PHILIPS 74ABT16543

INTEGRATED CIRCUITS
74ABT16543
74ABTH16543
16-bit latched transceivers with
dual enable (3-State)
Product specification
Supersedes data of 1995 Aug 17
IC23 Data Handbook
1998 Feb 27
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
FEATURES
74ABT16543
74ABTH16543
DESCRIPTION
• Two 8-bit octal transceivers with D-type latch
• Live insertion/extraction permitted
• Power-up 3-State
• Power-up reset
• Multiple VCC and GND pins minimize switching noise
• Back-to-back registers for storage
• Separate controls for data flow in each direction
• 74ABTH16543 incorporates bus-hold data inputs which eliminate
The 74ABT16543 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT16543 16-bit registered transceiver contains two sets of
D-type latches for temporary storage of data flowing in either
direction. Separate Latch Enable (nLEAB, nLEBA) and Output
Enable (nOEAB, nOEBA) inputs are provided for each register to
permit independent control of data transfer in either direction. The
outputs are guaranteed to sink 64mA.
Two options are available, 74ABT16543 which does not have the
bus-hold feature and 74ABTH16543 which incorporates the
bus-hold feature.
the need for external pull-up resistors to hold unused inputs
• Output capability: +64mA/–32mA
• Latch-up protection exceeds 500mA per JEDEC Std 17
• ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
• See 74ABT161543 for same function with Master Reset control
pins
QUICK REFERENCE DATA
SYMBOL
CONDITIONS
Tamb = 25°C; GND = 0V
PARAMETER
TYPICAL
UNIT
2.5
2.2
ns
pF
tPLH
tPHL
Propagation delay
nAx to nBx
CL = 50pF; VCC = 5V
CIN
Input capacitance
VI = 0V or VCC
3
CI/O
I/O capacitance
VO = 0V or VCC; 3-State
7
pF
550
µA
9
mA
ICCZ
Quiescent su
supply
ly current
ICCL
Outputs disabled; VCC = 5.5V
Outputs low; VCC = 5.5V
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
56-Pin Plastic SSOP Type III
–40°C to +85°C
74ABT16543 DL
BT16543 DL
SOT371-1
56-Pin Plastic TSSOP Type II
–40°C to +85°C
74ABT16543 DGG
BT16543 DGG
SOT364-1
56-Pin Plastic SSOP Type III
–40°C to +85°C
74ABTH16543 DL
BH16543 DL
SOT371-1
56-Pin Plastic TSSOP Type II
–40°C to +85°C
74ABTH16543 DGG
BH16543 DGG
SOT364-1
PIN DESCRIPTION
PIN NUMBER
SYMBOL
5, 6, 8, 9, 10, 12, 13, 14
15, 16, 17, 19, 20, 21, 23, 24
1A0 – 1A7,
2A0 – 2A7
Data inputs/outputs
52, 51, 49, 48, 47, 45, 44, 43
42, 41, 40,38, 37, 36, 34, 33
1B0 – 1B7,
2B0 – 2B7
Data inputs/outputs
1, 56
28, 29
1OEAB, 1OEBA,
2OEAB, 2OEBA
3, 54
26, 31
1EAB, 1EBA,
2EAB, 2EBA
2, 55
27, 30
1LEAB, 1LEBA,
2LEAB, 2LEBA
4, 11, 18, 25, 32, 39, 46, 53
GND
Ground (0V)
7, 22, 35, 50
VCC
Positive supply voltage
1998 Feb 27
NAME AND FUNCTION
A to B / B to A Output Enable inputs (active-Low)
A to B / B to A Enable inputs (active-Low)
A to B / B to A Latch Enable inputs (active-Low)
2
853-1739 19026
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
LOGIC SYMBOL (IEEE/IEC)
