Integrated Synthesizer and VCO ADF4360-2 Data Sheet FEATURES GENERAL DESCRIPTION Output frequency range: 1850 MHz to 2170 MHz Divide-by-2 output 3.0 V to 3.6 V power supply 1.8 V logic compatibility Integer-N synthesizer Programmable dual-modulus prescaler 8/9, 16/17, 32/33 Programmable output power level 3-wire serial interface Analog and digital lock detect Hardware and software power-down mode The ADF4360-2 is a fully integrated integer-N synthesizer and voltage-controlled oscillator (VCO). The ADF4360-2 is designed for a center frequency of 2000 MHz. In addition, a divide-by-2 option is available, whereby the user gets an RF output of between 925 MHz and 1085 MHz. Control of all the on-chip registers is through a simple 3-wire interface. The device operates with a power supply ranging from 3.0 V to 3.6 V and can be powered down when not in use. APPLICATIONS Wireless handsets (DECT, GSM, PCS, DCS, WCDMA) Test equipment Wireless LANs CATV equipment FUNCTIONAL BLOCK DIAGRAM AVDD DVDD CE RSET ADF4360-2 MUXOUT MULTIPLEXER 14-BIT R COUNTER REFIN LOCK DETECT CLK DATA MUTE 24-BIT FUNCTION LATCH 24-BIT DATA REGISTER LE CHARGE PUMP CP PHASE COMPARATOR VVCO VTUNE CC CN INTEGER REGISTER RFOUTA VCO CORE 13-BIT B COUNTER 5-BIT A COUNTER MULTIPLEXER N = (BP + A) RFOUTB LOAD LOAD AGND DGND DIVSEL = 1 DIVSEL = 2 ÷2 04436-001 PRESCALER P/P+1 OUTPUT STAGE CPGND Figure 1. Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. 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Technical Support www.analog.com ADF4360-2 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 MUXOUT and Lock Detect...................................................... 10 Applications ....................................................................................... 1 Input Shift Register .................................................................... 10 General Description ......................................................................... 1 VCO ............................................................................................. 10 Functional Block Diagram .............................................................. 1 Output Stage................................................................................ 11 Revision History ............................................................................... 2 Latch Structure ........................................................................... 12 Specifications..................................................................................... 3 Power-Up ..................................................................................... 16 Timing Characteristics..................................................................... 5 Control Latch .............................................................................. 18 Absolute Maximum Ratings............................................................ 6 N Counter Latch ......................................................................... 19 Transistor Count ........................................................................... 6 R Counter Latch ......................................................................... 19 ESD Caution .................................................................................. 6 Applications..................................................................................... 20 Pin Configuration and Function Descriptions ............................. 7 Direct Conversion Modulator .................................................. 20 Typical Performance Characteristics ............................................. 8 Fixed Frequency LO ................................................................... 21 Circuit Description ........................................................................... 9 Interfacing ................................................................................... 21 Reference Input Section ............................................................... 9 PCB Design Guidelines for Chip Scale Package........................... 22 Prescaler (P/P + 1)........................................................................ 9 Output Matching ........................................................................ 22 A and B Counters ......................................................................... 9 Outline Dimensions ....................................................................... 23 R Counter ...................................................................................... 9 Ordering Guide .......................................................................... 23 PFD and Charge Pump ................................................................ 9 REVISION HISTORY 11/12—Rev. B to Rev. C Changes to Table 1 ............................................................................ 4 Changes to Table 3 ............................................................................ 6 Changes to Figure 3 and Table 4 ..................................................... 7 Change to Output Matching Section ........................................... 22 Updated Outline Dimensions ....................................................... 23 Changes to Ordering Guide .......................................................... 23 4/06—Rev. A to Rev. B Updated Format .................................................................. Universal Changes to Features and General Description ............................. 1 Changes to Table 1 ............................................................................ 3 Changes to VCO Section ............................................................... 11 Changes to Control Latch Section................................................ 18 Changes to Direct Conversion Modulator Section .................... 20 Changes to Ordering Guide .......................................................... 23 12/04—Rev. 0 to Rev. A Updated Format .................................................................. Universal Changes to Specifications .................................................................3 Changes to Timing Characteristics .................................................5 Changes to Power-Up Section ...................................................... 16 Added Table 10 ............................................................................... 