FAIRCHILD FDP39N20_07

TM
UniFET
FDP39N20 / FDPF39N20
200V N-Channel MOSFET
Features
Description
• 39A, 200V, RDS(on) = 0.066Ω @VGS = 10 V
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
• Low gate charge ( typical 38 nC)
• Low Crss ( typical 57 pF)
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies and active power factor
correction.
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
D
G
G DS
TO-220F
TO-220
GD S
FDP Series
FDPF Series
S
Absolute Maximum Ratings
Symbol
Parameter
FDP39N20
VDSS
Drain-Source Voltage
ID
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM
Drain Current
- Pulsed
VGSS
Gate-Source voltage
EAS
Single Pulsed Avalanche Energy
IAR
FDPF39N20
200
V
39
23.4
(Note 1)
Unit
39 *
23.4 *
156
156 *
A
A
A
±30
V
(Note 2)
860
mJ
Avalanche Current
(Note 1)
39
A
EAR
Repetitive Avalanche Energy
(Note 1)
25.1
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
(TC = 25°C)
- Derate above 25°C
251
2.0
59
0.48
W
W/°C
-55 to +150
°C
300
°C
* Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FDP39N20
FDPF39N20
Unit
RθJC
Thermal Resistance, Junction-to-Case
0.5
2.1
°C/W
RθCS
Thermal Resistance, Case-to-Sink Typ.
0.5
-
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
62.5
62.5
°C/W
©2007 Fairchild Semiconductor Corporation
FDP39N20 / FDPF39N20 Rev. A
1
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
March 2007
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FDP39N20
FDP39N20
TO-220
-
-
50
FDPF39N20
FDPF39N20
TO-220F
-
-
50
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Conditions
Min.
Typ.
Max Units
200
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250µA
∆BVDSS
/ ∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250µA, Referenced to 25°C
--
0.2
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 200V, VGS = 0V
VDS = 160V, TC = 125°C
---
---
1
10
µA
µA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30V, VDS = 0V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30V, VDS = 0V
--
--
-100
nA
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
3.0
--
5.0
V
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10V, ID = 19.5A
--
0.056
0.066
Ω
gFS
Forward Transconductance
VDS = 40V, ID = 19.5A
--
28.5
--
S
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
--
1640
2130
pF
--
400
520
pF
--
57
85
pF
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = 100V, ID = 39A
RG = 25Ω
(Note 4, 5)
VDS = 160V, ID = 39A
VGS = 10V
(Note 4, 5)
--
30
70
ns
--
160
330
ns
--
150
310
ns
--
150
310
ns
--
38
49
nC
--
11
--
nC
--
16.5
--
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
39
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
156
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0V, IS = 39A
--
--
1.4
V
trr
Reverse Recovery Time
152
--
ns
Reverse Recovery Charge
VGS = 0V, IS = 39A
dIF/dt =100A/µs
--
Qrr
--
1.1
--
µC
(Note 4)
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 0.85mH, IAS = 39A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 39A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
FDP39N20 / FDPF39N20 Rev. A
2
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
2
10
2
Top :
1
10
ID, Drain Current [A]
ID, Drain Current [A]
Figure 2. Transfer Characteristics
10
0
10
1
10
o
150 C
o
25 C
o
-55 C
※ Notes :
1. VDS = 40V
2. 250µ s Pulse Test
※ Notes :
1. 250µ s Pulse Test
2. TC = 25℃
0
-1
0
10
10
1
10
10
2
4
6
8
10
12
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
0.14
2
IDR, Reverse Drain Current [A]
RDS(ON) [Ω ],
Drain-Source On-Resistance
10
0.12
0.10
VGS = 10V
0.08
0.06
VGS = 20V
0.04
※ Note : TJ = 25
1
10
150℃
25℃
※ Notes :
1. VGS = 0V
2. 250µ s Pulse Test
0
0
25
50
75
100
10
125
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VSD, Source-Drain voltage [V]
