MOTOROLA MRF393

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by MRF393/D
SEMICONDUCTOR TECHNICAL DATA
The RF Line
. . . designed primarily for wideband large–signal output and driver amplifier
stages in the 30 to 500 MHz frequency range.
• Specified 28 Volt, 500 MHz Characteristics —
Output Power = 100 W
Typical Gain = 9.5 dB (Class AB); 8.5 dB (Class C)
Efficiency = 55% (Typ)
100 W, 30 to 500 MHz
CONTROLLED “Q”
BROADBAND PUSH–PULL
RF POWER TRANSISTOR
NPN SILICON
• Built–In Input Impedance Matching Networks for Broadband Operation
• Push–Pull Configuration Reduces Even Numbered Harmonics
• Gold Metallization System for High Reliability
• 100% Tested for Load Mismatch
• Circuit board photomaster available upon request by
contacting RF Tactical Marketing in Phoenix, AZ.
2
6
5, 8
1, 4
7
3
CASE 744A–01, STYLE 1
The MRF393 is two transistors in a single package with separate base and collector leads
and emitters common. This arrangement provides the designer with a space saving
device capable of operation in a push–pull configuration.
PUSH–PULL TRANSISTORS
MAXIMUM RATINGS
Symbol
Value
Unit
Collector–Emitter Voltage
Rating
VCEO
30
Vdc
Collector–Base Voltage
VCBO
60
Vdc
Emitter–Base Voltage
VEBO
4.0
Vdc
Collector Current — Continuous
IC
16
Adc
Total Device Dissipation @ TC = 25°C (1)
Derate above 25°C
PD
270
1.54
Watts
W/°C
Storage Temperature Range
Tstg
– 65 to +150
°C
TJ
200
°C
Symbol
Max
Unit
RθJC
0.65
°C/W
Junction Temperature
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
NOTE:
1. This device is designed for RF operation. The total device dissipation rating applies only when the device is operated as an RF push–pull
amplifier.
REV 7
RF DEVICE DATA
MOTOROLA
Motorola, Inc. 1997
MRF393
1
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, IB = 0)
V(BR)CEO
30
—
—
Vdc
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, VBE = 0)
V(BR)CES
60
—
—
Vdc
Emitter–Base Breakdown Voltage (IE = 5.0 mAdc, IC = 0)
V(BR)EBO
4.0
—
—
Vdc
ICBO
—
—
5.0
mAdc
hFE
20
—
100
—
Cob
40
75
95
pF
Common–Emitter Amplifier Power Gain
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz)
Gpe
7.5
8.5
—
dB
Collector Efficiency
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz)
η
50
55
—
%
Load Mismatch
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz,
VSWR = 30:1, all phase angles)
ψ
OFF CHARACTERISTICS (1)
Collector Cutoff Current (VCB = 30 Vdc, IE = 0)
ON CHARACTERISTICS (1)
DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS (1)
Output Capacitance (VCB = 28 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS (2) — See Figure 1
No Degradation in Output Power
NOTES:
1. Each transistor chip measured separately.
2. Both transistor chips operating in push–pull amplifier.
L5
C10
C9
B1
+ 28 V
B2
L3
L1
C12
C11
C7
C1
Z3
Z5
Z1
C3
C5
C4
C6
Z2
Z4
C2
L2
Z6
C8
D.U.T.
L4
L6
C14
C13
C1, C2, C7, C8 — 240 pF 100 mil Chip Cap
C3 — 15 pF 100 mil Chip Cap
C4 — 24 pF 100 mil Chip Cap
C5 — 33 pF 100 mil Chip Cap
C6 — 12 pF 100 mil Chip Cap
C9, C13 — 1000 pF 100 mil Chip Cap
C10, C14 — 680 pF Feedthru Cap
C11, C15 — 0.1 µF Ceramic Disc Cap
C12, C16 — 50 µF 50 V
C15
C16
L1, L2 — 0.15 µH Molded Choke with Ferrite Bead
L3, L4 — 2–1/2 Turns #20 AWG 0.200″ ID
L5, L6 — 3–1/2 Turns #18 AWG 0.200″ ID
B1, B2 — Balun 50 Ω Semi Rigid Coax, 86 mil OD, 4″ Long
Z1, Z2 — 850 mil Long x 125 mil W. Microstrip
Z3, Z4 — 200 mil Long x 125 mil W. Microstrip
Z5, Z6 — 800 mil Long x 125 mil W. Microstrip
Board Material — 0.0325″ Teflon–Fiberglass, εr = 2.56,
Board Material — 1 oz. Copper Clad both sides.
