IRF IRG4PSH71KD

PD - 91688A
PRELIMINARY
IRG4PSH71KD
Short Circuit Rated
UltraFast IGBT
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
C
Features
• Hole-less clip/pressure mount package compatible
with TO-247 and TO-264, with reinforced pins
• High short circuit rating IGBTs, optimized for
motorcontrol
• Minimum switching losses combined with low
conduction losses
• Tightest parameter distribution
• IGBT co-packaged with ultrafast soft recovery
antiparallel diode
• Creepage distance increased to 5.35mm
VCES = 1200V
VCE(on) typ. = 2.97V
G
@VGE = 15V, IC = 42A
E
n-ch an nel
Benefits
• Highest current rating copack IGBT
• Maximum power density, twice the power
handling of the TO-247, less space than TO-264
• HEXFREDTM diode optimized for operation with
IGBT, to minimize EMI, noise and switching losses
SUPER - 247
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 100°C
IFM
tsc
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current 
Clamped Inductive Load Current ‚
Diode Continuous Forward Current
Diode Maximum Forward Current
Short Circuit Withstand Time
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Max.
Units
1200
78
42
156
156
42
156
10
± 20
350
140
-55 to +150
V
A
µs
V
W
°C
300 (0.063 in. (1.6mm) from case)
Thermal Resistance\ Mechanical
Parameter
RθJC
RθJC
RθCS
RθJA
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Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Recommended Clip Force
Weight
Min.
Typ.
Max.
–––
–––
–––
–––
20.0(2.0)
–––
–––
–––
0.24
–––
–––
6 (0.21)
0.36
0.69
–––
38
–––
–––
Units
°C/W
N (kgf)
g (oz)
1
5/11/99
IRG4PSH71KD
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
∆V(BR)CES/∆TJ
VCE(on)
VGE(th)
∆VGE(th)/∆TJ
gfe
ICES
VFM
IGES
Parameter
Min. Typ. Max. Units
Collector-to-Emitter Breakdown Voltageƒ 1200 —
—
V
Temperature Coeff. of Breakdown Voltage —
1.1
— V/°C
Collector-to-Emitter Saturation Voltage
— 2.97 3.9
— 3.44 —
V
— 2.60 —
Gate Threshold Voltage
3.0
—
6.0
Temperature Coeff. of Threshold Voltage
—
-12
— mV/°C
Forward Transconductance „
25
38
—
S
Zero Gate Voltage Collector Current
—
—
500
µA
—
—
10
mA
Diode Forward Voltage Drop
—
2.5 3.7
V
—
2.4
—
Gate-to-Emitter Leakage Current
—
— ±100 nA
Conditions
VGE = 0V, IC = 250µA
VGE = 0V, IC = 10mA
IC = 42A
VGE = 15V
See Fig. 2, 5
IC = 78A
IC = 42A, TJ = 150°C
VCE = VGE, IC = 250µA
VCE = VGE, IC = 1.5mA
VCE = 50V, IC = 42A
VGE = 0V, VCE = 1200V
VGE = 0V, VCE = 1200V, TJ = 150°C
IC = 42A
See Fig. 13
IC = 42A, TJ = 150°C
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
tsc
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Short Circuit Withstand Time
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M /dt
Diode Peak Rate of Fall of Recovery
During tb
2
Min.
—
—
—
—
—
—
—
—
—
—
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ. Max. Units
Conditions
410 610
IC = 42A
47
70
nC
VCC = 400V
See Fig.8
145 220
VGE = 15V
67
—
84
—
TJ = 25°C
ns
230 350
IC = 42A, VCC = 800V
130 190
VGE = 15V, RG = 5.0Ω
5.68 —
Energy losses include "tail"
3.23 —
mJ and diode reverse recovery
8.90 11.6
See Fig. 9,10,18
—
—
µs
VCC = 720V, TJ = 125°C
VGE = 15V, RG = 5.0Ω
65
—
TJ = 150°C,
See Fig. 11,18
87
—
IC = 42A, VCC = 800V
ns
370
—
VGE = 15V, RG = 5.0Ω
290
—
Energy losses include "tail"
13.7 —
mJ and diode reverse recovery
13
—
nH
Measured 5mm from package
5770 —
VGE = 0V
400
—
pF
VCC = 30V
See Fig. 7
100
—
ƒ = 1.0MHz
107 160
ns
TJ = 25°C See Fig.
160 240
TJ = 125°C
14
IF = 42A
10
15
A
TJ = 25°C See Fig.
16
24
TJ = 125°C
15
VR = 200V
680 1020 nC
TJ = 25°C See Fig.
1400 2100
TJ = 125°C
16
di/dt = 200A/µs
250
—
A/µs TJ = 25°C See Fig.
