FREESCALE MPX2300DT1_12

Pressure
MPX2300DT1
Rev 9, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
High Volume Pressure Sensor
for Disposable Applications
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer. This new
chip carrier package uses Freescale Semiconductor's unique sensor die with its
piezoresistive technology, along with the added feature of on-chip, thin-film
temperature compensation and calibration.
NOTE:Freescale Semiconductor is also offering the Chip Pak package in
application-specific configurations, which will have an “SPX” prefix,
followed by a four-digit number, unique to the specific customer
Pressure Sensors
0 to 300 mmHg
(0 to 40 kPa)
Application Examples
•
•
•
•
•
Features
•
•
•
•
•
MPX2300DT1
MPX2301DT1
Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (ISO 10993)
Provided in Easy-to-Use Tape and Reel
Medical Diagnostics
Infusion Pumps
Blood Pressure Monitors
Pressure Catheter Applications
Patient Monitoring
ORDERING INFORMATION
Device Name
Package Options
MPX2300DT1
MPX2301DT1
Tape and Reel
Tape and Reel
Case
No.
423A
423A
Gauge
Pressure Type
Differential
•
•
Absolute
Device Marking
Date Code, Lot ID
Date Code, Lot ID
CHIP PAK PACKAGE
MPX2300DT1/MPX2301DT1
CASE 423A-03
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
Table 1. Pin Numbers
Pin Number
1
2
3
4
Description
Vs
S+
S-
GND
© 2005, 2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
The MPX2300DT1/MPX2301DT1 Pressure Sensors have
been designed for medical usage by combining the
performance of Freescale's shear stress pressure sensor
design and the use of biomedically approved materials.
Materials with a proven history in medical situations have
been chosen to provide a sensor that can be used with
confidence in applications, such as invasive blood pressure
monitoring. It can be sterilized using ethylene oxide. The
portions of the pressure sensor that are required to be
biomedically approved are the rigid housing and the gel
coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: 10993-5:1999, 10993-10:2002, and 1099311:1993.
A silicone dielectric gel covers the silicon piezoresistive
sensing element. The gel is a nontoxic, nonallergenic
elastomer system which meets all USP XX Biological Testing
Class V requirements. The properties of the gel allow it to
transmit pressure uniformly to the diaphragm surface, while
isolating the internal electrical connections from the corrosive
effects of fluids, such as saline solution. The gel provides
electrical isolation sufficient to withstand defibrillation testing,
as specified in the proposed Association for the
Advancement of Medical Instrumentation (AAMI) Standard
for blood pressure transducers. A biomedically approved
opaque filler in the gel prevents bright operating room lights
from affecting the performance of the sensor. The
MPX2301DT1 is a reduced gel option.
MPX2300DT1
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (Backside)
Pmax
125
PSI
Storage Temperature
Tstg
-25 to +85
C
Operating Temperature
TA
+15 to +40
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Operating Characteristics
Table 3. Operating Characteristics (VS = 6 Vdc, TA = 25°C unless otherwise noted)
Characteristics
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
—
300
mmHg
Supply Voltage(1)
VS
—
6.0
10
Vdc
Supply Current
Io
—
1.0
—
mAdc
Voff
-0.75
—
0.75
mV
Zero Pressure Offset
Sensitivity
Full Scale Span(2)
Linearity + Hysteresis
(3)
Accuracy VS = 6 V, P = 101 to 200 mmHg
Accuracy VS = 6 V, P = 201 to 300 mmHg
—
4.95
5.0
5.05
V/V/mmHg
VFSS
2.976
3.006
3.036
mV
—
-1.5
—
1.5
%VFSS
—
-1.5
—
1.5
%
—
-3.0
—
3.0
%
TCS
-0.1
—
+0.1
%/C
TCVFSS
-0.1
—
+0.1
%/C
TCVoff
-9.0
—
+9.0
V/C
Input Impedance
Zin
1800
—
4500

Output Impedance
Zout
270
—
330

RCAL (150 k)(6)
RCAL
97
100
103
mmHg
tR
—
1.0
—
ms
—
0
—
85
C
—
—
0.5
—
%VFSS
Temperature Effect on Sensitivity
Temperature Effect on Full Scale Span(4)
(5)
Temperature Effect on Offset
Response Time
(10% to 90%)
(7)
Temperature Error Band
(8)
Stability
1. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may
induce additional error due to device self-heating.
2. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference
between full scale output and zero pressure offset.
3. Maximum deviation from end-point straight line fit at 0 and 200 mmHg.
4. Slope of end-point straight line fit to full scale span at 15°C and +40°C relative to +25°C.
5. Slope of end-point straight line fit to zero pressure offset at 15°C and +40°C relative to +25°C.
6. Offset measurement with respect to the measured sensitivity when a 150 kresistor is connected to VS and S+ output.
7. For a 0 to 300 mmHg pressure step change.
8. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10C to +85C after:
• 1000 temperature cycles, -40°C to +125°C.
• 1.5 million pressure cycles, 0 to 300 mmHg.
MPX2300DT1
Sensors
Freescale Semiconductor, Inc.
3
Pressure
PACKAGE DIMENSIONS
A
M
C
L
F
N
B
1 2 3
4
V
K
DETAIL A
-T-
D1
G
J
H
FRONT VIEW
E
END VIEW
AC
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
AA
AB
AD
D2
DETAIL A
BACK VIEW
DIM
A
B
C
D1
D2
E
F
G
H
J
K
L
M
N
V
AA
AB
AC
AD
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.240
0.260
6.10
6.60
0.350
0.370
8.89
9.40
0.140
0.150
3.56
3.81
0.012
0.020
0.30
0.51
0.014
0.022
0.36
0.56
0.088
0.102
2.24
2.59
0.123
0.128
3.12
3.25
0.045
0.055
1.14
1.40
0.037
0.047
0.94
1.19
0.007
0.011
0.18
0.28
0.120
0.140
3.05
3.56
0.095
0.105
2.41
2.67
0.165
0.175
4.19
4.45
0.223
0.239
5.66
6.07
0.105
0.115
2.67
2.92
0.095
0.107
2.41
2.72
0.015
0.035
0.38
0.89
0.120
0.175
3.05
4.45
0.100
0.115
2.54
2.92
STYLE 1:
PIN 1.
2.
3.
4.
VCC
+OUT
-OUT
GROUND
CASE 423A-03
ISSUE C
CHIP PAK PACKAGE
MPX2300DT1
4
Sensors
Freescale Semiconductor, Inc.
Pressure
Table 4. Revision History
Revision
number
Revision
date
9
10/2012
Description of changes
• Added Table 1. Pin Numbers on page 1.
MPX2300DT1
Sensors
Freescale Semiconductor, Inc.
5
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© 2012 Freescale Semiconductor, Inc.
MPX2300DT1
Rev. 9
10/2012