PHILIPS PCF84C00B

INTEGRATED CIRCUITS
DATA SHEET
PCF84C00
8-bit microcontroller with I2C-bus
interface
Product specification
Supersedes data of May 1996
File under Integrated Circuits, IC14
1996 Nov 25
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus
interface
PCF84C00
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING
6
FUNCTIONAL DESCRIPTION
6.1
6.2
6.3
6.4
6.5
‘Piggy-back’ version PCF84C00B
ROM-less version PCF84C00T
Data memory
I/O facilities
Reset
7
LIMITING VALUES
8
HANDLING
9
DC CHARACTERISTICS
10
AC CHARACTERISTICS
11
PACKAGE OUTLINES
12
SOLDERING
12.1
12.2
12.2.1
12.2.2
12.3
12.3.1
12.3.2
12.3.3
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO and VSO
Reflow soldering
Wave soldering
Repairing soldered joints
13
DEFINITIONS
14
LIFE SUPPORT APPLICATIONS
15
PURCHASE OF PHILIPS I2C COMPONENTS
1996 Nov 25
2
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
1
2
FEATURES
• Manufactured in silicon gate CMOS process
PCF84C00
GENERAL DESCRIPTION
This data sheet details the specific properties of the
PCF84C00. The shared properties of the PCF84CxxxA
family of microcontrollers are described in the
“PCF84CxxxA family” data sheet, which should be read in
conjunction with this publication.
• 8-bit CPU, RAM, I/O in a single 28-lead or 56-lead
package
• ‘Piggy-back’ and ROM-less versions, external program
memory
The PCF84C00 has 20 quasi-bidirectional I/O lines, an
I2C-bus serial interface, a single-level vectored interrupt
structure, an 8-bit timer/event counter and on-chip clock
oscillator and clock circuits.
• 256 × 8 RAM
• 20 quasi-bidirectional I/O port lines
• Two test inputs, one of which is also the external
interrupt input
This efficient controller also performs well as an arithmetic
processor. It has facilities for both binary and BCD
arithmetic plus bit-handling capabilities.
• Three single-level vectored interrupts:
– external
– timer/event counter
The instruction set is similar to the MAB8048 and is a
sub-set of that listed in the “PCF84CxxxA family” data
sheet.
– I2C-bus
• I2C-bus interface for serial data transfer on two lines
(serial I/O data via an existing port line and clock via a
dedicated line)
• 8-bit programmable timer/event counter
• Clock frequency range: 100 kHz to 10 MHz
• Over 80 instructions (similar to those of the MAB8048)
all of 1 or 2 cycles
• Single supply voltage (2.5 to 5.5 V)
• Stop and Idle modes
• Power-on reset circuit
• Operating temperature range: −40 to +85 °C.
3
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
PCF84C00B
−
Non-standard 28-lead ‘piggy-back’ package with 28-pin EPROM socket
on top. Bottom ‘footprint’ and pinning as DIP 28, version SOT117-1.
The SOT117-1 information provided in Chapter “Package Outlines” is
correct in these respects, but not for the physical size of the
PCF84C00B, which is larger than the SOT117-1 package.
−
PCF84C00T
VSO56
1996 Nov 25
Plastic very small outline package; 56 leads.
3
SOT 190-1
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
4
PCF84C00
BLOCK DIAGRAM
handbook, full pagewidth
SERIAL DATA/P2.3
P2.2 to P2.0
SCLK
P0.7 to P0.0
8
8
PORT 1
BUFFER
PORT 0
BUFFER
3
"SEE
FIGS 2 AND 3"
PORT 2
BUFFER
clock
data
PORT 2
LATCH
PORT 1
LATCH
I2C-BUS
INTERFACE
SIO
interrupt
P1.7 to P1.0
32
8
4
ACCUMULATOR
(8)
POWER
ON
RESET
INTERNAL
CLOCK
FREQUENCY
30
TEMPORARY
REGISTER 1
(8)
MEMORY
BANK
FLIP-FLOPS
13
TIMER/
EVENT
COUNTER
(8)
HIGHER
PROGRAM
COUNTER
(5)
TEST 1
TEMPORARY
REGISTER 2
(8)
timer
interrupt
8
5
8
PROGRAM
STATUS
WORD
8
7
PROGRAM
COUNTER
INTERRUPT
LOGIC
8
(8)
INT/T0
VDD
VSS
IDLE
DECIMAL
ADJUST
CONDITIONAL
BRANCH
LOGIC
INTERRUPT
RESET
INITIALIZE
XTAL 1
TIMER FLAG
ACC BIT
TEST
XTAL 2
OSCILLATOR
XTAL
Fig.1 Block diagram.
