STMICROELECTRONICS CPL-WB-00D3

CPL-WB-00D3
Wide band directional coupler with ISO port
Features
■
50 Ω nominal input / output impedance
■
Wide operating frequency range
(824 MHz to 2170 MHz)
■
Low Insertion Loss (< 0.2 dB)
■
34 dB typical coupling factor
■
High directivity (typical 25 dB)
■
High ESD robustness
(IEC 61000-4-2 Level 4)
■
Flip-Chip package
■
Small footprint: 1300 x 1000 µm
Figure 1.
Benefits
■
Very low profile (< 690 µm)
■
Lead-free package
■
High RF performance
■
RF module size reduction
Pin configuration (top view)
3
2
RFOUT GND
1
RFIN
A
ATN.
ATN.
B
ISO
GND
CPLD
Applications
■
Quad band power amplifier module
■
Quad band front end module
Description
■
GSM / WCDMA mobile phone
The CPL-WB-00D3 is a wide band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA / TD-SCDMA
applications. This CPL has been customized for
wide band operating frequencies (EGSM and
CELL, PCS, DCS, TD-SCDMA, WCDMA Band I)
with less than 0.2 dB insertion losses in the
transmit bandwidth (824 MHz to 2170 MHz).
The CPL-WB-00D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
April 2011
Doc ID 018753 Rev 1
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www.st.com
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Characteristics
CPL-WB-00D3
1
Characteristics
Table 1.
Absolute maximum rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Input Power RFIN
Max.
35
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots
with both polarities and each condition, cumulative method)
VESD (IEC) ISO and CPLD pins connected to ground:
RFIN, RFOUT, air discharge
RFIN, RFOUT, contact discharge
VESD (HBM) Human body model, JESD22-A114F, all I/O
dBm
kV
kV
±15
±8
2
kV
VESD (MM) Machine model, JESD22-A115-A, all I/O
100
V
VESD (CDM) Charge device model, JESD22-C101-C, all I/O
500
V
TOP
Table 2.
Operating temperature
-30
+85
ºC
Electrical characteristics (Tamb = 25 °C) - impedances
Value
Symbol
Parameter
Unit
Min.
Typ.
Max.
Nominal output impedance
50
Ω
Nominal input impedance
50
Ω
ZCPLD
Nominal coupling impedance
50
Ω
ZOUT
Nominal ISO impedance
50
Ω
ZOUT
ZIN
Table 3.
Electrical characteristics (Tamb = 25 °C) - RF performance
Value
Symbol
Parameter
Test condition
Unit
Min.
2/8
Typ.
Max.
f
Frequency range
(bandwidth)
IL
Insertion loss in bandwidth From 824 MHz to 2170 MHz
RL
Return loss in bandwidth
From 824 MHz to 2170 MHz
15
Coupling factor (including
attenuator)
From 824 MHz to 915 MHz
35
39
dB
CPLD
From 1710 MHz to 2025 MHz
28
33
dB
0.5
dB
824
Ripple
Coupling ripple in
individual band
(824 to 849 MHz) (880 to 915 MHz)
(1710 to 1785 MHz) (1850 to
1910 MHz) (1880 to 2025 MHz)
(1920 to 1980 MHz)
DIR
Coupler directivity
From 824 MHz to 2025 MHz
Doc ID 018753 Rev 1
0.1
20
2170
MHz
0.2
dB
dB
25
dB
CPL-WB-00D3
1.1
Characteristics
RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at
CPL-WB-00D3 bumps.
Figure 2.
Insertion loss
dB
-0.0
-0.05
-0.1
-0.15
-0.2
-0.25
F (MHz)
-0.3
Figure 3.
824
959 1093 1228 1362 1497 1632 1766 1901 2035 2170
Coupling and isolation
-26
dB
-28
-30
-32
-34
-36
-38
-40
7.0E8
Figure 4.
F (Hz)
9.0E8
1.1E9
1.3E9
1.5E9
1.7E9
1.9E9
2.1E9
2.3E9
2.5E9
Directivity
34
32
30
28
26
24
22
20
F (Hz)
18
8.0E8
1.0E9
1.2E9
1.4E9
1.6E9
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1.8E9
2.0E9
2.2E9
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Reference evaluation board
2
Reference evaluation board
Figure 5.
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CPL-WB-00D3
CPW lines (W = 127 µm with gap to gnd = 100 µm) on top layer + GND on
layer 2
●
Material: 4 layers FR4 with solder mask on top and bottom layer
●
Substrate thickness: 0.8 mm
●
Line lengths: 14.3 mm
●
TRL cal kit available
Doc ID 018753 Rev 1
CPL-WB-00D3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 6.
Package dimensions (bump side)
630 µm ± 60 µm
255 µm
1.3 mm ± 50µm
595 µm
450 µm
3
Package information
1.0 mm ± 50 µm
Figure 7.
Footprint
Figure 8.
Marking
Dot, ST logo
= ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Copper pad Diameter:
220 µm recommended,
260 µm max
Solder stencil opening: 220 µm
Solder mask opening :
320 µm recommendation
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x x z
y ww
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Package information
Figure 9.
CPL-WB-00D3
Flip Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
8.0
3.5
1.4
1.75
0.22
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
1.1
4.0
0.71
All dimensions are typical values in mm
Note:
User direction of unreeling
More information is available in the application note:
AN1235: “Flip Chip: package description and recommendations for use”
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CPL-WB-00D3
4
Ordering information
Ordering information
Table 4.
5
Ordering information
Order code
Marking
Base qty
Delivery mode
CPL-WB-00D3
RX
5000
Tape and reel
Revision history
Table 5.
Document revision history
Date
Revision
21-Apr-2010
1
Changes
Initial release.
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CPL-WB-00D3
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