Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 1/6 CYStech Electronics Corp. P-CHANNEL Enhancement Mode MOSFET MTP2305N3 Features • VDS=-20V RDS(ON)=65mΩ@VGS=-4.5V, IDS=-4.2A RDS(ON)=100mΩ@VGS=-2.5V, IDS=-2A • Advanced trench process technology • Super high density cell design for extremely low on resistance • Reliable and rugged • Compact and low profile SOT-23 package • Pb-free package Equivalent Circuit Outline MTP2305N3 SOT-23 D G：Gate S：Source D：Drain G S Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @TA=25°C (Note 1) Continuous Drain Current @TA=70°C (Note 1) Pulsed Drain Current (Note 2) Maximum Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Symbol Limits Unit VDS VGS ID ID IDM PD -20 ±12 -4.2 -3.4 -10 1.38 0.01 -55~+150 V V A A A W W/°C °C Tj, Tstg Note : 1. Surface mounted on 1 in² copper pad of FR-4 board, 270°C/W when mounted on minimum copper pad. 2. Pulse width limited by maximum junction temperature. MTP2305N3 CYStek Product Specification Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 2/6 CYStech Electronics Corp. Thermal Performance Parameter Thermal Resistance, Junction-to-Ambient Symbol Rth,ja Limit 90 Unit °C/W Note : Surface mounted on 1 in² copper pad of FR-4 board, 270°C/W when mounted on minimum copper pad. Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ΔBVDSS/ΔTj VGS(th) IGSS IDSS *RDS(ON) Min. Typ. Max. Unit -20 -0.5 - -0.1 9 ±100 -1 -10 53 65 100 250 - V V/°C V nA µA µA 740 167 126 5.9 3.6 32.4 2.6 10.6 2.32 3.68 - 27.7 22 -1.2 - *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *trr *Qrr - Test Conditions S VGS=0, ID=-250µA Reference to 25°C, ID=-1mA VDS=VGS, ID=-250µA VGS=±12V, VDS=0 VDS=-20V, VGS=0 VDS=-16V, VGS=0, Tj=70°C ID=-4.5A, VGS=-10V ID=-4.2A, VGS=-4.5V ID=-2.0A, VGS=-2.5V ID=-1.0A, VGS=-1.8V VDS=-5V, ID=-2.8A pF VDS=-15V, VGS=0, f=1MHz ns VDS=-15V, ID=-4.2A, VGS=-10V, RD=3.6Ω, RG=6Ω nC VDS=-16V, ID=-4.2A, VGS=-4.5V, V ns nC VGS=0V, ISD=-1.2A mΩ IS=-4.2A, VGS=0V, dI/dt=100A/µs *Pulse Test : Pulse Width ≤300µs, Duty Cycle≤2% Ordering Information Device MTP2305N3 MTP2305N3 Package SOT-23 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel 2305 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 3/6 Characteristic Curves MTP2305N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 4/6 Characteristic Curves(Cont.) MTP2305N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 5/6 Characteristic Curves(Cont.) MTP2305N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 6/6 SOT-23 Dimension Marking: A L 3 TE 2305 B S 2 1 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 G V Style: Pin 1.Gate 2.Source 3.Drain C D H K J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTP2305N3 CYStek Product Specification