1996 Nov 25
REGISTER 1
REGISTER 2
REGISTER 3
REGISTER 4
REGISTER 5
REGISTER 6
REGISTER 7
8 LEVEL STACK
(VARIABLE LENGTH)
OPTIONAL SECOND
REGISTER BANK
4
DATA STORE
CARRY
ACC
CONTROL & TIMING
INT/T0
REGISTER 0
TEST 1
external
interrupt
GND
STOP
MULTIPLEXER
D
E
C
O
D
E
RESET
POWER
SUPPLY
8
RAM
ADDRESS
REGISTER
INSTRUCTION
REGISTER
&
DECODER
ARITHMETIC
LOGIC UNIT
VPOR
LOWER
PROGRAM
COUNTER
(8)
PORT 0
LATCH
RESIDENT RAM ARRAY
MGG401
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
A0-A12
PCF84C00
k, full pagewidth
D0-D7
A0-A12
D0-D7
PSEN
DXALE
8
DXRD
DXWR
PSEN
8
EXDI
13
13
MGG402
Fig.2
5
Replacement of dotted section in Fig.1, for
the PCF84C00B ‘piggy-back’ version.
Fig.3
Replacement of dotted section in Fig.1, for
the PCF84C00T ROM-less version.
PINNING
Table 1
PCF84C00B (see Fig.4)
SYMBOL
PIN
TYPE
P2.2
1
I/O
1 bit of Port 2: 4-bit quasi-bidirectional I/O port
SDA/P2.3
2
I/O
bidirectional data line of the I2C-bus interface; or 1 bit of Port 2: 4-bit
quasi-bidirectional I/O line
SCLK
3
I/O
bidirectional clock line of the I2C-bus interface
8 bits of Port 0: 8-bit quasi-bidirectional I/O port
P0.0 to P0.7
DESCRIPTION
4 to 11
I/O
INT/T0
12
I
Interrupt/Test 0: external interrupt input (negative edge triggered)/test input
pin. When used as a test input, this pin is directly tested by conditional branch
instructions JT0 and JNT0.
T1
13
I
Test 1: test input pin, directly tested by conditional branch instructions JT1 and
JNT1. T1 may also be selected as an input to the 8-bit timer/event counter via
the STRT CNT instruction.
VSS
14
P
ground: circuit earth potential
XTAL1
15
I
oscillator input: input from a crystal which determines the internal oscillator
frequency or an external clock generator
XTAL2
16
I/O
oscillator output: output of the inverting amplifier
RESET
17
I/O
reset input: used to initialize the microcontroller (active HIGH); also output of
power-on-reset circuit
P1.0 to P1.7
18 to 25
I/O
8 bits of Port 1: 8-bit quasi-bidirectional I/O port
P2.0 to P2.1
26, 27
I/O
2 bits of Port 2: 4-bit quasi-bidirectional I/O port
28
P
VDD
1996 Nov 25
power supply: 2.5 V to 5.5 V
5
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
Table 2
PCF84C00
PCF84C00T (see Fig.5)
SYMBOL
PIN
TYPE
P2.2
1
I/O
1 bit of Port 2: 4-bit quasi-bidirectional I/O port
SDA/P2.3
2
I/O
bidirectional data line of the I2C-bus interface; or 1 bit of Port 2: 4-bit
quasi-bidirectional I/O port
SCLK
3
I/O
bidirectional clock line of the I2C-bus interface
4, 5
I/O
2 bits of Port 0: 8-bit quasi-bidirectional I/O port
6
O
Address latch enable: on the falling edge of DXALE, the Dx address can be
latched in an external latch. This signal occurs only during execution of the
MOV Dx, A, MOV A, Dx, ANL Dx, A and ORL Dx, A instructions, with
x = 0 to 255. It is active during TS10 of cycle 1 and the first half of TS1 of
cycle 2.
not connected
P0.0 to P0.1
DXALE
DESCRIPTION
7
−
8 to 13
I/O
INT/T0
14
I
Interrupt/Test 0: external interrupt input (negative edge triggered)/test input
pin. When used as a test input, this pin is directly tested by conditional branch
instructions JT0 and JNT0; note 1.