16 Added Figure 16 ............................................................................. 16 Changes to Ordering Guide .......................................................... 23 Updated Outline Dimensions ....................................................... 23 1/04—Revision 0: Initial Version Rev. C | Page 2 of 24 Data Sheet ADF4360-2 SPECIFICATIONS 1 AVDD = DVDD = VVCO = 3.3 V ± 10%; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted. Table 1. Parameter REFIN CHARACTERISTICS REFIN Input Frequency B Version Unit Conditions/Comments 10/250 MHz min/max REFIN Input Sensitivity 0.7/AVDD 0 to AVDD 5.0 ±100 V p-p min/max V max pF max µA max For f < 10 MHz, use a CMOS-compatible square wave, slew rate > 21 V/µs AC-coupled CMOS-compatible 8 MHz max 2.5 0.312 2.7/10 0.2 2 1.5 2 mA typ mA typ kΩ nA typ % typ % typ % typ 1.5 0.6 ±1 3.0 V min V max µA max pF max DVDD − 0.4 500 0.4 V min µA max V max 3.0/3.6 AVDD AVDD 10 2.5 24.0 29.0 3.5 to 11.0 7 V min/V max REFIN Input Capacitance REFIN Input Current PHASE DETECTOR Phase Detector Frequency 2 CHARGE PUMP ICP Sink/Source 3 High Value Low Value RSET Range ICP Three-State Leakage Current Sink and Source Current Matching ICP vs. VCP ICP vs. Temperature LOGIC INPUTS VINH, Input High Voltage VINL, Input Low Voltage IINH/IINL, Input Current CIN, Input Capacitance LOGIC OUTPUTS VOH, Output High Voltage IOH, Output High Current VOL, Output Low Voltage POWER SUPPLIES AVDD DVDD VVCO AIDD 4 DIDD4 IVCO4, 5 IVCO4, 5 IRFOUT4 Low Power Sleep Mode4 With RSET = 4.7 kΩ mA typ mA typ mA typ mA typ mA typ µA typ Rev. C | Page 3 of 24 1.25 V ≤ VCP ≤ 2.5 V 1.25 V ≤ VCP ≤ 2.5 V VCP = 2.0 V CMOS output chosen IOL = 500 µA ICORE = 15 mA ICORE = 20 mA RF output stage is programmable ADF4360-2 Data Sheet Parameter RF OUTPUT CHARACTERISTICS5 VCO Output Frequency B Version Unit Conditions/Comments 1850/2170 MHz min/max ICORE = 20 mA, RF < 2 GHz ICORE = 15 mA, RF > 2 GHz VCO Sensitivity Lock Time 6 Frequency Pushing (Open Loop) Frequency Pulling (Open Loop) Harmonic Content (Second) Harmonic Content (Third) Output Power5, 7 Output Power Variation VCO Tuning Range NOISE CHARACTERISTICS5 VCO Phase-Noise Performance 8 57 400 6 15 −19 −37 −13/−6 ±3 1.25/2.7 MHz/V typ µs typ MHz/V typ kHz typ dBc typ dBc typ dBm typ dB typ V min/max −110 −133 −141 −147 −172 −163 −147 −83 0.64 −70 −42 dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ Degrees typ dBc typ dBm typ Synthesizer Phase-Noise Floor 9 In-Band Phase Noise 10, 11 RMS Integrated Phase Error 12 Spurious Signals due to PFD Frequency11, 13 Level of Unlocked Signal with MTLD Enabled To within 10 Hz of final frequency Into 2.00 VSWR load Programmable in 3 dB steps (see Table 7) For tuned loads, see the Output Matching section @ 100 kHz offset from carrier @ 1 MHz offset from carrier @ 3 MHz offset from carrier @ 10 MHz offset from carrier @ 25 kHz PFD frequency @ 200 kHz PFD frequency @ 8 MHz PFD frequency @ 1 kHz offset from carrier 100 Hz to 100 kHz Operating temperature range is −40°C to +85°C. Guaranteed by design. Sample tested to ensure compliance. ICP is internally modified to maintain constant loop gain over the frequency range. 4 TA = 25°C; AVDD = DVDD = VVCO = 3.3 V; P = 32. 5 For RF > 2 GHz, these characteristics are guaranteed only for VCO core power = 15 mA. For frequencies < 2 GHz, these characteristics are guaranteed only for VCO core power = 20 mA. 6 Jumping from 2.0 GHz to 2.17 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz. 7 Using 50 Ω resistors to VVCO into a 50 Ω load. For tuned loads, see the Output Matching section. 8 The noise of the VCO is measured in open-loop conditions. 9 The synthesizer phase-noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value). 10 The phase noise is measured with the EV-ADF4360-2EB1Z Evaluation Board and the HP8562E spectrum analyzer. The spectrum analyzer provides the REFIN for the synthesizer; offset frequency = 1 kHz. 11 fREFIN = 10 MHz; fPFD = 200 kHz; N = 10000; Loop B/W = 10 kHz. 12 fREFIN = 10 MHz; fPFD = 1 MHz; N = 2000; Loop B/W = 25 kHz. 13 The spurious signals are measured with the EV-ADF4360-2EB1Z Evaluation Board and the HP8562E spectrum analyzer. The spectrum analyzer provides the REFIN for the synthesizer; fREFOUT = 10 MHz @ 0 dBm. 1 2 3 Rev. C | Page 4 of 24 Data Sheet ADF4360-2 TIMING CHARACTERISTICS 1 AVDD = DVDD = VVCO = 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = TMIN to TMAX, unless otherwise noted. Table 2. Parameter t1 t2 t3 t4 t5 t6 t7 Unit ns min ns min ns min ns min ns min ns min ns min Test Conditions/Comments LE Setup Time DATA to CLOCK Setup Time DATA to CLOCK Hold Time CLOCK High Duration CLOCK Low Duration CLOCK to LE Setup Time LE Pulse Width See the Power-Up section for the recommended power-up procedure for this device. t4 t5 CLOCK t2 DATA DB23 (MSB) t3 DB22 DB2 DB1 (CONTROL BIT C2) DB0 (LSB) (CONTROL BIT C1) t7 LE t1 t6 04436-002 1 Limit at TMIN to TMAX (B Version) 20 10 10 25 25 10 20 LE Figure 2. Timing Diagram Rev. C | Page 5 of 24 ADF4360-2 Data Sheet ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter AVDD to GND 1 AVDD to DVDD VVCO to GND VVCO to AVDD Digital I/O Voltage to GND Analog I/O Voltage to GND REFIN to GND Operating Temperature Maximum Junction Temperature CSP θJA Thermal Impedance Paddle Soldered Paddle Not Soldered Lead Temperature, Soldering Reflow 1 GND = AGND = DGND = 0 V. Rating −0.3 V to +3.9 V −0.3 V to +0.3 V −0.3 V to +3.9 V −0.3 V to +0.3 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V 150°C 50°C/W 88°C/W 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those included in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. This device is a high performance RF integrated circuit with an ESD rating of <1 kV; it is ESD sensitive. Proper precautions should be taken for handling and assembly. TRANSISTOR COUNT 12,543 (CMOS) and 700 (Bipolar). ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 6 of 24 Data Sheet ADF4360-2 19 LE 21 DVDD 20 MUXOUT 22 AGND 24 CP 23 CE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS PIN 1 IDENTIFIER CPGND 1 AVDD 2 18 DATA 17 CLK AGND 3 ADF4360-2 RFOUTA 4 TOP VIEW (Not to Scale) 16 REFIN 15 DGND RFOUTB 5 14 CN VVCO 6 NOTES 1. THE EXPOSED PAD MUST BE CONNECTED TO AGND. 04436-003 CC 12 AGND 11 AGND 10 AGND 9 VTUNE 7 AGND 8 13 RSET Figure 3. