RENESAS NP40N10VDF

Preliminary Data Sheet
NP40N10YDF, NP40N10VDF, NP40N10PDF
R07DS0361EJ0201
Rev.2.01
May 13, 2013
100 V – 40 A – N-channel Power MOS FET
Application: Automotive
Description
These products are N-channel MOS Field Effect Transistors designed for high current switching applications.
Features
• Low on-state resistance
⎯ RDS(on) = 25 mΩ MAX. (VGS = 10 V, ID = 20 A) (NP40N10YDF)
⎯ RDS(on) = 26 mΩ MAX. (VGS = 10 V, ID = 20 A) (NP40N10VDF)
⎯ RDS(on) = 27 mΩ MAX. (VGS = 10 V, ID = 20 A) (NP40N10PDF)
• Low Ciss: Ciss = 2100 pF TYP. (VDS = 25 V, VGS = 0 V)
• Logic level drive type
• Designed for automotive application and AEC-Q101 qualified
Outline
Drain
Body
Diode
Gate
Source
8-pin HSON
8
7
6 5
TO-252
TO-263
4
4
1
2
3
4
1, 2, 3 : Source
4
: Gate
5, 6, 7, 8: Drain
2
2
3
3
1
1. Gate
2. Drain
3. Source
4. Fin (Drain)
1
1. Gate
2. Drain
3. Source
4. Fin (Drain)
Remark: Strong electric field, when exposed to this device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred.
Ordering Information
Part No.
NP40N10YDF-E1-AY *1
NP40N10YDF-E2-AY *1
NP40N10VDF-E1-AY *1
NP40N10VDF-E2-AY *1
NP40N10PDF-E1-AY *1
NP40N10PDF-E2-AY *1
Note:
Lead Plating
Pure Sn (Tin)
Pure Sn (Tin)
Pure Sn (Tin)
Packing
Taping (E1 type)
Taping (E2 type)
Tape 2500 p/reel
Taping (E1 type)
Taping (E2 type)
Tape 800 p/reel
Taping (E1 type)
Taping (E2 type)
Tape 2500 p/reel
Package
8-pin HSON
TO-252 (MP-3ZP)
TO-263 (MP-25ZP)
*1. Pb-free (This product does not contain Pb in the external electrode)
R07DS0361EJ0201 Rev.2.01
May 13, 2013
Page 1 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
Absolute Maximum Ratings (TA = 25°C)
Item
Drain to Source Voltage (VGS = 0 V)
Gate to Source Voltage (VDS = 0 V)
Drain Current (DC) (TC = 25°C)
Drain Current (pulse) ∗1
Total Power Dissipation (TC = 25°C)
Symbol
VDSS
VGSS
ID(DC)
ID(pulse)
PT1
NP40N10YDF
Total Power Dissipation (TA = 25°C) ∗2
PT2
Ratings
100
±20
±40
±80
120
1.0
NP40N10VDF
Total Power Dissipation (TA = 25°C) ∗2
1.2
NP40N10PDF
Total Power Dissipation (TA = 25°C)
Channel Temperature
Storage Temperature
Single Avalanche Current ∗3
Single Avalanche Energy ∗3
1.8
Tch
Tstg
IAS
EAS
Unit
V
V
A
A
W
W
175
−55 to +175
25
61
°C
°C
A
mJ
Thermal Resistance
Channel to Case Thermal Resistance
Channel to Ambient Thermal Resistance ∗2
Rth(ch-C)
Rth(ch-A)
NP40N10YDF
NP40N10VDF
NP40N10PDF
1.25
150
125
83.3
°C/W
°C/W
°C/W
°C/W
Notes: *1. TC = 25°C, PW ≤ 10 μs, Duty Cycle ≤ 1%
*2. Mounted on glass epoxy substrate of 40 mm × 40 mm × 1.6 mmt with 4% copper area (35 μm)
*3. Tch(start) = 25°C, VDD = 50 V, RG = 25 Ω, L = 100 μH, VGS = 20 V → 0 V
R07DS0361EJ0201 Rev.2.01
May 13, 2013
Page 2 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
Electrical Characteristics (TA = 25°C)
Item
Zero Gate Voltage Drain Current
Gate Leakage Current
Gate to Source Threshold Voltage
Forward Transfer Admittance ∗1
Drain to Source NP40N10YDF
On-state
Resistance ∗1
Symbol
IDSS
IGSS
VGS(th)
| yfs |
RDS(on)1
Min
Typ
1.5
20
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
RDS(on)2
RDS(on)3
RDS(on)1
RDS(on)2
RDS(on)3
RDS(on)1
RDS(on)2
RDS(on)3
Ciss
Coss
Crss
td(on)
tr
2.0
40
21
23
24
21
23
24
21
23
24
2100
200
80
15
16
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate to Source Charge
Gate to Drain Charge
Body Diode Forward Voltage ∗1
Reverse Recovery Time
Reverse Recovery Charge
td(off)
tf
QG
QGS
QGD
VF(S-D)
trr
Qrr
60
5
47
8
12
0.9
67
162
NP40N10VDF
NP40N10PDF
Note:
Max
1
±100
2.5
Unit
μA
nA
V
S
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
pF
pF
pF
ns
ns
25
30
36
26
31
37
27
32
38
3150
300
144
33
40
120
13
71
ns
ns
nC
nC
nC
V
ns
nC
1.5
Test Conditions
VDS = 100 V, VGS = 0 V
VGS = ±20 V, VDS = 0 V
VDS = VGS, ID = 250 μA
VDS = 5.0 V, ID = 20 A
VGS = 10 V, ID = 20 A
VGS = 5.0 V, ID = 20 A
VGS = 4.5 V, ID = 20 A
VGS = 10 V, ID = 20 A
VGS = 5.0 V, ID = 20 A
VGS = 4.5 V, ID = 20 A
VGS = 10 V, ID = 20 A
VGS = 5.0 V, ID = 20 A
VGS = 4.5 V, ID = 20 A
VDS = 25 V,
VGS = 0 V,
f = 1 MHz
VDD = 50 V, ID = 20 A,
VGS = 10 V,
RG = 0 Ω
VDD = 80 V,
VGS = 10 V,
ID = 40 A
IF = 40 A, VGS = 0 V
IF = 40 A, VGS = 0 V,
di/dt = 100 A/μs
*1. Pulsed test
TEST CIRCUIT 1 AVALANCHE CAPABILITY
D.U.T.