T1
15
I
Test 1: test input pin, directly tested by conditional branch instructions JT1 and
JNT1. T1 may also be selected as an input to the 8-bit timer/event counter via
the STRT CNT instruction.
16 to 18
I/O
3 bits of 8-bit data bus: for external memory and peripherals. The specified
Stop mode supply current is valid only if external pull-ups are connected to all
data lines.
A12
19
O
1 bit of 13-bit address bus: for external memory and peripherals
DXWR
20
O
Write strobe (active LOW): on the rising edge, data on D0-D7 may be written
to external registers. This signal occurs only during MOV Dx, A, ANL Dx, A
and ORL Dx, A instructions, with x = 0 to 255. It is active during TS7 of
cycle 2.
n.c.
21
−
not connected
22 to 27
O
6 bits of 13-bit address bus: for external memory and peripherals
28
P
ground: circuit earth potential
29 to 34
O
6 bits of 13-bit address bus: for external memory and peripherals
35
O
Read strobe (active LOW): when this signal is active, external registers
emulating Dx registers can be read by the data bus. This signal occurs only
during execution of MOV A, Dx, ANL Dx, A and ORL Dx, A instructions, with
x = 0 to 255. It is active during TS3 and TS4 of cycle 2.
36 to 40
I/O
5 bits of 8-bit data bus: for external memory and peripherals. The specified
Stop mode supply current is valid only if external pull-ups are connected to all
data lines.
PSEN
41
O
Program store enable (active LOW): PSEN is used to enable external
program memory and is active during TS9 and TS10 of each machine cycle
and TS1 of each following cycle. PSEN is HIGH during the Stop mode.
XTAL1
42
I
oscillator input: input from a crystal which determines the internal oscillator
frequency or an external clock generator
XTAL2
43
I/O
n.c.
P0.2 to P0.7
D0 to D2
A11 to A6
VSS
A5 to A0
DXRD
D3 to D7
1996 Nov 25
6 bits of Port 0: 8-bit quasi-bidirectional I/O port
oscillator output: output of the inverting amplifier
6
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
SYMBOL
PCF84C00
PIN
TYPE
DESCRIPTION
44
I/O
reset input: used to initialize the microcontroller (active HIGH); also output of
power-on-reset circuit
45 to 48
I/O
49
I
P1.4 to P1.7
50 to 53
I/O
4 bits of Port 1: 8-bit quasi-bidirectional I/O port
P2.0 to P2.1
54, 55
I/O
2 bits of Port 2: 4-bit quasi-bidirectional I/O port
56
P
RESET
P1.0 to P1.3
EXDI
VDD
4 bits of Port 1: 8-bit quasi-bidirectional I/O port
External derivative interrupt (active LOW): EXDI is ‘OR-ed’ with the internal
serial interrupt and can be used to initiate an interrupt from external hardware
emulating derivative functions. EXDI is pulled HIGH internally. The derivative
interrupt is polled during time slot TS6 (note 1), and is only accepted if an EN
SI instruction has been executed and the device is not already executing an
interrupt routine. Derivative interrupts are not latched in the PCF84C00.
power supply: 2.5 V to 5.5 V
Note
1. The interrupt signal must remain active until the vector address (05 H) is present on the address bus.
1996 Nov 25
7
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
handbook, halfpage
handbook, halfpage
P2.2
1
56 VDD
P2.3
2
55 P2.1
SCLK
3
54 P2.0
P0.0
4
53 P1.7
P0.1
5
52 P1.6
DXALE
6
51 P1.5
n.c.
