SHENZHENFREESCALE AOU1N60

AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
General Description
The AOD1N60 & AOU1N60 & AOI1N60 have been fabricated using an advanced high voltage MOSFET
process that is designed to deliver high levels of performance and robustness in popular AC-DC applications.
By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply designs.
Features
VDS
700V@150℃
ID (at VGS=10V)
1.3A
RDS(ON) (at VGS=10V)
< 9Ω
g
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TC=25°C
Continuous Drain
CurrentB
Pulsed Drain Current
TC=100°C
C
Units
V
±30
V
1.3
ID
0.8
A
IDM
4
Avalanche Current C
IAR
1
A
Repetitive avalanche energy C
EAR
15
mJ
Single pulsed avalanche energy H
Peak diode recovery dv/dt
TC=25°C
Power Dissipation B Derate above 25oC
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
EAS
dv/dt
30
5
45
mJ
V/ns
W
0.36
-50 to 150
W/ oC
°C
300
°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,G
Maximum Case-to-sink A
Maximum Junction-to-CaseD,F
1/6
Maximum
600
PD
TJ, TSTG
TL
Symbol
RθJA
RθCS
RθJC
Typical
45
Maximum
55
Units
°C/W
2.3
0.5
2.8
°C/W
°C/W
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AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
600
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID=250µA, VGS=0V, TJ=150°C
700
V
ID=250µA, VGS=0V
0.6
V/ oC
VDS=600V, VGS=0V
1
VDS=480V, TJ=125°C
10
Gate-Body leakage current
VDS=0V, VGS=±30V
100
Gate Threshold Voltage
VDS=5V,ID=250µA
3
µA
4.1
4.5
nΑ
V
9
Ω
1
V
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=0.65A
7.5
gFS
Forward Transconductance
VDS=40V, ID=0.65A
0.9
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.65
S
IS
Maximum Body-Diode Continuous Current
1
A
ISM
Maximum Body-Diode Pulsed Current
4
A
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
VGS=10V, VDS=480V, ID=1A
105
130
160
pF
12
14.5
18
pF
1.5
1.8
2.2
pF
2.9
3.5
5.3
Ω
6.1
8
nC
Qgs
Gate Source Charge
1.3
2
nC
Qgd
Gate Drain Charge
3.1
4
nC
tD(on)
Turn-On DelayTime
10
13
ns
tr
Turn-On Rise Time
6.7
13
ns
tD(off)
Turn-Off DelayTime
20
26
ns
tf
trr
Turn-Off Fall Time
11.5
23
ns
Body Diode Reverse Recovery Time
IF=1.3A,dI/dt=100A/µs,VDS=100V
114
137
Qrr
Body Diode Reverse Recovery Charge IF=1.3A,dI/dt=100A/µs,VDS=100V
0.63
0.76
ns
µC
VGS=10V, VDS=300V, ID=1A,
RG=25Ω
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C in a TO252 package, using junction-to-case thermal resistance, and is more useful in
setting the upper dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C.
G.These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
H. L=60mH, IAS=1A, VDD=150V, RG=10Ω, Starting TJ=25°C
2/6
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AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2
10
10V
-55°C
VDS=40V
6.5V
1
ID(A)
ID (A)
1.5
6V
125°C
1
0.5
25°C
VGS=5.5V
0
0.1
0
5
10
15
20
25
30
2
VDS (Volts)
Fig 1: On-Region Characteristics
6
8
10
VGS(Volts)
Figure 2: Transfer Characteristics
2.5
14.0
Normalized On-Resistance
13.0
12.0
RDS(ON) (Ω
Ω)
4
VGS=10V
11.0
10.0
9.0
8.0
7.0
VGS=10V
ID=0.5A
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
-100
1.2
-50
0
50
100
150
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
1.0E+01
1.0E+00
40
1.1
1.0E-01
1
125°
25°C
1.0E-02
0.9
25°
0.8
1.0E-03
1.0E-04
-100
3/6
125°C
IS (A)
BVDSS (Normalized)
ID=30A
-50
0
50
100
150
200
TJ (oC)
Figure 5: Break Down vs. Junction Temperature
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1000
15
Capacitance (pF)
VGS (Volts)
Ciss
VDS=480V
ID=1A
12
9
6
100
Coss
10
Crss
3
1
0
0
2
4
6
Qg (nC)
Figure 7: Gate-Charge Characteristics
0.1
8
10
1
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
800
10µs
100µs
ID (Amps)
RDS(ON)
limited
1ms
10ms
0.1s
0.1
TJ(Max)=150°C
TC=25°C
DC
TJ(Max)=150°C
TC=25°C
600
Power (W)
1
400
200
0.01
0
1
10
100
1000
0.0001
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note F)
Zθ JC Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=2.8C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
0.1
PD
Single Pulse
Ton
T
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
4/6
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AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1.5
50
1.2
Current rating ID(A)
Power Dissipation (W)
60
40
30
20
0.9
0.6
0.3
10
0
0.0
0
25
50
75
100
125
TCASE (°C)
Figure 12: Power De-rating (Note B)
150
0
25
50
75
100
125
TCASE (°C)
Figure 13: Current De-rating (Note B)
150
400
TJ(Max)=150°C
TA=25°C
Power (W)
300
200
100
0
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)
100
1000
Zθ JA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=55°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
Single Pulse
T
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)
5/6
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AOD1N60/AOU1N60/AOI1N60
600V,1.3A N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+
VDC
-
VDC
DUT
Qgs
Vds
Qgd
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+
Vgs
Vgs
VDC
-
Rg
Vdd
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
6/6
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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