—
ns
5
Output data hold time from RAS
t OHR
3
—
3
—
3
—
ns
20
Output buffer turn-off to RAS
t OFR
—
13
—
15
—
15
ns
13, 20
Output buffer turn-off to WE
t WEZ
—
13
—
15
—
15
ns
13
WE to Din delay time
t WED
13
—
15
—
18
—
ns
RAS to Din delay time
t RDD
13
—
15
—
18
—
ns
12
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12
12
20
Datasheet Title
Write Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min
Max
Min Max
Unit Notes
Write command setup time
t WCS
0
—
0
—
0
—
ns
Write command hold time
t WCH
8
—
10
—
13
—
ns
Write command pulse width
t WP
8
—
10
—
10
—
ns
Write command to RAS lead time
t RWL
13
—
15
—
18
—
ns
Write command to CAS lead time
t CWL
10
—
10
—
13
—
ns
Data-in setup time
t DS
0
—
0
—
0
—
ns
Data-in hold time
t DH
8
—
10
—
13
—
ns
14
Read-Modify-Write Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min Max
Min Max
Unit Notes
Read-modify-write cycle time
t RWC
111 —
149 —
175 —
ns
RAS to WE delay time
t RWD
67
—
78
—
91
—
ns
14
CAS to WE delay time
t CWD
30
—
33
—
39
—
ns
14
Column address to WE delay time
t AWD
42
—
48
—
56
—
ns
14
OE hold time from WE
t OEH
13
—
15
—
18
—
ns
Refresh Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min Max
Min Max
Unit Notes
CAS setup time (CBR refresh cycle)
t CSR
5
—
5
—
5
—
ns
CAS hold time (CBR refresh cycle)
t CHR
8
—
10
—
10
—
ns
WE setup time (CBR refresh cycle)
t WRP
0
—
0
—
0
—
ns
WE hold time (CBR refresh cycle)
t WRH
10
—
10
—
10
—
ns
RAS precharge to CAS hold time
t RPC
5
—
0
—
0
—
ns
13
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Datasheet Title
EDO Page Mode Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min Max
Min Max
Unit Notes
EDO page mode cycle time
t HPC
20
—
25
30
ns
19
EDO page mode RAS pulse width
t RASP
—
100000 —
100000 —
100000 ns
15
Access time from CAS precharge
t CPA
—
28
—
35
—
40
ns
9, 16
RAS hold time from CAS precharge
t CPRH
28
—
35
—
40
—
ns
Output data hold time from CAS low
t DOH
3
—
3
—
3
—
ns
CAS hold time referred OE
t COL
8
—
10
—
13
—
ns
CAS to OE setup time
t COP
8
—
10
—
10
—
ns
Read command hold time from CAS
precharge
t RCHC
28
—
35
—
40
—
ns
Write pulse width during CAS precharge t WPE
8
—
10
—
10
—
ns
OE precharge time
8
—
10
—
10
—
ns
t OEP
—
—
9
EDO Page Mode Read-Modify-Write Cycle
HM5164805A/HM5165805A
-5R
-6
-7
Parameter
Symbol Min Max
Min
Max
Min Max
Unit Notes
EDO page mode read- modify-write
cycle time
t HPRWC
57
—
68
—
79
—
ns
WE delay time from CAS precharge
t CPW
45
—
54
—
62
—
ns
14
Refresh (HM5164805A Series)
Parameter
Symbol
Max
Unit
Notes
Refresh period
t REF
64
ms
8192 cycles
Refresh period (L-version)
t REF
128
ms
8192 cycles
Parameter
Symbol
Max
Unit
Notes
Refresh period
t REF
64
ms
4096 cycles
Refresh period (L-version)
t REF
128
ms
4096 cycles
Refresh (HM5165805A Series)
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Datasheet Title
Self Refresh Mode (L-version)
HM5164805AL/HM5165805AL
-5R
-6
-7
Parameter
Symbol
Min
Max Min Max Min
Max Unit
RAS pulse width (self refresh)
t RASS
TBD —
100 —
100
—
µs
RAS precharge time (self refresh)
t RPS
TBD —
110 —
130
—
ns
CAS hold time (self refresh)
t CHS
TBD —
–50 —
–50
—
ns
Notes
Notes: 1. AC measurements assume t T = 2 ns.