7
50 P1.4
P2.2
1
28 VDD
P0.2
8
49 EXDI
P2.3
2
27 P2.1
P0.3
9
48 P1.3
SCLK
3
26 P2.0
P0.4 10
47 P1.2
P0.0
4
25 P1.7
P0.5 11
46 P1.1
P0.1
5
24 P1.6
P0.6 12
45 P1.0
P0.2
6
23 P1.5
P0.7 13
44 RESET
P0.3
7
22 P1.4
INT/T0 14
PCF84C00B
43 XTAL2
PCF84C00T
P0.4
8
21 P1.3
T1 15
42 XTAL1
P0.5
9
20 P1.2
D0 16
41 PSEN
P0.6 10
19 P1.1
D1 17
40 D7
P0.7 11
18 P1.0
D2 18
39 D6
INT/T0 12
17 RESET
A12 19
38 D5
T1 13
16 XTAL2
DXWR 20
37 D4
VSS 14
15 XTAL1
n.c. 21
36 D3
A11 22
35 DXRD
A10 23
34 A0
A9 24
33 A1
A8 25
32 A2
A7 26
31 A3
A6 27
30 A4
VSS 28
29 A5
MGG403
MGG404
Fig.4
Bottom pinning diagram, ‘piggy-back’
version PCF84C00B.
1996 Nov 25
Fig.5
8
Pinning diagram; ROM-less version
PCF84C00T.
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
6
• INT/T0; External interrupt and test input. When used as
a test input, it can be directly tested by conditional
branch instructions JT0 and JNT0.
FUNCTIONAL DESCRIPTION
6.1
PCF84C00
‘Piggy-back’ version PCF84C00B
• T1; Test input which can alter program sequences when
tested by conditional jump instructions JT1 and JNT1.
T1 also functions as an input to the 8-bit timer/event
counter.
The PCF84C00B package has standard pinning on the
bottom to facilitate insertion as a mask-programmed
device. An EPROM can be mounted on top in an additional
socket. The total package height is greater than the height
of a standard DIP package. The PCF84C00B can address
up to 8 kbytes of external ROM/RAM, and has 256 bytes
of internal data RAM.
6.5
Reset
A positive-going signal on the RESET input/output:
6.2
• Sets the program counter to zero
ROM-less version PCF84C00T
• Selects location 0 of memory bank 0 and register bank 0
The PCF84C00T microcontroller contains no on-chip
ROM, but has all address and data lines brought out to
access an external ROM or EPROM. Consequently, this
version has more pins (see Fig.5) than the devices in the
PCF84CxxxA family with on-chip or ‘piggy-back’ ROM.
The PCF84C00T can address up to 8 kbytes of external
program memory, and has 256 bytes of internal data RAM.
6.3
• Sets the stack pointer to zero (000); pointing to RAM
address 8
• Disables the interrupts (external, timer and I2C-bus)
• Stops the timer/event counter, then sets it to zero
• Sets the timer prescaler to divide by 32
• Resets the timer flag
Data memory
• Sets all ports except P2.3 to input mode
Data memory consists of 256 bytes of Random-Access
Memory (RAM). All locations are indirectly addressable
using RAM pointer registers; up to 16 designated locations
are directly addressable. Memory also includes an 8-level
program counter stack addressed by a 3-bit stack pointer.
6.4
• Sets the I2C-bus interface to slave receiver mode and
disables the I2C-bus interface
• Cancels Idle and Stop mode.
A negative-going signal on the RESET input/output:
• Sets P2.3/SDA and SCLK to HIGH after a maximum of
30 clock pulses
I/O facilities
• Sets the I2C-bus interface to slave receiver mode and
disables the I2C-bus interface after a maximum of 30
clock pulses
Each device has 23 I/O lines arranged as follows:
• Port 0; 8-bit parallel port (P0.0-P0.7)
• Port1; 8-bit parallel port (P1.0-P1.7)
• Starts program execution after 1866 clock pulses.
• Port 2; 4-bit parallel port (P2.0-P2.3)
• SCLK ; I2C-bus (serial I/O) clock line
7 LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD
supply voltage
−0.8
+8
V
VI
all input voltages
−0.5
VDD+0.5
V
II
DC input current
−10
+10
mA
IO
DC output current
−10
+10
mA
Ptot
total power dissipation
−
125
mW
Tstg
storage temperature
−65
+150
°C
1996 Nov 25
9
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
SYMBOL
PARAMETER
CONDITIONS
Tamb
operating ambient temperature range
Tj
operating junction temperature
8
PCF84C00
MIN.
MAX.