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
12
4000
VGS, Gate-Source Voltage [V]
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Capacitances [pF]
Coss
Ciss
2000
※ Note ;
1. VGS = 0 V
2. f = 1 MHz
Crss
VDS = 40V
10
VDS = 100V
VDS = 160V
8
6
4
2
※ Note : ID = 39A
0
-1
10
0
10
0
1
10
FDP39N20 / FDPF39N20 Rev. A
0
10
20
30
40
50
60
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
3
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
1.1
1.0
※ Notes :
1. VGS = 0 V
2. ID = 250 µ A
0.9
0.8
-100
-50
0
50
100
150
2.5
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
2.0
1.5
1.0
※ Notes :
1. VGS = 10 V
2. ID = 19.5 A
0.5
0.0
-100
200
-50
0
50
100
o
TJ, Junction Temperature [ C]
Figure 9-1. Maximum Safe Operating Area
- FDP39N20
ID, Drain Current [A]
ID, Drain Current [A]
100 µs
1 ms
10 ms
100 ms
DC
Operation in This Area
is Limited by R DS(on)
0
10
※ Notes :
-1
1 ms
10 ms
1
10
100 ms
Operation in This Area
is Limited by R DS(on)
DC
0
10
※ Notes :
-1
o
1. TC = 25 C
10
o
1. TC = 25 C
10
10 µs
2
10
100 µs
1
o
2. TJ = 150 C
3. Single Pulse
o
2. TJ = 150 C
3. Single Pulse
-2
-2
10
200
Figure 9-2. Maximum Safe Operating Area
- FDPF39N20
10 µs
2
10
10
150
o
TJ, Junction Temperature [ C]
10
0
1
10
2
10
0
10
10
1
10
2
10
VDS, Drain-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 10. Maximum Drain Currentvs. Case Temperature
40
ID, Drain Current [A]
30
20
10
0
25
50
75
100
125
150
TC, Case Temperature [℃]
FDP39N20 / FDPF39N20 Rev. A
4
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Typical Performance Characteristics (Continued)
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Zθ JC(t), Thermal Response
Figure 11-1. Transient Thermal Response Curve - FDP39N20
D = 0 .5
10
0 .2
-1
※ N o te s :
1 . Z θ J C( t) = 0 .5 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C( t)
0 .1
0 .0 5
PDM
0 .0 2
0 .0 1
10
t1
-2
s in g le p u ls e
10
-5
10
-4
10
-3
10
-2
10
t2
-1
10
0
10
1
10
1
t 1 , S q u a r e W a v e P u ls e D u r a tio n [ s e c ]
Figure 11-2. Transient Thermal Response Curve - FDPF39N20
Zθ JC(t), Thermal Response
10
D = 0 .5
0
0 .2
0 .1
10
※ N o te s :
1 . Z θ J C( t) = 2 .1 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C( t)
0 .0 5
-1
0 .0 2
PDM
0 .0 1
t1
10
-2
10
t2
s in g le p u ls e
-5
10
-4
10
-3
10
-2
10
-1
10
0
t 1 , S q u a r e W a v e P u ls e D u r a tio n [ s e c ]
FDP39N20 / FDPF39N20 Rev. A
5
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP39N20 / FDPF39N20 Rev. A
6
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FDP39N20 / FDPF39N20 Rev. A
7
www.fairchildsemi.com
TO-220
4.50 ±0.20
2.80 ±0.10
(3.00)
+0.10
1.30 –0.05
18.95MAX.
(3.70)
ø3.60 ±0.10
15.90 ±0.20
1.30 ±0.10
(8.70)
(1.46)
9.20 ±0.20
(1.70)
9.90 ±0.20
1.52 ±0.10
10.08 ±0.30
(1.00)
13.08 ±0.20
)
(45°
1.27 ±0.10
0.80 ±0.10
2.54TYP
[2.54 ±0.20]
+0.10
0.50 –0.05
2.40 ±0.20
2.54TYP
[2.54 ±0.20]
10.00 ±0.20
FDP39N20 / FDPF39N20 Rev. A
8
www.fairchildsemi.com
FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Mechanical Dimensions
3.30 ±0.10
TO-220F
10.16 ±0.20
2.54 ±0.20
ø3.18 ±0.10
(7.00)
(1.00x45°)
15.87 ±0.20
15.80 ±0.20
6.68 ±0.20
(0.70)
0.80 ±0.10
)
0°
(3
9.75 ±0.30
MAX1.47
#1
+0.10
0.50 –0.05
2.54TYP
[2.54 ±0.20]
2.54TYP
[2.54 ±0.20]
9.40 ±0.20
FDP39N20 / FDPF39N20 Rev. A
2.76 ±0.20
4.70 ±0.20
0.35 ±0.10
9
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FDP39N20 / FDPF39N20 200V N-Channel MOSFET
Mechanical Dimensions
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properly used in accordance with instructions for use provided in
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I22
10
FDP39N20 / FDPF39N20 Rev. A
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FDP39N20 / FDPF39N20 200V N-Channel MOSFET
TRADEMARKS