74ABT16543
74ABTH16543
PIN CONFIGURATION
1OEAB
1
56
1OEBA
1LEAB
2
55
1LEBA
1EAB
3
54
1EBA
GND
4
53
GND
2EN4
1A0
5
52
1B0
3
G2
1A1
6
51
1B1
1LEAB
2
2C6
VCC
7
50
VCC
2OEBA
29
7EN9
1A2
8
49
1B2
2EBA
31
G7
1A3
9
48
1B3
2LEBA
30
7C11
1A4
10
47
1B4
2OEAB
28
GND
11
46
GND
2EAB
26
1A5
12
45
1B5
1A6
13
44
1B6
1A7
14
43
1B7
2A0
15
42
2B0
1OEBA
56
1EBA
54
1LEBA
55
1C5
1OEAB
1
1EAB
2LEAB
27
1EN3
G1
8EN10
G8
8C12
1A0
5
2A1
16
41
2B1
1A1
6
51
1B1
2A2
17
40
2B2
1A2
8
49
1B2
GND
18
39
GND
1A3
9
48
1B3
2A3
19
38
2B3
1A4
10
47
1B4
2A4
20
37
2B4
1A5
12
45
1B5
2A5
21
36
2B5
1A6
13
44
1B6
22
35
VCC
1A7
14
VCC
2A0
15
∇3
5D
6D
4∇
∇9
11D
12D
10 ∇
52
1B0
43
1B7
2A6
23
34
2B6
42
2B0
2A7
24
33
2B7
GND
25
32
GND
2EAB
26
31
2EBA
2LEAB
27
30
2LEBA
2OEAB
28
29
2OEBA
2A1
16
41
2B1
2A2
17
40
2B2
2A3
19
2A4
20
37
2B4
2A5
21
36
2B5
2A6
23
34
2B6
2A7
24
33
2B7
38
2B3
SH00037
SH00036
1998 Feb 27
3
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
LOGIC SYMBOL
74ABT16543
74ABTH16543
FUNCTIONAL DESCRIPTION
The 74ABT16543 contains two sets of eight D-type latches, with
separate control pins for each set. Using data flow from A to B as an
example, when the A-to-B Enable (nEAB) input and the A-to-B Latch
Enable (nLEAB) input are Low the A-to-B path is transparent.
5
6
8
9
10
12
13
A subsequent Low-to-High transition of the nLEAB signal puts the A
data into the latches where it is stored and the B outputs no longer
change with the A inputs. With EAB and nOEAB both Low, the
3-State B output buffers are active and display the data present at
the outputs of the A latches.
14
1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7
3
1EAB
54
1EBA
1OEAB
1
2
1LEAB
1OEBA
56
55
1LEBA
Control of data flow from B to A is similar, but using the nEBA,
nLEBA, and nOEBA inputs.
1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7
52
51
49
48
47
45
44
43
15
16
17
19
20
21
23
24
2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7
26
2EAB
31
2EBA
2OEAB
28
27
2LEAB
2OEBA
29
30
2LEBA
2B0 2B1 2B2 2B3 2B4 2B5 2B6 2B7
42
41
40
38
37
36
34
33
SH00038
FUNCTION TABLE
INPUTS
H =
h =
L =
l =
X =
↑ =
NC=
Z =
OUTPUTS
STATUS
nOEXX
nEXX
nLEXX
nAx or nBx
nBx or nAx
H
X
X
X
Z
Disabled
X
H
X
X
Z
Disabled
L
L
↑
↑
L
L
h
l
Z
Z
Disabled + Latch
L
L
L
L
↑
↑
h
l
H
L
Latch + Display
L
L
L
L
L
L
H
L
H
L
Transparent
L
L
H
X
NC
Hold
High voltage level
High voltage level one set-up time prior to the Low-to-High transition of nLEXX or nEXX (XX = AB or BA)
Low voltage level
Low voltage level one set-up time prior to the Low-to-High transition of nLEXX or nEXX (XX = AB or BA)
Don’t care
Low-to-High transition of nLEXX or nEXX (XX = AB or BA)
No change
High impedance or “off” state
1998 Feb 27
4
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
74ABT16543
74ABTH16543
LOGIC DIAGRAM
DETAIL A
D
nB0
Q
LE
nA0
Q
D
LE
nA1
nB1
nA2
nB2
nA3
nA4
nB3
DETAIL A X 7
nB4
nA5
nB5
nA6
nB6
nA7
nB7
nOEBA
nOEAB