UNIT
Ptot(max) = 100 mW
−40
+70
°C
Ptot(max) = 30 mW
−40
+85
°C
−
90
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices. See “Data Handbook IC14 Section: Handling MOS devices”.
9 DC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
V
VDD = 5 V; fxtal = 10 MHz
−
1.6
3.2
mA
VDD = 5 V; fxtal = 6 MHz
−
1
2
mA
VDD = 3 V; fxtal = 3.58 MHz
−
0.3
0.6
mA
−
0.8
1.6
mA
note 1; see Fig.7
note 1; see Fig.8
VDD = 5 V; fxtal = 10 MHz
supply current (Stop mode)
UNIT
5.5
see Fig.6
operating supply current
IDD(stp)
MAX.
−
operating supply voltage
IDD
supply current (Idle mode)
TYP.
2.5
VDD
IDD(idle)
MIN.
VDD = 5 V; fxtal = 6 MHz
−
0.5
1
mA
VDD = 3 V; fxtal = 3.58 MHz
−
0.15
0.4
mA
VDD = 2.5 V; Tamb = 25 °C
−
1.2
2.5
µA
VDD = 2.5 V; Tamb = 85 °C
−
−
10
µA
−
notes 1 and 2; see Fig.9
Inputs
VIL
LOW level input voltage
0
VIH
HIGH level input voltage
0.7VDD −
VDD
V
ILI
input leakage current
VSS < VI < VDD
−1
−
+1
µA
LOW level output sink
current
VDD = 5 V ±10%; VO = 0.4 V (except
1.6
P2.3/SDA, SCLK and Port 1); see Fig.10
3
−
mA
P2.3/SDA, SCLK; see Figs 11 and 12
3
−
−
mA
0.3VDD V
Outputs
IOL
IOH
IOH
HIGH level pull-up output
source current
VDD = 5 V ±10%; VO = 0.7VDD
−40
−
−
µA
VDD = 5 V ±10%; VO = Vss
−
−
−400
µA
HIGH level push-pull output
source current
VDD = 5 V ±10%; VO = VDD − 0.4 V;
see Fig.13
−1.6
−3
−
mA
Notes
1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values
at 25 °C with crystal connected between XTAL1 and XTAL2).
2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open
drain outputs connected to VSS; all other outputs open.
1996 Nov 25
10
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
MGG409
12
MGG415
2000
handbook, halfpage
handbook, halfpage
IDD
(µA)
fxtal
(MHz)
1600
8
1200
5V
800
guaranteed
operating
range
4
400
3V
100 kHz
0
0
2
4
0
10−1
6
VDD (V)
1
10
f (MHz)
VDD = 5 V.
VDD = 3 V.
Fig.6
Maximum clock frequency (fxtal) as a
function of the supply voltage.
Fig.7
Typical operating supply current (IDD) as a
function of clock frequency (fxtal).
MGG410
1000
MGG416
3
handbook, halfpage
handbook, halfpage
IDD(idle)
IDD(stp)
(µA)
(µA)
800
2
600
5V
(1)
400
(2)
1
200
3V
0
10−1
1
f (MHz)
0
10
2
0
VDD = 5 V.
VDD = 3 V.
(1) Tamb = 85 °C.
(2) Tamb = 25 °C.
Fig.8
Fig.9
Typical supply current in Idle mode (IDD(idle))
as a function of clock frequency (fxtal).
1996 Nov 25
11
4
VDD (V)
6
Typical supply current in Stop mode
(IDD(stp)) as a function of the supply voltage
(VDD).
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
MGG411
MGG412
4
8
handbook, halfpage
handbook, halfpage
IOL
(mA)
IOL
(mA)
3
6
2
4
1
2
0
0
0
2
4
6
VDD (V)
8
0
2
4
6
VDD (V)
8
VO = 0.4 V.
VO = 0.4 V.
Fig.10 Typical output sink current (IOL), outputs
P0.0 to P0.7 and P2.0 to P2.2, as a function
of the supply voltage (VDD).
Fig.11 Typical output sink current (IOL), outputs
P2.3/SDA and SCLK, as a function of the
supply voltage (VDD).
MGG413
20
IOL
MGG414
160
handbook, halfpage
handbook, halfpage
IOH
(µA)
(mA)
(1)
16
120
(2)
12
80
8
40
4
0
0
0
2
4
6
VDD (V)
8
0
2
4
6
VDD (V)
8
VO = 1.2 V.