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 Mnemonic CPGND AVDD 3, 8 to 11, 22 4 AGND RFOUTA 5 RFOUTB 6 VVCO 7 VTUNE 12 13 CC RSET Descriptions Charge Pump Ground. This is the ground return path for the charge pump. Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane should be placed as close as possible to this pin. AVDD must have the same value as DVDD. Analog Ground. This is the ground return path of the prescaler and VCO. VCO Output. The output level is programmable from −6 dBm to −13 dBm. See the Output Matching section for a description of the various output stages. VCO Complementary Output. The output level is programmable from −6 dBm to −13 dBm. See the Output Matching section for a description of the various output stages. Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane should be placed as close as possible to this pin. VVCO must have the same value as AVDD. Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP output voltage. Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor. Connecting a resistor between this pin and CPGND sets the maximum charge pump output current for the synthesizer. The nominal voltage potential at the RSET pin is 0.6 V. The relationship between ICP and RSET is ICPmax = 14 15 16 CN DGND REFIN 17 CLK 18 DATA 19 LE 20 MUXOUT 21 DVDD 23 CE 24 CP EP 11.75 R SET where RSET = 4.7 kΩ, ICPmax = 2.5 mA. Internal Compensation Node. This pin must be decoupled to VVCO with a 10 µF capacitor. Digital Ground. Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance of 100 kΩ. See Figure 10. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled. Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input. Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a high impedance CMOS input. Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the four latches, and the relevant latch is selected using the control bits. This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be accessed externally. Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane should be placed as close as possible to this pin. DVDD must have the same value as AVDD. Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode. Taking the pin high powers up the device depending on the status of the power-down bits. Charge Pump Output. When enabled, this provides ± ICP to the external loop filter, which in turn drives the internal VCO. Exposed Pad. The exposed pad must be connected to AGND. Rev. C | Page 7 of 24 ADF4360-2 Data Sheet 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 1k –10 OUTPUT POWER (dB) –20 1 2 3 –40 –50 –70 10k 100k 1M FREQUENCY OFFSET (Hz) –2kHz 10M 0 –10 –20 –95 –100 –30 OUTPUT POWER (dB) –85 –90 –105 –110 –115 –120 –125 –130 –135 –40 2000MHz 1kHz 2kHz VDD = 3V, VVCO = 3V ICP = 2.5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 10kHz RES. BANDWIDTH = 3kHz VIDEO BANDWIDTH = 3kHz SWEEP = 140ms AVERAGES = 100 –50 –60 –79.5dBc –70 1k 10k 100k FREQUENCY OFFSET (Hz) 1M 04436-008 04436-005 –80 –90 –200kHz 10M –70 –75 –80 –85 –90 OUTPUT POWER (dB) –95 –100 –105 –110 –115 –120 –125 –130 –135 –100kHz 2000MHz 100kHz 200kHz Figure 8. Reference Spurs at 2000 MHz (200 kHz Channel Spacing, 10 kHz Loop Bandwidth) Figure 5. VCO Phase Noise, 2000 MHz, 200 kHz PFD, 10 kHz Loop Bandwidth 0 VDD = 3V, VVCO = 3V –10 ICP = 2.5mA PFD FREQUENCY = 1MHz –20 LOOP BANDWIDTH = 25kHz RES. BANDWIDTH = 30kHz –30 VIDEO BANDWIDTH = 30kHz SWEEP = 50ms –40 AVERAGES = 100 –50 –60 –83.8dBc/Hz –70 1k 10k 100k FREQUENCY OFFSET (Hz) 1M 04436-009 –80 04436-006 OUTPUT POWER (dB) –1kHz Figure 7. Close-In Phase Noise at 2000 MHz (200 kHz Channel Spacing) –70 –140 –145 –150 100 04436-007 –90 –75 –80 –140 –145 –150 100 –84.0dBc/Hz –60 –80 Figure 4. Open-Loop VCO Phase Noise OUTPUT POWER (dB) –30 VDD = 3V, VVCO = 3V ICP = 2.5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 10kHz RES. BANDWIDTH = 30Hz VIDEO BANDWIDTH = 30Hz SWEEP = 1.9SECONDS AVERAGES = 10 4 04436-004 OUTPUT POWER (dB) TYPICAL PERFORMANCE CHARACTERISTICS –90 –1MHz 10M –0.5MHz 2000MHz 0.5MHz 1MHz Figure 9. Reference Spurs at 2000 MHz (1 MHz Channel Spacing, 25 kHz Loop Bandwidth) Figure 6. VCO Phase Noise, 1000 MHz, Divide-by-2 Enabled 200 kHz PFD, 10 kHz Loop Bandwidth Rev. C | Page 8 of 24 Data Sheet ADF4360-2 CIRCUIT DESCRIPTION REFERENCE INPUT SECTION The reference input stage is shown in Figure 10. SW1 and SW2 are normally closed switches. SW3 is normally open. When power-down is initiated, SW3 is closed, and SW1 and SW2 are opened. This ensures that there is no loading of the REFIN pin on power-down. N = BP + A 13-BIT B COUNTER LOAD PRESCALER P/P+1 FROM VCO 04436-011 N DIVIDER 100kΩ SW2 REFIN NC LOAD 5-BIT A COUNTER MODULUS CONTROL POWER-DOWN CONTROL NC TO PFD Figure 11. A and B Counters TO R COUNTER BUFFER SW1 R COUNTER 04436-010 SW3 NO Figure 10. Reference Input Stage PRESCALER (P/P + 1) The dual-modulus prescaler (P/P + 1), along with the A and B counters, enables the large division ratio, N, to be realized (N = BP + A). The dual-modulus prescaler, operating at CML levels, takes the clock from the VCO and divides it down to a manageable frequency for the CMOS A and B counters. The prescaler is programmable. It can be set in software to 8/9, 16/17, or 32/33 and is based on a synchronous 4/5 core. There is a minimum divide ratio possible for fully contiguous output frequencies; this minimum is determined by P, the prescaler value, and is given by (P2 − P). A AND B COUNTERS The A and B CMOS counters combine with the dual-modulus prescaler to allow a wide range division ratio in the PLL feedback counter. The counters are specified to work when the prescaler output is 300 MHz or less. Thus, with a VCO frequency of 2.5 GHz, a prescaler value of 16/17 is valid, but a value of 8/9 is not valid. The 14-bit R counter allows the input reference frequency to be divided down to produce the reference clock to the phase frequency detector (PFD). Division ratios from 1 to 16,383 are allowed. PFD AND CHARGE PUMP The PFD takes inputs from the R counter and N counter (N = BP + A) and produces an output proportional to the phase and frequency difference between them. Figure 12 is a simplified schematic. The PFD includes a programmable delay element that controls the width of the antibacklash pulse. This pulse ensures that there is no dead zone in the PFD transfer function and minimizes phase noise and reference spurs. Two bits in the R counter latch, ABP2 and ABP1, control the width of the pulse (see Table 9). VP HI D1 Q1 CHARGE PUMP UP U1 R