FREESCALE MRFIC1505AR2

Freescale Semiconductor
Technical Data
MRFIC1505
Rev. 1, 08/2004
MRFIC1505/MRFIC1505A Integrated GPS
Downconverter
1.575 GHz GPS DOWNCONVERTER
This integrated circuit is intended for GPS receiver applications. The dual conversion design is implemented in Motorola’s
low–cost, high–performance MOSAIC 5. silicon bipolar process and is packaged in a low–cost surface mount LQFP–48 package.
In addition to the mixers, a VCO, PLL, Crystal Oscillator, A/D converter and a loop filter are integrated on–chip. Output IF is
nominally 4.1 MHz.
•
105 dB Typical Conversion Gain
•
2.7 V Operation
•
28 mA Typical Current Consumption
•
Low–Cost, Low–Profile Plastic LQFP Package
MOSAIC 5 is a trademark of Motorola, Inc.
Ordering Information
Operating Temperature
Range
Package
MRFIC1505R2
TA = –40 to 85°C
LQFP-48
MRFIC1505AR2
TA = –40 to 85°C
LQFP-48
Device
© Freescale Semiconductor, Inc., 2004. All rights reserved.
Plastic Package
Case 932
(LQFP-48)
Maximum Ratings
Symbol
Value
Unit
DC Supply Voltage
Rating
VDD
5.0
Vdc
DC Supply Current
IDD
60
mA
Operating Ambient Temperature
TA
–40 to 85
°C
Tstg
–65 to 150
°C
–
260
°C
Storage Temperature Range
Lead Soldering Temperature Range
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics tables.
Electrical Characteristics (VCC = 2.7 to 3.3 V; TA = –40 to 85°C; Enable = 2.7 V unless otherwise noted)
Characteristic
Total Device
Supply Voltage
Supply Current
(TA = 25°C, VCC = 2.7 V, Enable = 2.7V)
Supply Current
(TA = 25°C, VCC = 2.7 V, Enable = 2.7V)
RF Amplifier
RF Input Frequency
Input Impedance
Input VSWR
Gain
Noise Figure
1.0 dB Compression (Measured at Output)
First Mixer
Input Frequency
Gain
Noise Figure
1.0 dB compression (Measured at Output)
First Local Oscillator Frequency
First Intermediate Frequenc
LO Leakage at IF Port
LO Leakage at RF Port
Output Impedance
First IF Amplifier and Second Mixer
Input Frequency
Input Impedance
Output Impedance
Second Local Oscillator Frequency
Second Intermediate Frequency
LO Leakage at IF Port
Gain
Cascaded Noise Figure
1.0 dB Compression Point (Measured at Output)
Limiting Amplifier
Second Intermediate Frequency
Input Signal Level
Output Voltage Swing (into 10 pf ll100 kΩ
DC Output Level
Gain
Reference Oscillator
Reference Frequency
Reference Frequency Input Level (Crystal Output Pin)
2
Symbol
Min
Typ
Max
Unit
VCC
2.7
3.0
3.3
V
ICC
–
28
36
mA
ICC
–
2.0
4.0
mA
fin
Zin
VSWRin
G
NF
P1dB
–
–
–
13
–
–
1575.42
50
2.0
15
2.0
1.0
–
–
–
–
–
–
MHz
Ω
–
dB
dB
dBm
fin
G
NF
P1dB
fLO1
fIF1
–
–
Zout
–
10
–
–
–
–
–
–
–
1575.42
14
13
-13
1636.8
61.38
-40
-50
50
–
–
–
–
–
–
–
–
–
MHz
dB
dB
dBm
MHz
MHz
dBm
dBm
Ω
fin
Zin
Zout
fLO2
fIF2
–
G
NF
P1dB
–
–
–
–
–
–
40
–
–
61.38
230
50