Figure 1. 500 MHz Test Fixture
MRF393
2
MOTOROLA RF DEVICE DATA
CLASS C
80
225 MHz
140
400 MHz
120
500 MHz
100
80
60
40
20
0
Pout , OUTPUT POWER (WATTS)
Pout , OUTPUT POWER (WATTS)
f = 100 MHz
2
4
6
8
10
12
14
Pin, INPUT POWER (WATTS)
16
60
50
500 MHz
40
30
20
10
VCC = 28 V
0
225 MHz
400 MHz
f = 100 MHz
70
18
0
20
VCC = 13.5 V
0
Figure 2. Output Power versus Input Power
2
4
6
8
10
12
14
Pin, INPUT POWER (WATTS)
16
18
20
Figure 3. Output Power versus Input Power
CLASS C
120
120
Pin = 16 W
8W
100
6W
80
60
40
Pout , OUTPUT POWER (WATTS)
Pout , OUTPUT POWER (WATTS)
Pin = 10 W
100
12 W
80
8W
60
40
f = 225 MHz
20
12
16
20
24
VCC, SUPPLY VOLTAGE (VOLTS)
f = 500 MHz
20
28
12
Figure 4. Output Power versus Supply Voltage
f = 100 MHz
ZOL* = Conjugate of the optimum load impedance
ZOL* = into which the device output operates at a
2 ZOL* = given output power, voltage and frequency.
4
225
2
400
Zin
4
ZOL*
225
6
500
500
6
Zo = 20 Ω
f = 100 MHz
8
8
400
VCC = 28 V, Pout = 100 W
f MHz
Zin
ZOL*
100
225
400
500
0.85 + j0
0.58 + j2.6
3.00 + j5.9
4.80 + j3.0
7.8 – j5.6
5.0 – j3.2
3.2 – j0.6
2.9 + j1.2
140
120
100
80
60
40
Figure 6. Series Equivalent Input/Output Impedance
MOTOROLA RF DEVICE DATA
f = 500 MHz
VCC = 28 V
ICQ = 200 mA
20
0
NOTE: Zin & ZOL* are given from base–to–base
NOTE: and collector–to–collector respectively.
28
Figure 5. Output Power versus Supply Voltage
Pout , OUTPUT POWER (WATTS)
2
4
16
20
24
VCC, SUPPLY VOLTAGE (VOLTS)
0
2
4
6
8
10
12
14
Pin, INPUT POWER (WATTS)
16
18
20
Figure 7. Class AB Output Power versus
Input Power
MRF393
3
PACKAGE DIMENSIONS
U
M
Q
0.76 (0.030)
M
A
M
4 PL
B
M
1
2
3
K
4
R
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
U
V
–B–
5
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
6
7
K
8
4 PL
F
V
4 PL
2 PL
L
G
–A–
J
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N
C
H
E
–T–
MILLIMETERS
MIN
MAX
22.60
23.11
9.52
10.03
6.65
7.16
1.60
1.95
2.94
3.40
2.87
3.22
16.51 BSC
4.01
4.36
0.07
0.15
4.34
4.90
12.45
12.95
45_NOM
1.051
11.02
3.04
3.35
9.90
10.41
1.02
1.27
0.64
0.89
INCHES
MIN
MAX
0.890
0.910
0.375
0.395
0.262
0.282
0.063
0.077
0.116
0.134
0.113
0.127
0.650 BSC
0.158
0.172
0.003
0.006
0.171
0.193
0.490
0.510
45_NOM
0.414
0.434
0.120
0.132
0.390
0.410
0.040
0.050
0.025
0.035
EMITTER (COMMON)
COLLECTOR
COLLECTOR
EMITTER (COMMON)
EMITTER (COMMON)
BASE
BASE
EMITTER (COMMON)
SEATING
PLANE
CASE 744A–01
ISSUE C
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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MRF393
4
◊
*MRF393/D*
MRF393/D
MOTOROLA RF DEVICE
DATA