DIVIDER CLR1 Pulse Swallow Function PROGRAMMABLE DELAY The A and B counters, in conjunction with the dual-modulus prescaler, make it possible to generate output frequencies that are spaced only by the reference frequency divided by R. The VCO frequency equation is ABP1 CLR2 D2 HI fVCO = [(P × B) + A] × fREFIN/R Q2 CP U3 ABP2 DOWN U2 where: N DIVIDER CPGND fVCO is the output frequency of the VCO. P is the preset modulus of the dual-modulus prescaler (8/9, 16/17, and so on). R DIVIDER A is the preset divide ratio of the binary 5-bit swallow counter (0 to 31). N DIVIDER CP OUTPUT fREFIN is the external reference frequency oscillator. Figure 12. PFD Simplified Schematic and Timing (In Lock) Rev. C | Page 9 of 24 04436-012 B is the preset divide ratio of the binary 13-bit counter (3 to 8,191). ADF4360-2 Data Sheet Table 5. C2 and C1 Truth Table MUXOUT AND LOCK DETECT The output multiplexer on the ADF4360 family allows the user to access various internal points on the chip. The state of MUXOUT is controlled by M3, M2, and M1 in the function latch. The full truth table is shown in Table 7. Figure 13 shows the MUXOUT section in block diagram form. Lock Detect Control Bits C1 0 1 0 1 C2 0 0 1 1 Data Latch Control Latch R Counter N Counter (A and B) Test Mode Latch MUXOUT can be programmed for two types of lock detect: digital and analog. Digital lock detect is active high. When LDP in the R counter latch is set to 0, digital lock detect is set high when the phase error on three consecutive phase detector cycles is less than 15 ns. VCO With LDP set to 1, five consecutive cycles of less than 15 ns phase error are required to set the lock detect. It stays set high until a phase error of greater than 25 ns is detected on any subsequent PD cycle. The correct band is chosen automatically by the band select logic at power-up or whenever the N counter latch is updated. It is important that the correct write sequence be followed at power-up. This sequence is The N-channel, open-drain, analog lock detect should be operated with an external pull-up resistor of 10 kΩ nominal. When a lock is detected, the output is high with narrow lowgoing pulses. 1. R counter latch 2. Control latch 3. N counter latch The VCO core in the ADF4360 family uses eight overlapping bands, as shown in Figure 14, to allow a wide frequency range to be covered without a large VCO sensitivity (KV) and resultant poor phase noise and spurious performance. During band select, which takes five PFD cycles, the VCO VTUNE is disconnected from the output of the loop filter and is connected to an internal reference voltage. DVDD ANALOG LOCK DETECT 3.5 DIGITAL LOCK DETECT R COUNTER OUTPUT MUX MUXOUT CONTROL 3.0 N COUNTER OUTPUT SDOUT Figure 13. MUXOUT Circuit VOLTAGE (V) INPUT SHIFT REGISTER 2.0 1.5 1.0 The ADF4360 family’s digital section includes a 24-bit input shift register, a 14-bit R counter, and an 18-bit N counter comprised of a 5-bit A counter and a 13-bit B counter. Data is clocked into the 24-bit shift register on each rising edge of CLK. The data is clocked in MSB first. Data is transferred from the shift register to one of four latches on the rising edge of LE. The destination latch is determined by the state of the two control bits (C2, C1) in the shift register. The two LSBs are DB1 and DB0, as shown in Figure 2. The truth table for these bits is shown in Table 5. Table 6 shows a summary of how the latches are programmed. Note that the test mode latch is used for factory testing and should not be programmed by the user. 0.5 0 1600 04436-014 DGND 04436-013 2.5 1700 1800 1900 2000 2100 FREQUENCY (MHz) 2200 2300 Figure 14. Frequency vs. VTUNE, ADF4360-2 The R counter output is used as the clock for the band select logic and should not exceed 1 MHz. A programmable divider is provided at the R counter input to allow division by 1, 2, 4, or 8 and is controlled by Bit BSC1 and Bit BSC2 in the R counter latch. Where the required PFD frequency exceeds 1 MHz, the divide ratio should be set to allow enough time for correct band selection. After band selection, normal PLL action resumes. The nominal value of KV is 57 MHz/V, or 28 MHz/V if divide-by-2 operation is selected (by programming DIV2 [DB22] high in the N counter latch). The ADF4360 family contains linearization circuitry to minimize any variation of the product of ICP and KV. Rev. C | Page 10 of 24 Data Sheet ADF4360-2 OUTPUT STAGE The RFOUTA and RFOUTB pins of the ADF4360 family are connected to the collectors of an NPN differential pair driven by buffered outputs of the VCO, as shown in Figure 15. To allow the user to optimize the power dissipation vs. the output power requirements, the tail current of the differential pair is programmable via Bit PL1 and Bit PL2 in the control latch. Four current levels can be set: 3.5 mA, 5 mA, 7.5 mA, and 11 mA. These levels give output power levels of −13 dBm, −11 dBm, −8 dBm, and −6 dBm, respectively, using a 50 Ω resistor to VDD and ac coupling into a 50 Ω load. Alternatively, both outputs can be combined in a 1 + 1:1 transformer or a 180° microstrip coupler (see the Output Matching section). If the outputs are used individually, the optimum output stage consists of a shunt inductor to VDD. Another feature of the ADF4360 family is that the supply current to the RF output stage is shut down until the part achieves lock as measured by the digital lock detect circuitry. This is enabled by the mute-till-lock detect (MTLD) bit in the control latch. Rev. C | Page 11 of 24 RFOUTA VCO RFOUTB BUFFER/ DIVIDE-BY-2 04436-015 The operating current in the VCO core is programmable in four steps: 5 mA, 10 mA, 15 mA, and 20 mA. This is controlled by Bit PC1 and Bit PC2 in the control latch. For VCO frequencies above 2 GHz, only the 15 mA core current should be used, and for frequencies below 2 GHz, only 20 mA core current should be used. Figure 15. Output Stage ADF4360-2 ADF4360-2 Data Sheet LATCH STRUCTURE Table 6 shows the three on-chip latches for the ADF4360 family. The two LSBs determines which latch is programmed. Table 6. Latch Structure DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 P2 P1 PD2 PD1 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG MUXOUT CONTROL COUNTER RESET CP THREESTATE PHASE DETECTOR POLARITY OUTPUT POWER LEVEL CURRENT SETTING 1 CP GAIN CURRENT SETTING 2 MUTE-TILLLD POWERDOWN 1 PRESCALER VALUE POWERDOWN 2 CONTROL LATCH CORE