(1) VO = VSS.
(2) VO = 0.7VDD.
Fig.12 Typical output sink current (IOL), outputs
P1.0 to P1.7, as a function of the supply
voltage (VDD).
Fig.13 Typical push-pull output source current
(IOH) as a function of the supply voltage
(VDD).
1996 Nov 25
12
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
10 AC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.(2)
MAX.
UNIT
tr
rise time all outputs
note 1
−
30
−
ns
tf
fall time all outputs
note 1
−
30
−
ns
Tcy
cycle time
30CP; note 2
3
−
30
µs
PCF84C00/non-standard pins:
tCC
control pulse width
Fig.16
−
9CP
−
µs
tAS
address to PSEN set-up
Fig.16
−
1.5CP
−
µs
tDS
data to PSEN set-up
Fig.16
−
2CP
−
µs
tDR
data hold time
Fig.16
0
−
−
ns
tSDO
data out to DWXR set-up
Fig.17
−
2CP
−
µs
tHDO
data out to DXWR hold
Fig.17
−
1CP
−
µs
tSLPH
time from DXALE to PSEN Figs 14, 15 and 17
−
1.5CP
−
µs
tDS1
data-in to DXRD set-up
Figs 14, 15 and 17
−
2.5CP
−
µs
tDR1
data-in to DXRD hold
Figs 14 and 17
0
−
−
ns
tDXALE
HIGH time of DXALE
Figs 14, 15 and 17
−
4.5CP
−
µs
tDXRD
LOW time of DXRD
Figs 14 and 17
−
6CP
−
µs
tDXWR
LOW time of DXWR
Figs 15 and 17
−
3CP
−
µs
Notes
1. At VDD = 5 V; Tamb = 25 °C; CL = 50 pF.
2. 1 time slot (TS) = 3CP, 1 clock pulse (CP) = 1/fxtal.
1996 Nov 25
13
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
Ø1
handbook, full pagewidth
TIME
SLOT
1
2
9
10
1
2
3
4
cycle 1
5
6
7
8
9
10
cycle 2
PSEN
derivative
register
address
D7-D0
(Dx)
8D
tDR1
tSLPH
tDS1
DXALE
tDXRD
tDXALE
DXRD
MGG405
Fig.14 MOV A, Dx timing (PCF84C00T only).
Ø1
handbook, full pagewidth
TIME
SLOT
1
2
9
10
1
2
3
cycle 1
4
5
6
7
8
9
10
cycle 2
PSEN
derivative
register
address
D7-D0
8C
(ACC)
tSLPH
tHDO
tSDO
DXALE
tDXWR
tDXALE
DXWR
MGG406
Fig.15 MOV Dx, A timing (PCF84C00T only).
1996 Nov 25
14
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
Ø1
handbook, full pagewidth
TIME
SLOT
7
8
9
10
1
2
3
4
5
6
7
tCC
PSEN
tDR
tAS
A12-A0
tDS
D7-D0
VALID
MGG407
Fig.16 External memory access timing (PCF84C00T and PCF84C00B).
handbook, full pagewidth
Ø1
TIME
SLOT
1
2
9
10
1
2
3
4
cycle 1
5
6
7
8
9
10
cycle 2
PSEN
derivative
register
address
D7-D0
8E 8F
(Dx)
tSLPH
(ACC)
tDR1
tDS1
tHDO
tSDO
DXALE
tDXALE
tDXRD
DXRD
tDXWR
DXWR
MGG408
Fig.17 ANL/ORL derivative interface timing (PCF84C00T only).