65.47
4.092
-40
43
9.3
-13
–
–
–
–
–
–
–
–
–
MHz
Ω
Ω
MHz
MHz
dBm
dB
dB
dBm
fIF2
–
Vout
–
G
–
4.0
800
–
–
4.092
11
–
1.4
50
–
31
–
–
–
MHz
Mv
mVpp
V
dB
fr
–
–
–
16.368
500
–
–
MHz
mVpp
Freescale Semiconductor
Electrical Characteristics (VCC = 2.7 to 3.3 V; TA = –40 to 85°C; Enable = 2.7 V unless otherwise noted)
Characteristic
Reference Oscillator Output Voltage Level (Into 15 pf II 10 kΩ)
Reference Clock Input Drive Level
PLL
First Local Oscillator Frequency
Second Local Oscillator Frequency
VCO C/N (at 10 kHz Offset)
VCO Gain (TBD Varactor)
Enable
Enable Active Level
Disable Active Level
Voltage Regulator
Regulator Output Voltage
(VCC = 2.7 to 3.3 V, Iout = 3.0 mA)
MRFIC505 Temperature Sense Specs
Temperature Sensor Output Voltage @ 25°C
Temperature Sensor Slope over Temperature
MRFIC505A Temperature Sense Specs
Temperature Sensor Output Voltage @ 25°C
Temperature Sensor Slope over Temperature
Freescale Semiconductor
Symbol
–
–
Min
750
400
Typ
–
800
Max
–
1500
Unit
mVpp
mVpp
fLO1
fLO2
–
–
–
–
–
–
1636.8
65.47
-80
200
–
–
–
–
MHz
MHz
dBc/Hz
MHz/V
–
–
0.8 x VCC
–
VCC
0
–
0.2 x VCC
V
V
VO
2.1
2.3
2.5
V
–
–
1.2
–
1.28
5.0
1.375
–
V
mV/°C
–
–
1.270
–
1.395
5.0
1.463
–
V
mV/°C
3
Figure 1 Applications Schematic (1636.8 MHz LO)
4
Freescale Semiconductor
Outline Dimensions
PLASTIC PACKAGE
CASE 932-03
(LQFP-48)
ISSUE F
4X
NOTES:
1 DIMENSIONING AND TOLERANCING PER ASME
2 DATUM
3
CONTROLLING
Y14.5M,PLANE
1994.AB
DIMENSION:
IS LOCATED
MILLIMETER.
AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
4 DATUMS
THE BOTTOM
T, U, AND
OF THE
Z TOPARTING
BE DETERMINED
LINE.
AT
5 DIMENSIONS
DATUM PLANE
S AND
AB. V TO BE DETERMINED AT
6 DIMENSIONS
SEATING PLANE
A AND
AC.B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
7 DIMENSION
DETERMINED
D DOES
AT DATUM
NOTPLANE
INCLUDE
AB.DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
8 MINIMUM
0.350. SOLDER PLATE THICKNESS SHALL BE
9 EXACT
0.0076.
SHAPE OF EACH CORNER IS OPTIONAL.
0.200 AB T-U Z
9
DETAIL Y
A
P
A1
48
37
1
36
T
U
V
B
AE
B1
12
25
13
AE
V1
24
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
L
M
N
P
R
S
S1
V
V1
W
AA
Z
S1
T, U, Z
S
DETAIL Y
4X
0.200 AC T-U
Z
0.080 AC
G
AB
AD
AC
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BSC
0.050
0.150
0.090
0.200
0.500
0.700
0 ð_ 7 ð_
12 ð_
REF
0.090
0.160
0.250 BSC
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
M ð_
BASE METAL
TOP & BOTTOM
0.250
J
C
E
GAUGE PLANE
N
R
F
D
0.080
M
AC T-U Z
SECTION AE-AE
W
H
L ð_
K
DETAIL AD
AA
Freescale Semiconductor
5
NOTES
6
Freescale Semiconductor
NOTES
Freescale Semiconductor
7
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© Freescale Semiconductor, Inc. 2004. All rights reserved.
MRFIC1505
Rev. 1
08/2004