POWER LEVEL CONTROL BITS DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 CP PDP M3 M2 M1 CR PC2 PC1 C2 (0) C1 (0) RESERVED CP GAIN DIVIDEBY-2 DIVIDE-BY2 SELECT N COUNTER LATCH 13-BIT B COUNTER DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DIVSEL DIV2 CPG B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 CONTROL BITS 5-BIT A COUNTER DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 B2 B1 RSV A5 A4 A3 A2 A1 DB1 DB0 C2 (1) C1 (0) ANTIBACKLASH PULSE WIDTH CONTROL BITS 14-BIT REFERENCE COUNTER DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 RSV R8 R7 R6 R5 R4 R3 R2 R1 RSV BSC2 BSC1 TMB LDP ABP2 ABP1 R14 R13 R12 R11 R10 R9 Rev. C | Page 12 of 24 DB1 DB0 C2 (0) C1 (1) 04436-016 BAND SELECT CLOCK TEST MODE BIT LOCK DETECT PRECISION RESERVED RESERVED R COUNTER LATCH Data Sheet ADF4360-2 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 P2 P1 PD2 PD1 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG COUNTER RESET OUTPUT POWER LEVEL CP THREESTATE PHASE DETECTOR POLARITY CURRENT SETTING 1 CP GAIN CURRENT SETTING 2 MUTE-TILLLD POWERDOWN 1 PRESCALER VALUE POWERDOWN 2 Table 7. Control Latch MUXOUT CONTROL CORE POWER LEVEL DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 CP PDP M3 M2 M1 CR PC2 PC1 C2 (0) C1 (0) PC2 0 0 1 1 CPI6 CPI5 CPI4 ICP(mA) CPI3 0 0 0 0 1 1 1 1 CPI2 0 0 1 1 0 0 1 1 CPI1 0 1 0 1 0 1 0 1 4.7kΩ 0.31 0.62 0.93 1.25 1.56 1.87 2.18 2.50 PDP 0 1 CP 0 1 CPG 0 1 MTLD 0 1 PL2 0 0 1 1 P2 0 0 1 1 P1 0 1 0 1 PD2 X X 0 1 PD1 X 0 1 1 PRESCALER VALUE 8/9 16/17 32/33 32/33 OUTPUT POWER LEVEL 0 1 0 1 CURRENT 3.5mA 5.0mA 7.5mA 11.0mA PHASE DETECTOR POLARITY NEGATIVE POSITIVE PC1 0 1 0 1 DB1 DB0 CORE POWER LEVEL 5mA 10mA 15mA 20mA COUNTER OPERATION CR 0 1 NORMAL R, A, B COUNTERS HELD IN RESET CHARGE PUMP OUTPUT NORMAL THREE-STATE CP GAIN CURRENT SETTING 1 CURRENT SETTING 2 MUTE-TILL-LOCK DETECT DISABLED ENABLED POWER INTO 50Ω (USING 50Ω TO VVCC ) –13dBm –11dBm –8dBm –6dBm MODE ASYNCHRONOUS POWER-DOWN NORMAL OPERATION ASYNCHRONOUS POWER-DOWN SYNCHRONOUS POWER-DOWN 04436-017 CE PIN 0 1 1 1 PL1 CONTROL BITS Rev. C | Page 13 of 24 M3 0 0 M2 0 0 M1 0 1 0 0 1 1 0 1 1 1 0 0 0 1 1 1 1 1 0 1 OUTPUT THREE-STATE OUTPUT DIGITAL LOCK DETECT (ACTIVE HIGH) N DIVIDER OUTPUT DVDD R DIVIDER OUTPUT N-CHANNEL OPEN-DRAIN LOCK DETECT SERIAL DATA OUTPUT DGND ADF4360-2 Data Sheet RESERVED CP GAIN DIVIDEBY-2 DIVIDE-BY2 SELECT Table 8. N Counter Latch 13-BIT B COUNTER CONTROL BITS 5-BIT A COUNTER DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DIVSEL DIV2 B2 B1 RSV A5 A4 A3 A2 A1 CPG B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 DB1 DB0 C2 (1) C1 (0) THIS BIT IS NOT USED BY THE DEVICE AND IS A DON'T CARE BIT. B12 0 0 0 0 . . . 1 1 1 1 B11 0 0 0 0 . . . 1 1 1 1 .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... B3 0 0 0 1 . . . 1 1 1 1 B2 0 0 1 1 . . . 0 0 1 1 B1 0 1 0 1 . . . 0 1 0 1 F4 (FUNCTION LATCH) FASTLOCK ENABLE CP GAIN OPERATION 0 0 0 1 CHARGE PUMP CURRENT SETTING 1 IS PERMANENTLY USED CHARGE PUMP CURRENT SETTING 2 IS PERMANENTLY USED A4 .......... A2 A1 0 0 0 0 . . . 1 1 1 1 0 0 0 0 . . . 1 1 1 1 .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... 0 0 1 1 . . . 0 0 1 1 0 1 0 1 . . . 0 1 0 1 A COUNTER DIVIDE RATIO 0 1 2 3 . . . 28 29 30 31 B COUNTER DIVIDE RATIO NOT ALLOWED NOT ALLOWED NOT ALLOWED 3 . . . 8188 8189 8190 8191 N = BP + A; P IS PRESCALER VALUE SET IN THE CONTROL LATCH. B MUST BE GREATER THAN OR EQUAL TO A. FOR CONTINUOUSLY ADJACENT VALUES OF (N × FREF ), AT THE OUTPUT, NMIN IS (P2–P). DIV2 0 1 DIVSEL 0 1 DIVIDE-BY-2 FUNDAMENTAL OUTPUT DIVIDE-BY-2 DIVIDE-BY-2 SELECT (PRESCALER INPUT) FUNDAMENTAL OUTPUT SELECTED DIVIDE-BY-2 SELECTED Rev. C | Page 14 of 24 04436-018 B13 0 0 0 0 . . . 1 1 1 1 A5 Data Sheet ADF4360-2 TEST MODE BIT LOCK DETECT PRECISION RESERVED RESERVED Table 9. R Counter Latch BAND SELECT CLOCK ANTIBACKLASH PULSE WIDTH CONTROL BITS 14-BIT REFERENCE COUNTER DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 RSV R8 R7 R6 R5 R4 R3 R2 R1 RSV BSC2 BSC1 TMB TEST MODE BIT SHOULD BE SET TO 0 FOR NORMAL OPERATION. LDP 0 1 BSC1 0 1 0 1 R13 R12 R11 R10 R14 0 0 0 0 . . . 1 1 1 1 ABP2 0 0 1 1 BSC2 0 0 1 1 R14 ABP1 0 1 0 1 ANTIBACKLASH PULSE WIDTH 3.0ns 1.3ns 6.0ns 3.0ns LOCK DETECT PRECISION THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCUR BEFORE LOCK DETECT IS SET. FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCUR BEFORE LOCK DETECT IS SET. BAND SELECT CLOCK DIVIDER 1 2 4 8 04436-019 THESE BITS ARE NOT USED BY THE DEVICE AND ARE DON'T CARE BITS. LDP ABP2 ABP1 Rev. C | Page 15 of 24 R9 R13 0 0 0 0 . . . 1 1 1 1 R12 0 0 0 0 . . . 1 1 1 1 .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... R3 0 0 0 1 . . . 1 1 1 1 R2 0 1 1 0 . . . 0 0 1 1 R1 0 1 0 1 . . . 0 1 0 1 DB1 DB0 C2 (0) C1 (1) DIVIDE RATIO 1 2 3 4 . . . 16380 16381 16382 16383 ADF4360-2 Data Sheet POWER-UP Power-Up Sequence The correct programming sequence for the ADF4360-2 after power-up is as: 1. R counter latch 2. Control latch 3. N counter latch Initial Power-Up Initial power-up refers to programming the part after the application of voltage to the AVDD, DVDD, VVCO, and CE pins. On initial power-up, an interval is required between programming the control latch and programming the N counter latch. This interval is necessary to allow the transient behavior of the ADF4360-2 during initial power-up to have settled. During initial power-up, a write to the control latch powers up the part and the bias currents of the VCO begin to settle. If these currents have not settled to within 10% of their steady-state value, and if the N counter latch is then programmed, the VCO may not be able to oscillate at the desired frequency, which does not allow the band select logic to choose the correct frequency band and the ADF4360-2 may not achieve lock. If the recommended interval is inserted and the N counter latch is programmed, the band select logic can choose the correct frequency band, and the part locks to the correct frequency. The duration of this interval is affected by the value of the capacitor on the CN pin (Pin 14). This capacitor is used to reduce the close-in noise of the ADF4360-2 VCO. The recommended value of this capacitor is 10 µF. Using this value requires an interval of ≥ 5 ms between the latching in of the control latch bits and the latching in of the N counter latch bits. If a shorter delay is required, this capacitor can be reduced. A slight phase