ONSEMI NSL12AWT1G

NSL12AWT1G
High Current Surface Mount
PNP Silicon Low VCE(sat)
Transistor for Battery
Operated Applications
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Features
•
•
•
•
•
High Current Capability (3 A)
High Power Handling (Up to 650 mW)
Low VCE(s) (170 mV Typical @ 1 A)
Small Size
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
12 VOLTS
3.0 AMPS
PNP TRANSISTOR
COLLECTOR
1, 2, 5, 6
Benefits
• High Specific Current and Power Capability Reduces Required PCB Area
• Reduced Parasitic Losses Increases Battery Life
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
Collector-Emitter Voltage
VCEO
−12
Vdc
Collector-Base Voltage
VCBO
−12
Vdc
Emitter-Base Voltage
VEBO
−5.0
Vdc
Collector Current − Continuous
Collector Current − Peak
IC
ICM
−2.0
−3.0
Adc
Electrostatic Discharge
ESD
HBM Class 3
MM Class C
3
BASE
4
EMITTER
SC−88/SOT−363
CASE 419B
STYLE 20
1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
MARKING DIAGRAM
Characteristic
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD (Note 1)
450
mW
3.6
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 1)
275
°C/W
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD (Note 2)
650
mW
5.2
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 2)
192
°C/W
RqJL
105
°C/W
PD Single
1.4
W
TJ, Tstg
−55 to +150
°C
Thermal Resistance,
Junction−to−Lead 6
Total Device Dissipation
(Single Pulse < 10 sec.)
Junction and Storage
Temperature Range
6
11 MG
G
1
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1. FR−4, Minimum Pad, 1 oz Coverage
2. FR−4, 1″ Pad, 1 oz Coverage
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 3
1
Publication Order Number:
NSL12AW/D
NSL12AWT1G
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector −Emitter Breakdown Voltage, (IC = −10 mAdc, IB = 0)
V(BR)CEO
−12
−15
−
Vdc
Collector −Base Breakdown Voltage, (IC = −0.1 mAdc, IE = 0)
V(BR)CBO
−12
−25
−
Vdc
Emitter −Base Breakdown Voltage, (IE = −0.1 mAdc, IC = 0)
V(BR)EBO
−5.0
−7.0
−
Vdc
Collector Cutoff Current, (VCB = −12 Vdc, IE = 0)
ICBO
−
−0.02
−0.1
mAdc
Collector−Emitter Cutoff Current, (VCES = −12 Vdc, IE = 0)
ICES
−
−0.03
−0.1
mAdc
Emitter Cutoff Current, (VCES = −5.0 Vdc, IE = 0)
IEBO
−
−0.03
−0.1
mAdc
100
100
100
180
165
160
−
300
−
−
−
−
−0.10
−0.14
−0.17
−0.160
−0.235
−0.290
−
−0.84
−0.95
−
−0.81
−0.95
−
100
−
−
50
65
OFF CHARACTERISTICS
ON CHARACTERISTICS
DC Current Gain (Note 3)
(IC = −0.5 A, VCE = −1.5 V)
(IC = −0.8 A, VCE = −1.5 V)
(IC = −1.0 A, VCE = −1.5 V)
hFE
Collector −Emitter Saturation Voltage (Note 3)
(IC = −0.5 A, IB = −10 mA)
(IC = −0.8 A, IB = −16 mA)
(IC = −1.0 A, IB = −20 mA)
VCE(sat)
Base −Emitter Saturation Voltage (Note 3)
(IC = −1.0 A, IB = −20 mA)
VBE(sat)
Base −Emitter Turn−on Voltage (Note 3)
(IC = −1.0 A, VCE = −1.5 V)
VBE(on)
Cutoff Frequency
(IC = −100 mA, VCE = −5.0 V, f = 100 MHz)
fT
Output Capacitance
(VCB = −1.5 V, f = 1.0 MHz)
Cobo
V
V
V
MHz
pF
3. Pulsed Condition: Pulse Width < 300 msec, Duty Cycle < 2%
ORDERING INFORMATION
Device
NSL12AWT1G
Package
Shipping†
SOT−363
(Pb−Free)
3000 Tape & Reel
VCE, COLLECTOR EMITTER VOLTAGE (V)
VCE, COLLECTOR EMITTER VOLTAGE (V)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
0.5
0.4
2A
0.3
0.2
1A
800 mA
0.1
IC = 100 mA
0
1
500 mA
10
IB, BASE CURRENT (mA)
100
Figure 1. Collector Emitter Voltage vs Base Current
0.5
0.4
0.3
0.2
IC/IB = 100
0.1
IC/IB = 10
0
0.001
0.1
0.01
IC, COLLECTOR CURRENT (AMPS)
1
Figure 2. Collector Emitter Voltage vs Collector Current
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2
NSL12AWT1G
1.0
VCE = 1.5 V
125°C
VBE, BASE EMITTER VOLTAGE (V)
hFE, DC CURRENT GAIN
400
300
25°C
200
100
0
TA = −55°C
0.001
0.01
0.1
0.9
TA = −55°C
0.8
0.7
25°C
0.6
0.5
125°C
0.4
VCE = 1.5 V
0.3
0.001
1
0.01
Figure 3. DC Current Gain versus Collector
Current
Figure 4. Base Emitter Voltage versus
Collector Current
1.0
10
0.9
IC/IB = 10
0.8
IC/IB = 100
0.7
0.6
0.001
0.01
10 ms
1 ms
SINGLE PULSE TA = 25°C
0.1
IC, COLLECTOR CURRENT (AMPS)
1
100 ms
0.1
0.01
1
0.1
1s
dc
1
1
10
VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)
Figure 5. Base Emitter Saturation Voltage
versus Base Current
r(t), MINIMUM PAD NORMALIZED
TRANSIENT THERMAL RESISTANCE
1
IC, COLLECTOR CURRENT (AMPS)
IC, COLLECTOR CURRENT (A)
VBE(sat), BASE EMITTER SATURATION VOLTAGE (V)
IC, COLLECTOR CURRENT (AMPS)
0.1
Figure 6. Safe Operating Area
D = 0.50
D = 0.20
D = 0.10
0.1
D = 0.05
D = 0.02
0.01
D = 0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1
Figure 7. Normalized Thermal Response
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3
10
100
1000
NSL12AWT1G
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
e
6
5
4
1
2
3
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
M
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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PUBLICATION ORDERING INFORMATION
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NSL12AW/D