SUPERWORLD L815PW

HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
1. PART NO. EXPRESSION :
L815PW-1R0MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(d) Tolerance code : M = ±20%
(b) Type code
(e) F : Lead Free
(c) Inductance code : 1R0 = 1.0uH
2. CONFIGURATION & DIMENSIONS :
A'
C'
A
C
D
L
E
B'
B
SWORLD
R33
H
G
PCB Pattern
Unit:m/m
A'
A
B'
B
C'
C
D
E
G
H
L
7.8 Max.
6.86±0.5
7.0 Max.
6.47±0.5
4.2 Max.
4.0 Max.
1.6±0.5
2.1±0.5
3.7 Ref.
3.5 Ref.
8.7 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
(a) Core
(b) Wire
(c) Terminal
c
5. FEATURES :
a) Shielded Construction
b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
6. GENERAL SPECIFICATION :
a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC
b) Ambient Temp. : 20°C
c) Operating Temp. : -55°C to +125°C
d) Storage Temp. : -55°C to +125°C
e) Humidity Range : 50 ~ 60% RH
f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss.
g) Saturation Current (Isat) : Will cause L0 to drop approximately 20% typ.
h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Part No.
Inductance L 0
( µH )
±20% @ 0 Adc
Irms
(A)
Typ.
Isat
(A)
Typ.
DCR
( mȍ )
Max.
Q
Min.
L815PW-R33MF
0.33
25
32
1.4
15
L815PW-R47MF
0.47
20
30
2.5
15
L815PW-R68MF
0.68
17
28
3.8
15
L815PW-1R0MF
1.0
15
20
5.8
15
L815PW-1R5MF
1.5
16
18
8.4
15
L815PW-2R2MF
2.2
12
14
15
15
L815PW-3R3MF
3.3
10
13
18
15
L815PW-4R7MF
4.7
7
9
21
15
L815PW-6R8MF
6.8
5.5
7
30
15
L815PW-100MF
10.0
4.5
5
60
15
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
8. CHARACTERISTICS CURVES :
L815PW-R33MF
SMPI0604PW -R33
SL815PW-R47MF
MPI0604PW-R47
100
100
0.6
90
90
0.5
70
0.3
60
50
0.2
40
30
0.1
INDUCTANCE (uH)
80
TEM P. RISE(oC)
INDUCTANCE (uH)
0.4
20
80
70
0.4
60
50
0.3
40
0.2
30
20
0.1
10
10
0
0
0
0
7.2
14.4
21.6
28.8
TEM P. RISE(oC)
0.5
0
0
36
6
12
18
24
30
DC CURRENT(A)
DC CURRENT(A)
L815PW-1R0MF
S MPI0604PW-1R0
100
90
90
0.4
50
40
30
IND UCT ANCE (uH )
60
TEMP. RISE(oC)
70
80
1.2
80
0.6
0.2
70
60
0.9
50
40
0.6
30
0.3
20
20
10
10
0
0
0
7
14
21
0
0
28
4.8
9.6
14.4
19.2
24
DC CURRENT(A)
DC CURRENT(A)
L815PW-2R2MF
SMPI0604PW -2R2
L815PW-1R5MF
S MPI0604PW-1R5
2
3
100
100
90
90
1.5
70
60
1
50
40
30
0.5
20
INDUCTANCE (uH)
2.4
TEM P. RISE(oC)
INDUCTANCE (uH)
80
80
70
1.8
60
50
1.2
40
30
0.6
20
10
0
0
0
3.6
7.2
10.8
DC CURRENT(A)
14.4
18
TEM P. RISE(oC)
0
T EM P. R ISE( o C)
0.8
INDUCTANCE (uH)
100
1.5
SMPI0604PW
-R68
L815PW-R68MF
10
0
0
0
3.6
7.2
10.8
14.4
18
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
8. CHARACTERISTICS CURVES :
L815PW-4R7MF
S
MPI0604PW-4R7
S L815PW-3R3MF
MPI0604PW-3R3
100
7
100
90
60
2.4
50
40
1.6
30
INDUCT ANCE (uH)
70
5.6
TEM P. RISE(oC)
20
0.8
80
70
4.2
60
50
2.8
40
30
1.4
20
10
0
10
0
0
2.6
5.2
7.8
10.4
0
13
0
0
DC CURRENT(A)
1.8
3.6
5.4
7.2
9
DC CURRENT(A)
S
MPI0604PW-100
L815PW-100MF
SMPI0604PW
-6R8
L815PW-6R8MF
10
15
100
100
90
90
12
70
6
60
50
4
40
30
2
20
INDUCTANCE (uH)
80
TEM P. RISE(oC)
INDUCTANCE (uH)
8
80
70
9
60
50
6
40
30
3
20
10
10
0
0
0
2
4
6
8
TEM P. RISE(oC)
INDUCTANCE (uH)
90
80
3.2
T EM P. RISE( o C)
4
0
0
0
1