2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh).
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 1 TTL loads and 50 pF (HM5165805A-5R) and 1 TTL
loads and 100 pF (HM5164805A Series, HM5165805A/AL-6/7).
10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max).
11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max).
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max), tOEZ (max), tWEZ (max) and tOFR (max) define the time at which the outputs achieve the
open circuit condition and are not referred to output voltage levels.
14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
15. t RASP defines RAS pulse width in EDO page mode cycles.
16. Access time is determined by the longest among t AA , t CAC and t CPA.
17. All the V CC and VSS pins shall be supplied with the same voltages.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
19. t HPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode
read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle (EDO
page mode mix cycle (1), (2)), minimum value of CAS cycle (tCAS + tCP + 2 tT) becomes greater
than the specified t HPC (min) value. The value of CAS cycle time of mixed EDO page mode is
shown in EDO page mode mix cycle (1) and (2).
15
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Datasheet Title
20. Data output turns off and becomes high impedance from later rising edge of RAS and CAS.
Hold time and turn off time are specified by the timing specifications of later rising edge of RAS
and CAS between t OHR and t OH and between tOFR and t OFF.
21. t CSH (min) can be achieved when tRCD ≤ tCSH (min) – tCAS (min).
22. Please do not use tRASS timing, 10 µs ≤ tRASS ≤ 100 µs. During this period, the device is in
transition state from normal operation mode to self refresh mode. If t RASS > 100 µs, then RAS
precharge time should use tRPS instead of tRP.
23. CBR burst refresh or 4096 cycles of distributed CBR refresh with 15.6 µs interval should be
executed within 64 ms immediately after exiting from and before entering into the self refresh
mode.
24. Repetitive self refresh mode without refreshing all memory is not allowed. Once you exit from
self refresh mode, all memory cells need to be refreshed before re-entering the self refresh mode
again.
25. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
16
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Datasheet Title
Timing Waveforms*25
Read Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tT
tRSH
tCAS
CAS
tRAD
tASR
Address
tRAH
tRAL
tCAL
tASC
tCAH
Column
Row
tRRH
tRCHR
tRCS
tRCH
WE
tDZC
tCDD
tWED
tRDD
High-Z
Din
tDZO
tOEA
tOED
OE
tOEZ
tOHO
tOFF
tOH
tOFR
tOHR
tCAC
tAA
tRAC
tCLZ
tWEZ
Dout
Dout
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Datasheet Title
Early Write Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