1996 Nov 25
15
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
Table 3
PCF84C00
I2C-bus timing
SYMBOL
INPUT
(see Fig.18)
PARAMETER
OUTPUT
(see Fig.19; note 1)
SCLK
tHD;STA
START condition hold time
14
≥ -------f xtal
tLOW
SCLK LOW time
17
≥ -------f xtal
DF – 3
-----------------2 × f xtal
tHIGH
SCLK HIGH time
17
≥ -------f xtal
DF + 3
------------------ ; note 2
2 × f xtal
tRC
SCLK rise time
≤1 µs
≤1 µs; note 3
tFC
SCLK fall time
≤0.3 µs
≤0.1 µs; note 4
tBUF
bus free time
14
≥ -------f xtal
tSU;DAT
data set-up time
≥250 ns
tHD;DAT
data hold time
tRD
SDA/P2.3 rise time
≤1 µs
≤1 µs; note 3
tFD
SDA/P2.3 fall time
≤0.3 µs
≤0.1 µs; note 4
tSU;STO
STOP condition set-up time
14
≥ -------f xtal
DF + 9
-----------------2 × f xtal
; note 2
SDA
≥ 4.7 µs; note 5
≥0
Notes
1. DF stands for Division Factor: the divisor of fxtal (see the “PCF84CxxxA family” data sheet).
3 ( DF + 1 )
DF – 3
2. Values given for ASC = 0; for ASC =1: tHIGH = ---------------------------- ; tLOW = -----------------4 × f xtal
4 × f xtal
3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor.
4. At maximum allowed I2C-bus capacitance Cb = 400 pF.
5. Determined by program.
t LOW – 9
24
6. If tLOW < -------- , tSU:DAT≥ --------------------- , independent of ASC.
f xtal
f xtal
1996 Nov 25
16
15
≥ -------f xtal
; note 6
9
≥ -------f xtal
DF – 3
-----------------2 × f xtal
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
0.7 V DD
SCLK
0.3 VDD
t LOW
t HIGH
0.7 V DD
SDA/P2.3
0.3 VDD
t BUF
t HD;STA
t RD
t RC
t HD;DAT
t FC
t SU;DAT
t FD
t SU;STO
MBB568
Fig.18 Slave SCLK receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs).
t LOW
0.9 VDD
SCLK
VOLmax
t HIGH
t FD
t FC
0.9 V DD
SDA/P2.3
acknowledge bit
t HD;STA
t HD;DAT
t HD;DAT
V OLmax
t HD;DAT
t SU;STO
t SU;DAT
MBB569
t SU;DAT
Fig.19 Master SCLK and transmitter SDA/P2,3 timing (SCLK and SDA/P2.3 are outputs).
1996 Nov 25
17
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
handbook, full pagewidth
A11 to A00
8
8
P0
PSEN
EPROM
(2732
2716)
8
D
P1
D×0
8
5
8
CP
EN
P2
8
PCF84C00T
8
T1
D7-D0
8-BIT
LATCH
8
DECODER
INT
D
RESET
D × n−1
CP
DXALE
EN
XTAL1
8
DXWR
DXRD
XTAL2
8
EXDI
MGG419
Fig.20 Block diagram of the external Dx register interface. The Dx interface can only be used with PCF84C00T.
1996 Nov 25
18
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
11 PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
1996 Nov 25
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
19
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
VSO56: plastic very small outline package; 56 leads
SOT190-1
D
E
A
X
c
y
HE
v M A
Z
56
29
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
detail X
28
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
3.3
0.3
0.1
3.0
2.8
0.25
0.42
0.30
0.22
0.14
21.65
21.35
11.1
11.0
0.75
15.8
15.2
2.25
1.6
1.4
1.45
1.30
0.2
0.1
0.1
0.90
0.55
0.13
0.012
0.004
0.12
0.11
0.01
0.017 0.0087 0.85
0.012 0.0055 0.84
0.44
0.43
0.03
0.62
0.60
0.063
0.089
0.055
inches
0.057
0.035
0.008 0.004 0.004
0.051
0.022
θ
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
96-04-02
SOT190-1
1996 Nov 25
EUROPEAN
PROJECTION
20
o
7
0o
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
12 SOLDERING
12.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
12.3.2
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
12.2
12.2.1
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
12.3
12.3.1
12.3.3
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO and VSO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
VSO packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Nov 25
WAVE SOLDERING
Wave soldering techniques can be used for all SO and
VSO packages if the following conditions are observed:
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
12.2.2
PCF84C00
21
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
PCF84C00
13 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
14 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
15 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Nov 25
22
Philips Semiconductors
Product specification
8-bit microcontroller with I2C-bus interface
NOTES
1996 Nov 25
23
PCF84C00
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 247 9145, Fax. +7 095 247 9144
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
457021/1200/02/pp24
Date of release: 1996 Nov 25
Document order number:
9397 750 01025