320
—
TJ = 125°C
17
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IRG4PSH71KD
40
F o r b o th :
D u ty c y c le : 5 0 %
TJ = 1 2 5 ° C
T sink = 9 0 ° C
G a te d riv e a s s p e c ifie d
LOAD CURRENT (A)
30
P o w e r D is s ip a tio n = 58 W
S q u a re w a v e :
6 0% of rate d
volta ge
20
I
10
Id e a l d io d e s
0
0.1
1
10
100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
1000
100
TJ = 150 °C
TJ = 25 °C
10
V GE = 15V
80µs PULSE WIDTH
1
1.0
2.0
3.0
4.0
5.0
VCE , Collector-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
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I C , Collector-to-Emitter Current (A)
Ic , Collector-to-Emitter
Current(A)
(A)
I C , Collector Current
1000
TJ = 150 °C
10
TJ = 25 °C
V CC = 50V
5µs PULSE WIDTH
1
5
6
7
8
9
10
11
VGE , Gate-to-Emitter Voltage (V)
Fig. 3 - Typical Transfer Characteristics
3
IRG4PSH71KD
5.0
VCE , Collector-to-Emitter Voltage(V)
Maximum DC Collector Current(A)
80
60
40
20
50
75
100
125
150
I C = 84 A
3.0
I C = 42 A
I C = 21 A
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( ° C)
TC , Case Temperature ( °C)
Fig. 4 - Maximum Collector Current vs. Case
Temperature
4.0
2.0
-60 -40 -20
0
25
VGE = 15V
80 us PULSE WIDTH
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Thermal Response (ZthJC)
1
D = 0 .50
0.1
0 .20
PDM
0 .1 0
0.05
0.0 2
0.01
t
1
t2
SIN G L E PU L SE
(T HE R M A L R ES PO N SE )
Notes:
1. Duty factor D = t
1 / t2
2. Peak TJ = PDM x Z thJC + TC
0.01
0.0001
0.001
0.01
0.1
1
10
A
100
t 1 , R e ctang ular Pulse D uratio n (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PSH71KD
VGE = 0V,
f = 1MHz
Cies = Cge + Cgc , Cce SHORTED
Cres = Cgc
Coes = Cce + Cgc
C, Capacitance (pF)
8000
Cies
6000
4000
2000
Coes
20
VGE , Gate-to-Emitter Voltage (V)
10000
VCC = 400V
I C = 42A
15
10
5
Cres
0
1
10
0
100
0
VCE , Collector-to-Emitter Voltage (V)
Total Switching Losses (mJ)
Total Switching Losses (mJ)
100
V CC = 800V
V GE = 15V
TJ = 25 ° C
14
I C = 42A
13
12
11
10
9
20
30
40
RG , Gate Resistance (Ω)
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
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(Ω)
300
400
500
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
15
10
200
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
0
100
50
RG = 5.0 Ω
VGE = 15V
VCC = 800V
IC = 84 A
IC = 42 A
10
IC = 21 A
1
-60 -40 -20
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( °C )
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
5
IRG4PSH71KD
1000
= 5.0 Ω
= 150 ° C
= 800V
= 15V
I C , Collector Current (A)
RG
TJ
VCC
VGE
30
VGE = 20V
T J = 125 oC
100
20
10
10
SAFE OPERATING AREA
0
20
40
60
80
1
100
1
I C , Collector Current (A)
10
100
1000
10000
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
1000
Instantaneous forward current - IF (A)
Total Switching Losses (mJ)
40
100
TJ = 150°C
TJ = 125°C
TJ = 25°C
10
1
0.0
2.0
4.0
6.0
Forward Voltage Drop - VFM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4PSH71KD
300
100
I F = 84A
I F = 42A
I F = 21A
I F = 84A
I F = 42A
I F = 21A
Irr- ( A)
trr- (nC)
200
10
100
VR = 2 00V
T J = 12 5°C
T J = 25 °C
VR = 200 V
T J = 12 5°C
T J = 25 °C
0
100
di f /dt - (A/µ s)
1
100
1000
1000
di f /dt - (A/µ s )
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
10000
5000
VR = 2 00V
T J = 125°C
T J = 25°C
4000
I F = 84A
I F = 42A
Qrr- (nC)
3000
di (rec) M/dt- (A /µs)
I F = 84A
I F = 42A
I F = 21A
2000
IF = 21A
1000
1000
VR = 2 00V
T J = 1 2 5 °C
T J = 2 5 °C
0
100
di f /dt - (A/µ s)
1000
Fig. 16 - Typical Stored Charge vs. dif/dt
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100
100
1000
di f /dt - (A/µ s)
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
7
IRG4PSH71KD
90% Vge
Same ty pe
device as
D .U.T.
+Vge
V ce
430µF
80%
of Vce
D .U .T.
Ic
9 0 % Ic
10% Vce
Ic
5 % Ic
td (o ff)
tf
E o ff =
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1
∫
t1 + 5 µ S
V c e icIcd tdt
Vce
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O L T A G E D .U .T .
1 0 % +V g
trr
Q rr =
Ic
∫
trr
id
t
Ic ddt
tx
+Vg
tx
10% Vcc
1 0 % Irr
V cc
D UT VO LTAG E
AN D CU RRE NT
Vce
V pk
Irr
Vcc
1 0 % Ic
Ip k
9 0 % Ic
Ic
D IO D E R E C O V E R Y
W A V E FO R M S
tr
td (o n )
5% Vce
t1
∫
t2
ce ieIcd t dt
E on = V
Vce
t1
t2
E re c =
D IO D E R E V E R S E
REC OVERY ENER GY
t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
8
∫
t4
VVd
d idIc
d t dt
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
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IRG4PSH71KD
V g G A T E S IG N A L
D E V IC E U N D E R T E S T
C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
D.U.T.
L
1000V
Vc*
RL=
800V
4 X IC @25°C
0 - 800V
50V
6000µ F
100 V
Figure 19. Clamped Inductive Load Test Circuit
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Figure 20. Pulsed Collector Current
Test Circuit
9
IRG4PSH71KD
Notes:
 Repetitive rating: VGE=20V; pulse width limited by maximum junction
temperature (figure 20)
‚ VCC=80%(VCES), VGE=20V, L=10µH, RG= 5.0Ω (figure 19)
ƒ Pulse width ≤ 80µs; duty factor ≤ 0.1%
„ Pulse width 5.0µs, single shot
Case Outline and Dimensions — Super-247
Dimensions are shown in millimeters
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
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Data and specifications subject to change without notice.
5/99
10
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