tT
CAS
tASR
Address
tRAH
Row
tASC
tCAH
Column
tWCS
tWCH
WE
tDS
Din
Dout
tDH
Din
High-Z*
* t WCS
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t WCS (min)
Datasheet Title
Delayed Write Cycle*18
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
tT
CAS
tASR
Address
tRAH
tASC
Row
tCAH
Column
tCWL
tRWL
tWP
tRCS
WE
tDS
tDZC
High-Z
Din
Din
tOED
tDZO
tDH
tOEH
tOEP
OE
tOEZ
tCLZ
High-Z
Dout
Invalid Dout
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Datasheet Title
Read-Modify-Write Cycle*18
tRWC
tRAS
tRP
RAS
tT
tRCD
tCAS
tCRP
CAS
tRAD
tASR
Address
tASC
tRAH
Row
tCAH
Column
tCWL
tCWD
tRCS
tRWL
tWP
tAWD
tRWD
WE
tDZC
tDS
High-Z
Din
Din
tDH
tOED
tDZO
tOEH
tOEA
tOEP
OE
tCAC
tAA
tOEZ
tRAC
tOHO
Dout
Dout
tCLZ
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High-Z
Datasheet Title
RAS-Only Refresh Cycle
tRC
tRAS
tRP
RAS
tT
tRPC
tCRP
tCRP
CAS
tASR
tRAH
Row
Address
tOFR
tOFF
High-Z
Dout
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Datasheet Title
CAS-Before-RAS Refresh Cycle
t RC
t RP
t RAS
t RP
RAS
t RPC
t CSR
t CHR
t RPC
tT
CAS
t CP
t WRP
t WRH
t CP
WE
Address
t OFR
t OFF
Dout
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High-Z
t CRP
Datasheet Title
Hidden Refresh Cycle
tRC
tRC
tRAS
tRP
tRAS
tRC
tRP
tRAS
tRP
RAS
tT
tRSH
tCHR
tCRP
tRCD
CAS
tRAD
tASR
Address
tRAH
tRAL
tASC
Row
tCAH
Column
tRRH
tRCS
tRCH
WE
tWED
tDZC
tCDD
tRDD
High-Z
Din
tDZO
tOED
tOEA
OE
tCAC
tAA
tRAC
tOFF
tCLZ
Dout
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tOEZ
tWEZ
tOHO
tOH
Dout
tOFR
tOHR
23
Datasheet Title
EDO Page Mode Read Cycle (1)
t RP
t HPC
t RASP
RAS
tT
t CSH
t CP
t HPC
t CAS
CAS
t HPC
t CPRH
t CP
t
t CRP
RSH
t CAS
t RCHR
t RCS
t CP
tCAS
tCAS
t RCHC
t RCH t RCS
t RRH
t RCH
WE
tASR
Address
tRAH tASC
Row
tCAH
Column 1
t WPE
t ASC t CAH
t ASC t CAH
Column 2
Column 3
t CAL
t CAL
t RAL
t CAH
tASC
t WED
Column 4
t CAL
t CAL
tRDD
tCDD
tDZC
High-Z
Din
tCOL
tDZO
tCOP
t OEP
tOED
tOEP
OE
tAA
tCAC
tCAC
tAA
tWEZ
tCPA
tAA
tCAC
tOEZ
tOHO
tDOH
Dout 2
Dout 2
tOHO
Dout 3
tCAC
tOHO
tOFF
tOH
tOEA
Dout 4
Dout 1
tAA
tOEZ
tOEA
tRAC
Dout
tOFR
tOHR
tOEZ
tCPA
tCPA
tOEA
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Datasheet Title
EDO Page Mode Read Cycle (2)
t RP
t RASP
RAS
tT
t CSH
t CP
t HPC
t CAS
CAS
tHPC
t CP
t HPC
t CP
tRSH
t CAS
t CAS
t CRP
tCAS
t RCHC
t RRH
t RCH
t RCS
WE
tASR
Address
tRAH tASC
Row
tCAH
t ASC t CAH
t ASC t CAH
Column 1
Column 2
t CAL
t RAL
t CAH
tASC
Column 3
t CAL
t WED
Column 4
t CAL
tRDD
t CAL
tDZC
tCDD
High-Z
Din
tCOL
tDZO
tCOP
t OEP
tOED
tOEP
OE
tAA
tCAC
tCAC
tAA
tOEZ
tOHO
tDOH
tRAC
Dout
tCPA
tAA
tCAC
tCPA
tOEA
tOEA
tAA
tOEZ
tDOH
tOHO
Dout 1
Dout 2
Dout 2
tOFR
tOHR
tOEZ
tCPA
Dout 3
tCAC
tOHO
tOFF
tOH
tOEA
Dout 4
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Datasheet Title
EDO Page Mode Early Write Cycle
tRP
tRASP