RG = 25 Ω
PG.
VGS = 20 → 0 V
TEST CIRCUIT 2 SWITCHING TIME
D.U.T.
L
50 Ω
RL
Wave Form
RG
PG.
VDD
VGS
VGS
VDD
0
VGS
10%
90%
VDS
90%
ID
IAS
90%
VDS
VGS
0
BVDSS
VDS
10%
0
10%
Wave Form
VDS
VDD
Starting Tch
τ
τ = 1 μs
Duty Cycle ≤ 1%
td(on)
tr
ton
td(off)
tf
toff
TEST CIRCUIT 3 GATE CHARGE
PG.
D.U.T.
IG = 2 mA
RL
50 Ω
VDD
R07DS0361EJ0201 Rev.2.01
May 13, 2013
Page 3 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
Typical Characteristics (TA = 25°C)
TOTAL POWER DISSIPATION vs.
CASE TEMPERATURE
140
120
PT - Total Power Dissipation - W
dT - Percentage of Rated Power - %
DERATING FACTOR OF FORWARD BIAS SAFE
OPERATING AREA
100
80
60
40
20
0
0
25
50
75
100
125
150
175
120
100
80
60
40
20
0
0
25
50
75
100
125
150
175
TC - Case Temperature - °C
TC - Case Temperature - °C
FORWARD BIAS SAFE OPERATING AREA
ID - Drain Current - A
1000
RDS(ON) Limited
100 (VGS = 10V)
PW = 100 μs
ID(Pulse)
10
Power Dissipation Limited
1 ms
1
Secondary Breakdown Limited
TC = 25°C
Single Pulse
0.1
0.1
10 ms
1
10
100
VDS - Drain to Source Voltage - V
R07DS0361EJ0201 Rev.2.01
May 13, 2013
Page 4 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH (NP40N10YDF)
rth(t) - Transient Thermal Resistance - °C/W
1000
Rth(ch-A) = 150°C/W
100
10
Rth(ch-C) = 1.25°C/W
1
0.1
Single pulse
Mounted on glass epoxy substrate of 40 mm × 40 mm × 1.6 mmt
with 4% copper area (35 μm)
0.01
100 μ
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH (NP40N10VDF)
rth(t) - Transient Thermal Resistance - °C/W
1000
Rth(ch-A) = 125°C/W
100
10
Rth(ch-C) = 1.25°C/W
1
0.1
Single pulse
Mounted on glass epoxy substrate of 40 mm × 40 mm × 1.6 mmt
with 4% copper area (35 μm)
0.01
100 μ
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH (NP40N10PDF)
rth(t) - Transient Thermal Resistance - °C/W
1000
Rth(ch-A) = 83.3°C/W
100
10
Rth(ch-C) = 1.25°C/W
1
0.1
Single Pulse
0.01
100 μ
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s
R07DS0361EJ0201 Rev.2.01
May 13, 2013
Page 5 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
FORWARD TRANSFER CHARACTERISTICS
100
100
90
VGS = 10 V
80
ID - Drain Current - A
ID - Drain Current - A
VDS = 10 V
Pulsed
5.0 V
4.5 V
70
60
50
40
30
20
1
0.1
Pulsed
0
1
2
3
4
5
0.001
6
0
1
2
3
4
5
VDS - Drain to Source Voltage - V
VGS - Gate to Source Voltage - V
GATE TO SOURCE THRESHOLD VOLTAGE vs.
