ADPOW APTM50HM75STG

APTM50HM75STG
Full bridge
Series & parallel diodes
MOSFET Power Module
Application
• Motor control
• Switched Mode Power Supplies
• Uninterruptible Power Supplies
VB US
CR3A
CR3B
Q3
G3
G1
O UT1 O UT2
S1
CR4A
CR2A
Q2
S3
CR2B
CR4B
Q4
G2
G4
S2
S4
0/V BUS
NTC1
NTC2
G3
G4
S3
S4
VBUS
0/VB US
OUT2
OUT1
S1
S2
NTC2
G1
G2
NTC1
Features
• Power MOS 7® MOSFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
• Kelvin source for easy drive
• Very low stray inductance
- Symmetrical design
- Lead frames for power connections
• Internal thermistor for temperature monitoring
• High level of integration
Benefits
• Outstanding performance at high frequency operation
• Direct mounting to heatsink (isolated package)
• Low junction to case thermal resistance
• Solderable terminals both for power and signal for
easy PCB mounting
• Low profile
• RoHS compliant
Absolute maximum ratings
Symbol
VDSS
ID
IDM
VGS
RDSon
PD
IAR
EAR
EAS
Parameter
Drain - Source Breakdown Voltage
Tc = 25°C
Tc = 80°C
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
Tc = 25°C
Max ratings
500
46
34
184
±30
90
357
46
50
2500
Unit
V
A
November, 2005
CR1B
Q1
V
mΩ
W
A
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
APT website – http://www.advancedpower.com
1–7
APTM50HM75STG – Rev 3
CR1A
VDSS = 500V
RDSon = 75mΩ typ @ Tj = 25°C
ID = 46A @ Tc = 25°C
APTM50HM75STG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
RDS(on)
VGS(th)
IGSS
Test Conditions
Zero Gate Voltage Drain Current
VGS = 0V,VDS = 500V
VGS = 0V,VDS = 400V
Drain – Source on Resistance
Gate Threshold Voltage
Gate – Source Leakage Current
VGS = 10V, ID = 23A
VGS = VDS, ID = 2.5mA
VGS = ±30 V, VDS = 0V
Dynamic Characteristics
Symbol
Ciss
Coss
Crss
Qg
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain Charge
Td(on)
Turn-on Delay Time
Tr
Td(off)
Turn-off Delay Time
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Test Conditions
VGS = 0V
VDS = 25V
f = 1MHz
IF
VF
DC Forward Current
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF = 30A
IF = 60A
IF = 30A
IF = 30A
VR = 133V
di/dt = 200A/µs
Unit
Max
Unit
µA
mΩ
V
nA
pF
nC
65
Test Conditions
VR=200V
Typ
5600
1200
90
123
Max
100
500
90
5
±100
33
18
35
77
755
1241
µJ
846
Typ
Max
250
500
Tj = 125°C
30
1.1
1.4
0.9
Tj = 25°C
24
Tj = 125°C
48
Tj = 25°C
33
Tj = 125°C
150
APT website – http://www.advancedpower.com
µJ
726
Min
200
Tj = 25°C
Tj = 125°C
Tc = 85°C
ns
87
Inductive switching @ 125°C
VGS = 15V, VBus = 333V
ID = 46A, R G = 5Ω
Maximum Reverse Leakage Current
Diode Forward Voltage
Min
Inductive switching @ 25°C
VGS = 15V, VBus = 333V
ID = 46A, R G = 5Ω
Symbol Characteristic
VRRM Maximum Peak Repetitive Reverse Voltage
IRM
75
VGS = 10V
VBus = 250V
ID = 46A
Series diode ratings and characteristics
Typ
3
Inductive switching @ 125°C
VGS = 15V
VBus = 333V
ID = 46A
R G = 5Ω
Rise Time
Tf
Min
T j = 25°C
T j = 125°C
Unit
V
µA
A
1.15
V
November, 2005
IDSS
Characteristic
ns
nC
2–7
APTM50HM75STG – Rev 3
Symbol
APTM50HM75STG
Parallel diode ratings and characteristics
Symbol Characteristic
VRRM Maximum Peak Repetitive Reverse Voltage
IF
VF
Maximum Reverse Leakage Current
VR=600V
DC Forward Current
IF = 30A
IF = 60A
IF = 30A
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF = 30A
VR = 400V
di/dt = 200A/µs
Min
600
Tj = 25°C
Tj = 125°C
Tc = 70°C
Tj = 125°C
Tj = 25°C
85
Tj = 125°C
160
Tj = 25°C
130
Tj = 125°C
700
Symbol Characteristic
VISOL
TJ
TSTG
TC
Torque
Wt
Min
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Typ
Transistor
Diode
Junction to Case Thermal Resistance
To heatsink
M5
Max
250
500
30
1.6
1.9
1.4
Thermal and package characteristics
RthJC
Typ
A
V
ns
nC
Max
0.35
1.2
2500
-40
-40
-40
1.5
R 25
Unit
°C/W
V
150
125
100
4.7
160
Typ
50
3952
Max
°C
N.m
g
Unit
kΩ
K
T: Thermistor temperature