DC CURRENT(A)
2
3
4
5
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
9. CORE LOSS :
100KHz and 500KHz
40000
material
gauss loss
K
W
/3m3
K
W
/m
30000
20000
500KHZ
10000
100KHZ
0
0
200
400
600
800
1000
gauss
gauss
100KHz
500KHz
100
-
266
200
-
1,234
300
351.7
2,932
400
665.9
5,195
500
1,039
8,336
600
1,471
12,025
700
1,923
15,715
800
2,537
20,444
900
3,148
25,429
1000
3,902
31,002
100KHz
4000
material
gauss loss
KKW
/3m3
W
/m
3000
2000
1000
0
200
400
600
800
1000
gau ss
gauss
100KHz
300
351.7
400
665.9
500
1,039
600
1,471
700
1,923
800
2,537
900
3,148
1000
3,902
500KHz
40000
KW
W
/m
K
/m
3
3
30000
20000
10000
0
0
200
400
600
800
1000
g au ss
gauss
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
10. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Inductance
Refer to standard electrical characteristics list
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
DCR
CH16502, Agilent33420A Micro-Ohm Meter.
Heat Rated Current (Irms)
Irms(A) will cause the coil temperature rise
approximately ǻT=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 20% typ.
Mechanical Performance Test
Solderability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 230±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Preheating Dipping
230°C
150°C
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
60
seconds
Natural
cooling
4±1
seconds
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating
Dipping
260°C
150°C
60
seconds
Natural
cooling
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Low Temperature
Life Test
1. Appearance : No damage
Thermal Shock
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : -55±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Conditions of 1 cycle.
Step
Temperature (°C)
1
-55±3
30±3
2
Room Temperature
Within 3
Times (min.)
3
+125±3
30±3
4
Room Temperature
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
11. SOLDERIND AND MOUNTING :
11-1. Recommended PC Board Pattern
3.7
2.5
3.5
2.5
11-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
11-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
11-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Soldering
10s max.
Natural
cooling
250~260
230
180
150
60~120s
30~60s
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
350
Soldering
Natural
cooling
300
150
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
12. PACKAGING INFORMATION :
12-1. Reel Dimension
COVER TAPE
ØC
B
D
2.0±0.5
A
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
13" x 16mm
16.0±0.5
100±2.0
13.5±0.5
330
Ø1.5+0.1
2.0±0.1
t
P
0.15 MIN
Bo
W
F
4.0±0.1
1.75±0.1
12-2 Tape Dimension
Ko
Ao
Series
Ao(mm)
Bo(mm)
Ko(mm)
P(mm)
W(mm)
F(mm)
t(mm)
L815PW
7.0±0.1
7.8±0.1
4.3±0.1
12.0±0.1
16.0±0.3
7.5±0.1
0.35±0.05
12-3. Packaging Quantity
Size
L815PW
Chip / Reel
1000
Inner Box
2000
Carton
8000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
HIGH CURRENT MOLDED POWER INDUCTORS
L815PW SERIES
12-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 30°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9