noise penalty is incurred by this change, which is explained further in Table 10. Table 10. CN Capacitance vs. Interval and Phase Noise Recommended Interval Between Control Latch and N Counter Latch ≥ 5 ms ≥ 600 µs Open-Loop Phase Noise @ 10 kHz Offset −86 dBc −85 dBc POWER-UP CLOCK DATA R COUNTER LATCH DATA CONTROL LATCH DATA N COUNTER LATCH DATA LE REQUIRED INTERVAL CONTROL LATCH WRITE TO N COUNTER LATCH WRITE Figure 16. ADF4360-2 Power-Up Timing Rev. C | Page 16 of 24 04436-020 CN Value 10 µF 440 nF Data Sheet ADF4360-2 Hardware Power-Up/Power-Down Software Power-Up/Power-Down If the ADF4360-2 is powered down via the hardware (using the CE pin) and powered up again without any change to the N counter register during power-down, the part locks at the correct frequency because it is already in the correct frequency band. The lock time depends on the value of capacitance on the CN pin, which is <5 ms for 10 µF capacitance. The smaller capacitance of 440 nF on this pin enables lock times of <600 µs. If the ADF4360-2 is powered down via the software (using the control latch) and powered up again without any change to the N counter latch during power-down, the part locks at the correct frequency because it is already in the correct frequency band. The lock time depends on the value of capacitance on the CN pin, which is <5 ms for 10 µF capacitance. The smaller capacitance of 440 nF on this pin enables lock times of <600 µs. The N counter value cannot be changed while it is in powerdown because it may not lock to the correct frequency on power-up. If it is updated, the correct programming sequence for the part after power-up is to the R counter latch, followed by the control latch, and finally the N counter latch, with the required interval between the control latch and N counter latch, as described in the Initial Power-Up section. The N counter value cannot be changed while the part is in power-down because it may not lock to the correct frequency on power-up. If it is updated, the correct programming sequence for the parts after power-up is to the R counter latch, followed by the control latch, and finally the N counter latch, with the required interval between the control latch and N counter latch, as described in the Initial Power-Up section. Rev. C | Page 17 of 24 ADF4360-2 Data Sheet CONTROL LATCH Charge Pump Currents With (C2, C1) = (0, 0), the control latch is programmed. Table 7 shows the input data format for programming the control latch. CPI3, CPI2, and CPI1 in the ADF4360 family determine Current Setting 1. Prescaler Value CPI6, CPI5, and CPI4 determine Current Setting 2. See the truth table in Table 7. In the ADF4360 family, P2 and P1 in the control latch set the prescaler values. Power-Down DB21 (PD2) and DB20 (PD1) provide programmable powerdown modes. In the programmed asynchronous power-down, the device powers down immediately after latching a 1 into Bit PD1, with the condition that PD2 is loaded with a 0. In the programmed synchronous power-down, the device power-down is gated by the charge pump to prevent unwanted frequency jumps. Once the power-down is enabled by writing a 1 into Bit PD1 (on the condition that a 1 is also loaded to PD2), the device goes into power-down on the second rising edge of the R counter output, after LE goes high. When the CE pin is low, the device is immediately disabled regardless of the state of PD1 or PD2. When a power-down is activated (either synchronous or asynchronous mode), the following events occur: Output Power Level Bit PL1 and Bit PL2 set the output power level of the VCO. See the truth table in Table 7. Mute-Till-Lock Detect (LD) DB11 of the control latch in the ADF4360 family is the mutetill-lock detect bit. This function, when enabled, ensures that the RF outputs are not switched on until the PLL is locked. CP Gain DB10 of the control latch in the ADF4360 family is the charge pump gain bit. When it is programmed to 1, Current Setting 2 is used. When it is programmed to 0, Current Setting 1 is used. Charge Pump (CP) Three-State This bit puts the charge pump into three-state mode when programmed to a 1. It should be set to 0 for normal operation. Phase Detector Polarity • All active dc current paths are removed. The PDP bit in the ADF4360 family sets the phase detector polarity. The positive setting enabled by programming a 1 is used when using the on-chip VCO with a passive loop filter or with an active noninverting filter. It can also be set to 0, which is required if an active inverting loop filter is used. • The R, N, and timeout counters are forced to their load state conditions. • The charge pump is forced into three-state mode. MUXOUT Control • The digital lock detect circuitry is reset. • The RF outputs are debiased to a high impedance state. The on-chip multiplexer is controlled by M3, M2, and M1. See the truth table in Table 7. • The reference input buffer circuitry is disabled. Counter Reset • The input register remains active and capable of loading and latching data. DB4 is the counter reset bit for the ADF4360 family. When this is 1, the R counter and the A, B counters are reset. For normal operation, this bit should be 0. Core Power Level PC1 and PC2 set the power level in the VCO core. The recommended setting is 15 mA for frequencies above 2 GHz and 20 mA for frequencies below 2 GHz. No other settings are valid. See the truth table in Table 7. Rev. C | Page 18 of 24 Data Sheet ADF4360-2 N COUNTER LATCH R COUNTER LATCH With (C2, C1) = (1, 0), the N counter latch is programmed. Table 8 shows the input data format for programming the N counter latch. With (C2, C1) = (0, 1), the R counter latch is programmed. Table 9 shows the input data format for programming the R counter latch. A Counter Latch R Counter A5 to A1 program the 5-bit A counter. The divide range is 0 (00000) to 31 (11111). R1 to R14 set the counter divide ratio. The divide range is 1 (00......001) to 16383 (111......111). Reserved Bits Antibacklash Pulse Width DB7 is a spare bit that is reserved. It should be programmed to 0. DB16 and DB17 set the antibacklash pulse width. B Counter Latch Lock Detect Precision B13 to B1 program the B counter. The divide range is 3 (00.....0011) to 8191 (11....111). DB18 is the lock detect precision bit. This bit sets the number of reference cycles with less than 15 ns phase error for entering the locked state. With LDP at 1, five