RAS
tT
tCSH
tHPC
tCAS
tRCD
tCP
tRSH
tCAS
tCP
tCAS
tCRP
CAS
tASR
Address
Row
tRAH
tASC
tCAH
Column 1
tWCS
tWCH
tASC
tCAH
Column 2
tWCS
tWCH
tASC
tCAH
Column N
tWCS
tWCH
WE
tDS
Din
tDH
Din 1
Dout
tDS
tDH
Din 2
tDS
tDH
Din N
High-Z*
* t WCS
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t WCS (min)
Datasheet Title
EDO Page Mode Delayed Write Cycle*18
tRASP
tRP
RAS
tT
tCP
tCSH
tRCD
tCRP
tCP
tHPC
tCAS
tCAS
tRSH
tCAS
CAS
tRAD
tASR
tASC
tCAH
tASC
tCAH
Column 1
Column 2
tRAH
Address
Row
tASC
tCAH
tCWL
Column N
tCWL
tCWL
tRWL
tRCS
tRCS
tRCS
WE
tWP
tDZC tDS
tDZC
tWP
tDS
tDZC
tDH
tDH
Din
1
Din
tDZO tOED
tWP
tDS
tDH
Din
2
tDZO
tOED
tOEP
tOEH
tDZO
tOED
tOEP
tOEH
tOEP
tOEH
Din
N
OE
tCLZ
tCLZ
tOEZ
tCLZ
tOEZ
tOEZ
Dout
Invalid Dout
Invalid Dout
High-Z
Invalid Dout
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Datasheet Title
EDO Page Mode Read-Modify-Write Cycle*18
t RASP
t RP
RAS
tT
t HPRWC
t CP
t RCD
t RSH
t CP
t CAS
t CAS
t CRP
t CAS
CAS
t RAD
t ASR
Address
t ASC
t RAH
Row
t ASC
t CAH
t CAH
Column 1
t ASC
t CAH
Column 2
t RWD
t CWL
t AWD
t CPW
t CWL
t CPW
t AWD
t RCS
t CWD
Column N
t CWL
t AWD
t RCS
t CWD
t RWL
t CWD
WE
t RCS
t WP
t WP
t DZC t DS
t WP
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
t DZO
t OED
t OEP
t OEH
t DH
Din
2
t OED
t DZO
t OEP
t OEH
Din
N
t OED
t DZO
t OEP
t OEH
OE
t OHO
t OHO
t OHO
t OEA
t CAC
t OEA
t CAC
t AA
t OEA
t CAC
t AA
t CPA
t RAC
t OEZ
t CLZ
t AA
t CPA
t OEZ
t CLZ
t OEZ
t CLZ
High-Z
Dout
Dout 1
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Dout 2
Dout N
Datasheet Title
EDO Page Mode Mix Cycle (1)*19
t RP
t RASP
RAS
tT
t CAS
CAS
t CRP
t CP
t CP
t CP
t CAS
tCAS
tCAS
t CSH
tRSH
t RCD
t WCS
t WCH
tCPW
tAWD
WE
t ASC
tRAH
tASR
Address
Row
tCAH
Column 1
t RRH
t RCH
t RCS
t RCS
t ASC t CAH
tASC t CAH
Column 2
Column 3
tWP
tASC
t RAL
t CAH
Column 4
t CAL
t DS
Din
Din 1
tRDD
tCDD
t CAL
t DH
t DH
t DS
High-Z
Din 3
tOED
tOEP
tWED
OE
tCPA
tAA
tCAC
Dout
tOFR
tWEZ
tCPA
tCPA
tAA
tOEA
t DOH
Dout 2
t OEZ
tCAC t OHO
Dout 3
tAA
tOEZ
tCAC
tOHO
tOEA
tOFF
tOH
Dout 4
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Datasheet Title
EDO Page Mode Mix Cycle (2)*19
t RP
t RASP
RAS
tT
t CSH
t CAS
CAS
t RCD
t CAS
tCAS
t RCH
tWCS t WCH
tRAH
Row
tCAH
Column 1
t ASC t CAH
t ASC t CAH
Column 2
Column 3
t CAL
t CAL
t RRH
t RCH
tWP
tCPW
t ASC
tRSH
t RCS
t RCS
WE
Address
tCAS
t RCHR
t RCS
tASR
t CRP
t CP
t CP
t CP
t RAL
t CAH
tASC
Column 4
t CAL
t CAL
t DS
t DS
High-Z
Din
t DH
tRDD
tCDD
t DH
Din 2
Din 3
t OEP
t OEP
tOED
tOED
tCOP
tWED
tCOL
OE
t OEA
tAA
tOEA
tCAC
tOEZ
tCPA
tAA
tCAC
tRAC
tOEZ
t OHO
t OHO
Dout
Dout 1
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tOFR
tWEZ
tCPA
Dout 3
tAA
tCAC
tOEZ
tOEA
tOFF
tOH
tOHO
Dout 4
Datasheet Title
Self Refresh Cycle (L-version)*22, 23, 24
tRASS
tRP
tRPS
RAS
tRPC
tCP
tT
tCRP
tCHS
tCSR
CAS