nEBA
nEAB
nLEBA
nLEAB
SH00039
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL
VCC
PARAMETER
CONDITIONS
RATING
UNIT
–0.5 to +7.0
V
–18
mA
–1.2 to +7.0
V
VO < 0
–50
mA
output in Off or High state
–0.5 to +5.5
V
output in Low state
128
mA
output in High state
–64
mA
–65 to 150
°C
DC supply voltage
IIK
DC input diode current
VI
DC input voltage3
IOK
DC output diode current
voltage3
VOUT
DC output
IOUT
O
DC output current
Tstg
Storage temperature range
VI < 0
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Feb 27
5
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
74ABT16543
74ABTH16543
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
LIMITS
PARAMETER
DC supply voltage
UNIT
Min
Max
4.5
5.5
V
0
VCC
V
VI
Input voltage
VIH
High-level input voltage
VIL
Low-level Input voltage
0.8
V
IOH
High-level output current
–32
mA
IOL
Low-level output current
2.0
∆t/∆v
Input transition rise or fall rate
Tamb
Operating free-air temperature range
V
64
mA
0
10
ns/V
–40
+85
°C
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
VIK
VOH
VOL
VRST
II
IHOLD
Input clamp voltage
High-level output voltage
Low-level output voltage
Power-up output
voltage3
Input leakage
g
current
Bus Hold current A or B
Ports5 74ABTH16543
Tamb = –40°C
to +85°C
Tamb = +25°C
TYP
VCC = 4.5V; IIK = –18mA
MAX
MIN
–1.2
UNIT
MAX
–1.2
V
VCC = 4.5V; IOH = –3mA; VI = VIL or VIH
2.5
2.9
2.5
V
VCC = 5.0V; IOH = –3mA; VI = VIL or VIH
3.0
3.4
3.0
V
VCC = 4.5V; IOH = –32mA; VI = VIL or VIH
2.0
2.4
2.0
V
VCC = 4.5V; IOL = 64mA; VI = VIL or VIH
0.36
0.55
0.55
V
VCC = 5.5V; IO = 1mA; VI = GND or VCC
0.13
0.55
0.55
V
0 01
0.01
±1 0
±1.0
±1 0
±1.0
µA
5V; VI = GND or 5
5V
VCC = 5
5.5V
5.5V
Control
pins
VCC = 4.5V; VI = 0.8V
35
35
VCC = 4.5V; VI = 2.0V
–75
–75
VCC = 5.5V; VI = 0 to 5.5V
±800
µA
Power-off leakage current
VCC = 0.0V; VO or VI ≤ 4.5V
2.0
±100
±100
µA
Power-up/down 3-State
output current4
VCC = 2.1V; VO = 0.0V or VCC;
VI = GND or VCC; VOE = Don’t care
1.0
±50
±50
µA
IIH + IOZH
3-State output High current
VCC = 5.5V; VO = 5.5V; VI = VIL or VIH
1.0
10
10
µA
IIL + IOZL
3-State output Low current
VCC = 5.5V; VO = 0.0V; VI = VIL or VIH
–1.0
–10
–10
µA
Output High leakage current
VCC = 5.5V; VO = 5.5V; VI = GND or VCC
1.0
50
50
µA
Output current1
VCC = 5.5V; VO = 2.5V
–100
–200
–200
mA
IOFF
IPU/PD
ICEX
IO
–50
–50
ICCH
VCC = 5.5V; Outputs High, VI = GND or VCC
0.55
2
2
mA
ICCL
VCC = 5.5V; Outputs Low, VI = GND or VCC
9
19
19
mA
VCC = 5.5V; Outputs 3–State;
VI = GND or VCC
0.55
2
2
mA
Quiescent su
supply
ly current
ICCZ
∆ICC
Additional supply current
per input pin2
74ABT16543
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
5.0
50
50
µA
∆ICC
Additional supply current
per input pin2
74ABTH16543
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
200
500
500
µA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
transition time of up to 100µsec is permitted.