 1 1  RT : Thermistor value at T
exp B 25 / 85 
− 
 T25 T 

November, 2005
RT =
Min
µA
1.8
Temperature sensor NTC (see application note APT0406 on www.advancedpower.com for more information).
Symbol Characteristic
R25
Resistance @ 25°C
B 25/85 T25 = 298.15 K
Unit
V
APT website – http://www.advancedpower.com
3–7
APTM50HM75STG – Rev 3
IRM
Test Conditions
APTM50HM75STG
SP4 Package outline (dimensions in mm)
APT website – http://www.advancedpower.com
4–7
APTM50HM75STG – Rev 3
November, 2005
ALL DIMENSIONS MARKED " * " ARE TOLERENCED AS :
APTM50HM75STG
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.35
0.9
0.3
0.7
0.25
0.5
0.2
0.15
0.3
0.1
0.1
0.05
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
rectangular Pulse Duration (Seconds)
Low Voltage Output Characteristics
160
Transfert Characteristics
8V
VGS=10&15V
140
I D, Drain Current (A)
7.5V
120
100
7V
80
6.5V
60
40
6V
20
5.5V
VDS > ID(on)xR DS(on)MAX
250µs pulse test @ < 0.5 duty cycle
100
80
60
40
TJ =25°C
20
TJ =125°C
TJ=-55°C
0
0
0
5
10
15
20
VDS, Drain to Source Voltage (V)
25
0
RDS(on) vs Drain Current
Normalized to
VGS=10V @ 23A
1.15
3
4
5
6
7
8
DC Drain Current vs Case Temperature
VGS=10V
1.10
1.05
2
50
I D, DC Drain Current (A)
1.20
1
VGS, Gate to Source Voltage (V)
VGS=20V
1.00
0.95
0.90
0.85
0.80
40
30
20
10
0
0
20
40
60
ID, Drain Current (A)
80
100
25
50
75
100
125
TC, Case Temperature (°C)
APT website – http://www.advancedpower.com
November, 2005
I D, Drain Current (A)
10
120
180
RDS(on) Drain to Source ON Resistance
1
150
5–7
APTM50HM75STG – Rev 3
Thermal Impedance (°C/W)
0.4
1.1
1.0
0.9
0.8
0.7
-50 -25
0
25 50
75 100 125 150
ON resistance vs Temperature
2.5
VGS=10V
ID=23A
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
TJ, Junction Temperature (°C)
Threshold Voltage vs Temperature
Maximum Safe Operating Area
1000
1.1
ID, Drain Current (A)
1.0
0.9
0.8
0.7
0.6
limited by RDSon
100µs
10
1ms
10ms
1
Single pulse
TJ =150°C
100ms
0.1
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
1
Capacitance vs Drain to Source Voltage
VGS , Gate to Source Voltage (V)
100000
C, Capacitance (pF)
limited by R DSon
100
Ciss
10000
Coss
1000
Crss
100
10
0
10
20
30
40
VDS, Drain to Source Voltage (V)
50
10
100
1000
VDS, Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
14
V DS =100V
I D=46A
12 T =25°C
J
V =250V
DS
10
VDS=400V
8
6
4
2
0
0
20
APT website – http://www.advancedpower.com
40 60 80 100 120 140 160
Gate Charge (nC)
November, 2005
VGS (TH), Threshold Voltage
(Normalized)
1.2
6–7
APTM50HM75STG – Rev 3
BVDSS, Drain to Source Breakdown
Voltage (Normalized)
Breakdown Voltage vs Temperature
1.2
RDS(on), Drain to Source ON resistance
(Normalized)
APTM50HM75STG
APTM50HM75STG
Delay Times vs Current
Rise and Fall times vs Current
120
td(off)
80
VDS=333V
RG=5Ω
TJ=125°C
L=100µH
60
40
td(on)
20
80
60
40
tr
0
10
20
30
40
50
60
I D, Drain Current (A)
10
70
VDS=333V
RG=5Ω
TJ=125°C
L=100µH
2
1.5
40
50
60
70
Switching Energy vs Gate Resistance
Eon
Eoff
1
30
4
Switching Energy (mJ)
2.5
20
I D, Drain Current (A)
Switching Energy vs Current
0.5
VDS=333V
ID=46A
T J=125°C
L=100µH
3.5
3
2.5
Eoff
2
Eon
1.5
1
Eoff
0.5
0
0
30
40
50
60
0
70
10
ID, Drain Current (A)
Operating Frequency vs Drain Current
300
ZCS
250
IDR, Reverse Drain Current (A)
V DS=333V
D=50%
R G=5Ω
T J=125°C
T C=75°C
ZVS
200
150
100
hard
switching
50
0
10
15
20
25
30
ID, Drain Current (A)
30
40
50
Gate Resistance (Ohms)
400
350
20
35
40
1000
100
Source to Drain Diode Forward Voltage
TJ =150°C
10
TJ=25°C
1
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
VSD, Source to Drain Voltage (V)
November, 2005
20
APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
APT website – http://www.advancedpower.com
7–7
APTM50HM75STG – Rev 3
10
Frequency (kHz)
tf
20
0
Switching Energy (mJ)
VDS=333V
RG=5Ω
T J=125°C
L=100µH
100
t r and tf (ns)
t d(on) and td(off) (ns)
100