tWRP
tWRH
WE
tOFR
tOFF
Dout
High-Z
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Datasheet Title
Package Dimensions
HM5164805AJ/ ALJ Series
HM5165805AJ/ ALJ Series (CP-32DC)
Unit: mm
3.50 ± 0.26
1.165 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
0.10
Dimension including the plating thickness
Base material dimension
32
2.55 ± 0.46
16
0.74
0.90 ± 0.26
1
11.18 ± 0.13
17
10.16 ± 0.13
32
20.95
21.38 Max
9.40 ± 0.25
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-32DC
—
Conforms
1.2 g
Datasheet Title
HM5164805ATT/ALTT Series
HM5165805ATT/ALTT Series (TTP-32DC)
Unit: mm
20.95
21.35 Max
17
10.16
32
1.27
0.42 ± 0.08
0.40 ± 0.06
0.21
16
M
0.80
11.76 ± 0.20
0.13 ± 0.05
0.10
0.145 ± 0.05
0.125 ± 0.04
1.20 Max
1.15 Max
Dimension including the plating thickness
Base material dimension
0° – 5° 0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
0.68
1
TTP-32DC
Conforms
—
0.51 g
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
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Datasheet Title
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
USA
Tel: 415-589-8300
Fax: 415-583-4207
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
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Datasheet Title
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
0.0
Oct. 13, 1995
Initial issue
S. Ikenaga
J. Kitano
0.1
Apr. 30, 1996
Change format
S. Ikenaga
J. Kitano
S. Ikenaga
J. Kitano
J. Kitano
J. Kitano
Unification of HM5164805A Series and HM5165805A
Series
Addition of HM5164805A/HM5165805A-5 Series
Addition of HM5164805AJ/ALJ Series,
HM5165805AJ/ALJ Series (CP-32DC)
Pin Descriptions
Addition of Row/Refresh address and Column
address to address input
Addition of Block Diagrams
DC Characteristics (HM5164805A)
I CC1 max: 105/95 mA to TBD/135/115 mA
I CC3 max: 105/95 mA to TBD/135/115 mA
I CC6 max: 105/95 mA to TBD/150/130 mA
I CC7 max: 105/95 mA to TBD/145/125 mA
Addition of note 4
DC Characteristics (HM5165805A)
I CC1 max: 145/135 mA to TBD/185/165 mA
I CC3 max: 125/110 mA to TBD/185/165 mA
I CC6 max: 125/110 mA to TBD/150/130 mA
I CC7 max: 125/110 mA to TBD/145/125 mA
Addition of note 4
AC Characteristics
t RCD max: 38/45 ns to TBD/45/52 ns
t COP min: 5/5 ns to TBD/10/10 ns
Addition of t WPE and tOEP
t HPRWC min: 79/90 ns to TBD/68/79 ns
Addition of notes 20 to 24
Change of notes 3 and 13
Timing waveforms
Addition of t WPE and tOEP timings
Deletion of note: t OEH ≥ tCWL
0.2
Jun. 12, 1996
AC Characteristics
Change of notes 18 and 25
Timing waveforms
Deletion of notes about undefined pins
0.3
Jan. 22, 1997
Power dissipation
TBD/540/468 mW to TBD/414/360 mW (max)
(HM5164805A Series)
TBD/648/576 mW to TBD/594/522 mW (max)
(HM5165805A Series)
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Datasheet Title
Revision Record (cont)
Rev.