cycles are taken; with LDP at 0, three cycles are taken. Overall Divide Range The overall divide range is defined by ((P × B) + A), where P is the prescaler value. CP Gain DB21 of the N counter latch in the ADF4360 family is the charge pump gain bit. When this bit is programmed to 1, Current Setting 2 is used. When programmed to 0, Current Setting 1 is used. This bit can also be programmed through DB10 of the control latch. The bit always reflects the latest value written to it, whether through the control latch or the N counter latch. Divide-by-2 DB22 is the divide-by-2 bit. When set to 1, the output divide-by-2 function is chosen. When set to 0, normal operation occurs. Divide-by-2 Select DB23 is the divide-by-2 select bit. When programmed to 1, the divide-by-2 output is selected as the prescaler input. When set to 0, the fundamental is used as the prescaler input. For example, using the output divide-by-2 feature and a PFD frequency of 200 kHz, the user needs a value of N = 10,000 to generate 1000 MHz. With the divide-by-2 select bit high, the user can keep N = 5,000. Test Mode Bit (TMB) DB19 is the test mode bit and should be set to 0. With TMB = 0, the contents of the test mode latch are ignored and normal operation occurs as determined by the contents of the control latch, R counter latch, and N counter latch. Note that test modes are for factory testing only and should not be programmed by the user. Band Select Clock These bits set a divider for the band select logic clock input. The output of the R counter is by default the value used to clock the band select logic. If this value is too high (>1 MHz), a divider can be switched on to divide the R counter output to a smaller value (see Table 9). Reserved Bits DB23 to DB22 are spare bits that are reserved. They should be programmed to 0. Rev. C | Page 19 of 24 ADF4360-2 Data Sheet APPLICATIONS DIRECT CONVERSION MODULATOR The LO ports of the AD8349 can be driven differentially from the complementary RFOUTA and RFOUTB outputs of the ADF4360-2. This gives better performance than a single-ended LO driver and eliminates the often necessary use of a balun to convert from a single-ended LO input to the more desirable differential LO inputs for the AD8349. The typical rms phase noise (100 Hz to 100 kHz) of the LO in this configuration is 2.1°. Direct conversion architectures are increasingly being used to implement base station transmitters. Figure 17 shows how ADI parts can be used to implement such a system. The circuit block diagram shows the AD9761 TxDAC® being used with the AD8349. The use of dual integrated DACs, such as the AD9761 with its specified ±0.02 dB and ±0.004 dB gain and offset matching characteristics, ensures minimum error contribution (over temperature) from this portion of the signal chain. The AD8349 accepts LO drive levels from −10 dBm to 0 dBm. The optimum LO power can be software programmed on the ADF4360-2, which allows levels from −13 dBm to −6 dBm from each output. The local oscillator is implemented using the ADF4360-2. The low-pass filter was designed using ADIsimPLL™ for a channel spacing of 100 kHz and an open-loop bandwidth of 10 kHz. The frequency range of the ADF4360-2 (1.85 GHz to 2.17 GHz) makes it ideally suited for the implementation of a W-CDMA transceiver. REFIO IOUTA MODULATED DIGITAL DATA LOW-PASS FILTER IOUTB AD9761 TxDAC QOUTA LOW-PASS FILTER QOUTB FSADJ The RF output is designed to drive a 50 Ω load but must be accoupled, as shown in Figure 17. If the I and Q inputs are driven in quadrature by 2 V p-p signals, the resulting output power from the modulator is approximately 2 dBm. 2kΩ VVCO 6 1nF 1nF FREFIN 21 2 23 IBBP 20 VVCO DVDD AVDD CE MUXOUT VTUNE 7 14 CN CP 24 13kΩ 16 REFIN 6.8nF 470pF 51Ω SPI-COMPATIBLE SERIAL BUS 47nH 13 RSET 47nH 1.8pF 3.6nH RFOUTA 4 CPGND 1 TO RF PA QBBN 12 CC 4.7kΩ AD8349 VVCO 19 LE 1nF 220pF 100pF QBBP ADF4360-2 18 DATA VPS2 IBBN 6.8kΩ 17 CLK VPS1 AGND 3 8 9 10 11 22 LOIN DGND RFOUTB 5 15 LOIP 1.8pF 3.6nH Figure 17. Direct Conversion Modulator Rev. C | Page 20 of 24 PHASE SPLITTER 04436-021 10µF LOCK DETECT VDD Data Sheet ADF4360-2 FIXED FREQUENCY LO ADuC812 Interface Figure 18 shows the ADF4360-2 used as a fixed frequency LO at 2.0 GHz. The low-pass filter was designed using ADIsimPLL for a channel spacing of 8 MHz and an open-loop bandwidth of 40 kHz. The maximum PFD frequency of the ADF4360-2 is 8 MHz. Because using a larger PFD frequency allows the use of a smaller N, the in-band phase noise is reduced to as low as possible, –99 dBc/Hz. The 40 kHz bandwidth is chosen to be just greater than the point at which the open-loop phase noise of the VCO is –99 dBc/Hz, thus giving the best possible integrated noise. The typical rms phase noise (100 Hz to 100 kHz) of the LO in this configuration is 0.3°. The reference frequency is from a 16 MHz TCXO from Fox; thus, an R value of 2 is programmed. Taking into account the high PFD frequency and its effect on the band select logic, the band select clock divider is enabled. In this case, a value of 8 is chosen. A very simple pull-up resistor and dc blocking capacitor complete the RF output stage. Figure 19 shows the interface between the ADF4360 family and the ADuC812 MicroConverter®. Because the ADuC812 is based on an 8051 core, this interface can be used with any 8051-based microcontroller. The MicroConverter is set up for SPI master mode with CPHA = 0. To initiate the operation, the I/O port driving LE is brought low. Each latch of the ADF4360 family needs a 24-bit word, which is accomplished by writing three 8-bit bytes from the MicroConverter to the device. When the third byte is written, the LE input should be brought high to complete the transfer. 