CHANNEL TEMPERATURE
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
|yfs| - Forward Transfer Admittance - S
2.5
VDS = VGS
ID = 250 μA
2
1.5
1
0.5
0
–100
–50
0
50
100
150
200
100
TA = –55°C
–25°C
25°C
75°C
100°C
125°C
10
150°C
175°C
VDS = 5 V
Pulsed
1
0.01
0.1
1
10
100
Tch - Channel Temperature - °C
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
60
VGS = 4.5 V
50
5.0 V
40
10 V
30
20
10
Pulsed
0
0.1
1
10
ID - Drain Current - A
R07DS0361EJ0201 Rev.2.01
May 13, 2013
100
RDS(on) - Drain to Source On-State Resistance - mΩ
VGS(th) - Gate to Source Threshold Voltage - V
RDS(on) - Drain to Source On-State Resistance - mΩ
TA = –55°C
–25°C
25°C
75°C
100°C
125°C
150°C
175°C
0.01
10
0
10
45
40
ID = 40 A
35
20 A
30
8A
25
20
15
10
5
0
Pulsed
0
5
10
15
20
VGS - Gate to Source Voltage - V
Page 6 of 9
Preliminary
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
70
10000
50
40
30
20
ID = 20 A
Pulsed
10
0
–100
–50
0
50
100
150
1000
Coss
100
Crss
VGS = 0 V
f = 1 MHz
10
0.01
200
0.1
1
10
100
Tch - Channel Temperature - °C
VDS - Drain to Source Voltage - V
SWITCHING CHARACTERISTICS
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
1000
12
90
VDD = 50 V
VGS = 10 V
RG = 0 Ω
100
td(off)
td(on)
tr
10
tf
1
0.1
1
10
VDD = 80 V
50 V
20 V
80
70
10
8
60
VGS
50
6
40
4
30
20
2
10
0
100
ID = 40 A
VDS
0
10
20
30
40
ID - Drain Current - A
QG- Gate Charge - nC
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
REVERSE RECOVERY TIME vs.
DRAIN CURRENT
trr - Reverse Recovery Time - ns
VGS = 10 V
0V
10
1
Pulsed
0.1
0
50
100
100
IF - Diode Forward Current - A
Ciss
VGS - Gate to Source Voltage - V
60
Ciss, Coss, Crss - Capacitance -pF
VGS = 4.5 V
5.0 V
10 V
VDS - Drain to Source Voltage - V
td(on), tr, td(off), tf - Switching Time - ns
RDS(on) - Drain to Source On-State Resistance - mΩ
NP40N10YDF, NP40N10VDF, NP40N10PDF
0
0.2
0.4
0.6
0.8
VF(S-D) - Source to Drain Voltage - V
R07DS0361EJ0201 Rev.2.01
May 13, 2013
1
10
di/dt = 100 A/μs
VGS = 0 V
1
0.1
1
10
100
IF - Drain Current - A
Page 7 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
Package Drawings (Unit: mm)
8-pin HSON (Mass: 0.13 g TYP.)
1.27
Renesas package code: PLSN0008KA-A
1
5
+0.1
5.0 ±0.2
6
4
0.42 –0.05
7
3
5.15 ±0.2
8
2
6.0 ±0.2
0.10 S
3.8 ±0.2
1.45 MAX.
0.73
0.4
0.42 ±0.05
0
+0.05
–0
0.10 M
5.4 ±0.2
1, 2, 3 : Source
4
: Gate
5, 6, 7, 8: Drain
3.18 ±0.2
0.8 ±0.15
0.6 ±0.15
TO-252 (MP-3ZP) (Mass: 0.27 g TYP.)
Renesas package code: PRSS0004ZP-A
2.3±0.1
1.0 TYP.
6.5±0.2
5.1 TYP.
4.3 MIN.
0.5±0.1
No Plating
2
3
0.8
1
1.14 MAX.
0.51 MIN.
1.13
6.1±0.2
10.4 MAX. (9.8 TYP.)
4.0 MIN.
4
No Plating
2.3
1. Gate
2. Drain
3. Source
4. Fin (Drain)
R07DS0361EJ0201 Rev.2.01
May 13, 2013
0 to 0.25
0.5±0.1
0.76±0.12
2.3
1.0
Page 8 of 9
NP40N10YDF, NP40N10VDF, NP40N10PDF
Preliminary
TO-263 (MP-25ZP) (Mass: 1.48 g TYP.)
No plating
10.0 ±0.3
7.88 MIN.
1.35 ±0.3
Renesas package code: PRSS0004AL-A
4.45 ±0.2
1.3 ±0.2
9.15 ±0.3
0.5
0.025
to 0.25
15.25 ±0.5
8.0 TYP.
4
3
2.5
1 2
R07DS0361EJ0201 Rev.2.01
May 13, 2013
.2
0 to 8
°
0.25
2.54
1. Gate
2. Drain
3. Source
4. Fin (Drain)
2.54 ±0.25
0.6 ±0
0.75 ±0.2
Page 9 of 9
Revision History
NP40N10YDF, NP40N10VDF, NP40N10PDF Data Sheet
Description
Rev.
Date
1.00
2.00
Feb 21, 2013
Mar 11, 2013
2.01
May 13, 2013
Page
—
Summary
First Edition Issued
1
7
"Outline" added
Modification of "CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE"
1
8
Modification of "Outline"
Modification of "Package Drawings 8-pinHSON"
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C-1
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Colophon 2.2