Date
Contents of Modification
Drawn by
Approved by
0.3
Jan. 22, 1997
DC Characteristics (HM5164805A Series)
J. Kitano
J. Kitano
I CC1(max): TBD/135/115 mA to TBD/115/100 mA
I CC3(max): TBD/135/115 mA to TBD/115/100 mA
I CC6(max): TBD/150/130 mA to TBD/140/120 mA
I CC7(max): TBD/145/125 mA to TBD/110/95 mA
I LO test conditions: 0 V ≤ Vout ≤ VCC + 0.3 to
0 V ≤ Vout ≤ VCC
DC Characteristics (HM5165805A Series)
I CC1(max): TBD/185/165 mA to TBD/165/145 mA
I CC3(max): TBD/185/165 mA to TBD/165/145 mA
I CC6(max): TBD/150/130 mA to TBD/140/120 mA
I CC7(max): TBD/145/125 mA to TBD/125/110 mA
I LO test conditions: 0 V ≤ Vout ≤ VCC + 0.3 to
0 V ≤ Vout ≤ VCC
AC Characteristics
Change of note 20
1.0
Sep.12, 1997
Deletion of preliminary
Power dissipation
Standby mode (L-version): TBD to 1.08 mW(max)
DC Characteristics (HM5165805A Series)
I CC2(max)(L-version):
TBD/TBD/TBD µA to TBD/300/300 µA
I CC10(max): TBD/TBD/TBD µA to TBD/650/650 µA
I CC11(max): TBD/TBD/TBD µA to TBD/500/500 µA
AC Characteristics
t RAD (min): TBD/15/15 ns to TBD/14/15 ns
t RWL (min): TBD/10/13 ns to TBD/15/18 ns
t REF (L-version) (HM5164805A Series)
128 ms to TBD (for suspension of L-version),
Correct errors (HM5164805A Series)
t REF (L-version): 4096 cycles to 8192 cycles
2.0
Oct. 30, 1997
Deletion of HM5164805A/HM5165805A-5 Series
Addition of HM5165805A-5R
Addition of specification for HM5164805AL
Power dissipation
TBD/594/522 mW to 702/594/522 mW
(HM5165805A)
Recommended DC Operating Conditions
Addition of VCC (HM5165805A-5R): 3.15/3.3/3.6 V
DC Characteristics (HM5164805A Series)
I CC2 max: TBD/TBD/TBD to TBD/300/300 µA
I CC10 max: TBD/TBD/TBD to TBD/650/650 µA
I CC11 max: TBD/TBD/TBD to TBD/500/500 µA
36
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M. Tsunozaki M. Saeki
Datasheet Title
Revision Record (cont)
Rev.
Date
Contents of Modification
2.0
Oct. 30, 1997
AC Characteristics
Test conditions
Addition of output load condition (-5R):
1 TTL gate + CL (50pF)
t RAD min: TBD/14/15 ns to 10/14/14 ns
t REF (L-version) (8k refresh): TBD to 128 ms
Change of note 9
Drawn by
Approved by
Timing waveforms
Correct error of EDO page mode mix cycle (1)
37
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