2 23 1nF 4.7kΩ CLK DATA 19 LE 12 CC 13 RSET 560Ω ADF4360-2 VVCO 51Ω 1 51Ω 100pF RFOUTA 4 CPGND AGND 3 8 9 10 DGND RF OUTB 5 11 22 ADF4360-x 04436-023 MUXOUT (LOCK DETECT) I/O port lines on the ADuC812 are also used to control power down (CE input) and detect lock (MUXOUT configured as lock detect and polled by the port input). When operating in the described mode, the maximum SCLOCK rate of the ADuC812 is 4 MHz. This means that the maximum rate at which the output frequency can be changed is 166 kHz. 18.0nF 3.3nF 18 LE CE Figure 19. ADuC812 to ADF4360-x Interface 51Ω 17 I/O PORTS 20 VVCO DVDD AVDD CE MUXOUT VTUNE 7 14 CN CP 24 1nF 1nF 16 REFIN 15 ADSP-21xx Interface 100pF 04436-022 SPI-COMPATIBLE SERIAL BUS FOX 801BE-160 16MHz 21 ADuC812 SCLK SDATA Figure 18. Fixed Frequency LO INTERFACING The ADF4360 family has a simple SPI®-compatible serial interface for writing to the device. CLK, DATA, and LE control the data transfer. When LE goes high, the 24 bits that are clocked into the appropriate register on each rising edge of CLK are transferred to the appropriate latch. See Figure 2 for the timing diagram and Table 5 for the latch truth table. The maximum allowable serial clock rate is 20 MHz. This means that the maximum update rate possible is 833 kHz or one update every 1.2 µs. This is certainly more than adequate for systems that have typical lock times in hundreds of microseconds. Figure 20 shows the interface between the ADF4360 family and the ADSP-21xx digital signal processor. The ADF4360 family needs a 24-bit serial word for each latch write. The easiest way to accomplish this using the ADSP-21xx family is to use the autobuffered transmit mode of operation with alternate framing. This provides a means for transmitting an entire block of serial data before an interrupt is generated. SCLOCK MOSI TFS ADSP-21xx I/O PORTS SCLK SDATA LE ADF4360-x CE MUXOUT (LOCK DETECT) 04436-024 6 10µF MOSI LOCK DETECT VVDD VVCO SCLOCK Figure 20. ADSP-21xx to ADF4360-x Interface Set up the word length for 8 bits and use three memory locations for each 24-bit word. To program each 24-bit latch, store the 8-bit bytes, enable the autobuffered mode, and write to the transmit register of the DSP. This last operation initiates the autobuffer transfer. Rev. C | Page 21 of 24 ADF4360-2 Data Sheet VVCO The bottom of the chip scale package has a central thermal pad. The thermal pad on the printed circuit board should be at least as large as this exposed pad. On the printed circuit board, there should be a clearance of at least 0.25 mm between the thermal pad and the inner edges of the pad pattern to ensure that shorting is avoided. Thermal vias can be used on the printed circuit board thermal pad to improve thermal performance of the package. If vias are used, they should be incorporated into the thermal pad at a 1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm, and the via barrel should be plated with 1 ounce of copper to plug the via. 47nH 1.8pF 3.6nH RFOUT 50Ω Figure 22. Optimum ADF4360-2 Output Stage If the user does not need the differential outputs available on the ADF4360-2, the user can either terminate the unused output or combine both outputs using a balun. The circuit in Figure 23 shows how best to combine the outputs. VVCO The user should connect the printed circuit thermal pad to AGND. This is internally connected to AGND. 2.2nH RFOUTA 3.6nH 47nH 1.8pF 10pF OUTPUT MATCHING There are a number of ways to match the output of the ADF4360-2 for optimum operation; the most basic is to use a 50 Ω resistor to VVCO. A dc bypass capacitor of 100 pF is connected in series, as shown in Figure 21. Because the resistor is not frequency dependent, this provides a good broadband match. The output power in this circuit typically gives −6 dBm output power into a 50 Ω load. VVCO 51Ω 50Ω 04436-025 100pF RFOUT Figure 21. Simple ADF4360-2 Output Stage A better solution is to use a shunt inductor (acting as an RF choke) to VVCO. This gives a better match and, therefore, more output power. Additionally, a series inductor is added after the dc bypass capacitor to provide a resonant LC circuit. This tunes the oscillator output and provides approximately 10 dB additional rejection of the second harmonic. The shunt inductor needs to be a relatively high value (>40 nH). 3.6nH RFOUTB 50Ω 2.2nH 1.8pF 04436-027 The leads on the chip scale package (CP-24) are rectangular. The printed circuit board pad for these should be 0.1 mm longer than the package lead length and 0.05 mm wider than the package lead width. The lead should be centered on the pad to ensure that the solder joint size is maximized. Experiments have shown that the circuit shown in Figure 22 provides an excellent match to 50 Ω over the operating range of the ADF4360-2. This gives approximately −3 dBm output power across the frequency range of the ADF4360-2. Both single-ended architectures can be examined using the EV-ADF4360-2EB1Z evaluation board. 04436-026 PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE Figure 23. Balun for Combining ADF4360-2 RF Outputs The circuit in Figure 23 is a lumped-lattice-type LC balun. It is designed for a center frequency of 2.0 GHz and outputs 2.0 dBm at this frequency. The series 2.2 nH inductor is used to tune out any parasitic capacitance due to the board layout from each input, and the remainder of the circuit is used to shift the output of one RF input by +90° and the second by −90°, thus combining the two. The action of the 3.6 nH inductor and the 1.8 pF capacitor accomplishes this. The 47 nH is used to provide an RF choke to feed the supply voltage, and the 10 pF capacitor provides the necessary dc block. To ensure good RF performance, the circuits in Figure 22 and Figure 23 are implemented with Coilcraft 0402/0603 inductors and AVX 0402 thin-film capacitors. Alternatively, instead of the LC balun shown in Figure 23, both outputs can be combined using a 180° rat-race coupler. Rev. C | Page 22 of 24 Data Sheet ADF4360-2 OUTLINE DIMENSIONS 4.10 4.00 SQ 3.90 0.60 MAX 2.50 REF 0.60 MAX 3.75 BSC SQ 1 0.50 BSC 2.45 2.30 SQ 2.15 EXPOSED PAD 6 13 TOP VIEW 1.00 0.85 0.80 12° MAX 7 12 0.80 MAX 0.65 TYP 0.30 0.23 0.18 SEATING PLANE 0.50 0.40 0.30 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF BOTTOM VIEW 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2 04-09-2012-A PIN 1 INDICATOR PIN 1 INDICATOR 24 19 18 Figure 24. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4mm Body, Very Thin Quad (CP-24-2) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADF4360-2BCPZ ADF4360-2BCPZRL ADF4360-2BCPZRL7 EV-ADF4360-2EB1Z 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Frequency Range 1850 MHz to 2170 MHz 1850 MHz to 2170 MHz 1850 MHz to 2170 MHz Z = RoHS Compliant Part. Rev. C | Page 23 of 24 Package Description 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ Evaluation Board Package Option CP-24-2 CP-24-2 CP-24-2 ADF4360-2 Data Sheet NOTES Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ©2004–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04436–0–11/12(C) Rev. C | Page 24 of 24