5. This is the bus hold overdrive current required to force the input to the opposite logic state.
1998 Feb 27
6
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
74ABT16543
74ABTH16543
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
LIMITS
SYMBOL
PARAMETER
+25oC
Tamb = –40 to +85oC
VCC = +5.0V ±0.5V
Tamb =
VCC = +5.0V
WAVEFORM
UNIT
MIN
TYP
MAX
MIN
MAX
2
1.0
1.0
2.5
2.2
3.3
4.4
1.0
1.0
3.8
5.1
ns
tPLH
tPHL
Propagation delay
nAx to nBx, nBx to nAx
tPLH
tPHL
Propagation delay
LEBA to nAx, LEAB to nBx
1, 2
1.0
1.2
3.1
3.0
4.3
4.8
1.0
1.2
5.2
5.6
ns
tPZH
tPZL
Output enable time
OEBA to nAx, OEAB to nBx
4
5
1.0
1.1
3.3
3.3
4.3
5.9
1.0
1.1
5.2
7.0
ns
tPHZ
tPLZ
Output disable time
OEBA to nAx, OEAB to nBx
4
5
1.9
1.6
3.5
2.6
5.0
4.2
1.9
1.6
5.7
4.6
ns
tPZH
tPZL
Output enable time
EBA to nAx, EAB to nBx
4
5
1.0
1.2
3.4
3.4
4.9
6.5
1.0
1.2
6.2
7.8
ns
tPHZ
tPLZ
Output disable time
EBA to nAx, EAB to nBx
4
5
2.0
1.7
3.4
2.6
5.6
5.1
2.0
1.7
6.6
5.4
ns
AC SETUP REQUIREMENTS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
LIMITS
SYMBOL
PARAMETER
WAVEFORM
+25oC
Tamb = –40 to +85oC
VCC = +5.0V ±0.5V
Tamb =
VCC = +5.0V
MIN
TYP
MIN
UNIT
ts(H)
ts(L)
Setup time
nAx to LEAB, nBx to LEBA
3
1.5
3.5
0.4
–0.1
1.5
3.5
ns
th(H)
th(L)
Hold time
nAx to LEAB, nBx to LEBA
3
1.5
2.0
0.2
–0.3
1.5
2.0
ns
ts(H)
ts(L)
Setup time
nAx to EAB, nBx to EBA
3
1.5
3.5
0.2
–0.3
1.5
3.5
ns
th(H)
th(L)
Hold time
nAx to EAB, nBx to EBA
3
1.5
2.0
0.3
–0.2
1.5
2.0
ns
tw(L)
Latch enable pulse width, Low
3
4.0
3.1
4.0
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
VIN
VM
tPHL
VOUT
VIN
VM
VOUT
VM
SH00040
tPHL
VM
VM
SH00041
Waveform 1. Propagation Delay For Inverting Output
1998 Feb 27
VM
tPLH
tPLH
VM
VM
Waveform 2. Propagation Delay For Non-Inverting Output
7
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
74ABT16543
74ABTH16543
AC WAVEFORMS (Continued)
VM = 1.5V, VIN = GND to 3.0V
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
nAx, nBx
VM
VM
ts(H)
VM
ts(L)
th(H)
nLEAB, nLEBA,
nEAB, nEBA
VM
nOEAB, nOEBA,
nEAB, nEBA
VM
VM
th(L)
tw(L)
VM
tPZL
VM
nAx, nBx
VM
tPLZ
VOL +0.3V
VOL
NOTE: The shaded areas indicate when the input is permitted
to change for predictable output performance.
SH00042
SH00044
Waveform 3. Data Setup and Hold Times and Latch Enable
Pulse Width
nOEAB, nOEBA,
nEAB, nEBA
VM
Waveform 5. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
VM
tPZH
tPHZ
VOH
VOH –0.3V
VM
nAx, nBx
0V
SH00043
Waveform 4. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
TEST CIRCUIT AND WAVEFORMS
VCC
7.0V
PULSE
GENERATOR
VOUT
VIN
tW
90%
VM
NEGATIVE
PULSE
RL
10%
0V
tTLH (tR)
tTHL (tF)
CL
tTLH (tR)
RL
tTHL (tF)
90%
POSITIVE
PULSE
Test Circuit for 3-State Outputs
AMP (V)
90%
VM
VM
10%
10%
tW
SWITCH POSITION
TEST
SWITCH
tPLZ
closed
tPZL
closed
All other
open
0V
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
AMP (V)
VM
10%
D.U.T.
RT
90%
FAMILY
74ABT/H16
Amplitude
Rep. Rate
tW
tR
tF
3.0V
1MHz
500ns
2.5ns
2.5ns
SA00018
1998 Feb 27
8
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm
1998 Feb 27
9
74ABT16543
74ABTH16543
SOT371-1
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
1998 Feb 27
10
74ABT16543
74ABTH16543
SOT364-1
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
NOTES
1998 Feb 27
11
74ABT16543
74ABTH16543
Philips Semiconductors
Product specification
16-bit latched transceivers with dual enable
(3-State)
74ABT16543
74ABTH16543
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
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otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
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