%*$*36 6LOLFRQ'LVFUHWHV *36/RZ1RLVH$PSOLILHUXVLQJ%*$ 9FF & & 100nF 10nF / & 47nH 47pF In / 3.9nH 1 4 ,& & 5 BGA622 47pF 2 0Ω )LJXUH $SSOLFDWLRQ&LUFXLW'LDJUDP 7DEOH 0HDVXUHG3HUIRUPDQFH'DWDDW 0+]DQG9&& 3DUDPHWHU Supply current Insertion power gain Out 3 9 6\PERO 9DOXH 8QLW ICC 5.8 mA |S21| 2 15.4 dB NF 1.3 dB Input return loss |S11|2 13.7 dB Output return loss |S22|2 14.5 dB 2 27.5 dB Noise figure Reverse isolation |S12| Input 1 dB-compression point IP1dB -16 dBm Input third order intercept point1) IIP3 1 dBm 1) ∆f = 1 MHz; Pin = -25 dBm 1 2002-02-07 %*$*36 6LOLFRQ'LVFUHWHV 7DEOH %LOORI0DWHULDOV 1DPH 9DOXH 3DFNDJH 0DQXIDFWXUHU )XQFWLRQ C1 47 pF 0402 various DC block C2 100 nF 0603 various Improve linearity C3 10 nF 0402 various RF bypass C4 47 pF 0402 various RF bypass IC1 BGA622 SOT343 Infineon Technologies SiGe MMIC L1 3.9 nH 0402 Toko LL 1005-FH Input matching L2 47 nH 0402 Toko LL 1005-FH RF choke R1 0Ω 0402 various Jumper 0HDVXUHG&LUFXLW3HUIRUPDQFH All presented measurement values include losses of both PCB and connectors - in other words, the reference planes used for measurements are the PCB’s RF SMA connectors. Noise figure and gain results shown do not have any PCB loss extracted from them. 18 17 16 @ % G > 15 Q L D * 14 13 12 1.4 1.45 1.5 1.55 1.6 1.65 1.7 1.75 )UHTXHQF\>*+]@ )LJXUH ,QVHUWLRQ*DLQ 2 2002-02-07 %*$*36 6LOLFRQ'LVFUHWHV 10 11 @ % G > V V R / 12 s11 13 Q U X W H 5 14 s22 15 16 1.4 1.45 1.5 1.55 1.6 1.65 1.7 1.75 1.65 1.7 1.75 )UHTXHQF\>*+]@ )LJXUH ,QSXWDQG2XWSXW5HWXUQ/RVV 24 @ % G > 25 Q R L W OD 26 27 R V , H V U H Y H 5 28 29 30 1.4 1.45 1.5 1.55 1.6 )UHTXHQ\>*+]@ )LJXUH 5HYHUVH,VRODWLRQ 3 2002-02-07 %*$*36 6LOLFRQ'LVFUHWHV 5 4 3 % . K 2 1 B1 0 0 1 2 3 4 5 6 5 6 )UHTXHQF\>*+]@ )LJXUH 6WDELOLW\)DFWRU.DQG6WDELOLW\0HDVXUH% 20 18 16 14 @ %12 G > 10 Q L D 8 * 6 4 2 0 0 1 2 3 4 )UHTXHQF\>*+]@ )LJXUH :LGH6SDQ*DLQ 4 2002-02-07 %*$*36 6LOLFRQ'LVFUHWHV 0 2 @ % G > V V R / s11 4 6 8 Q10 U X W H 5 12 14 s22 16 18 0 1 2 3 4 5 6 )UHTXHQF\>*+]@ )LJXUH :LGH6SDQ5HWXUQ/RVV 0 17 -4 16 @ P % G > W Gain -8 15 XR -12 14 3 @ % G > Q L D * Pout -16 13 -20 12 -35 -30 -25 -20 -15 -10 3LQ>G%P@ )LJXUH *DLQ&RPSUHVVLRQ# *+= 5 2002-02-07 %*$*36 6LOLFRQ'LVFUHWHV $SSOLFDWLRQERDUGDQGFRPSRQHQWSODFHPHQW )LJXUH shows the placement of the specific components on the application PCB. )LJXUH displays the cross section of the application board. The actually used microstrip structure is the one with the 0.2 mm FR4 dielectric. The 0.8 mm FR4 are for mechanical rigidity purposes only. Vcc NA C3 L2 C2 L1 C1 1 4 2 3 4 R1 9.5 mm C4 In Out NA NA NA 8 mm PD )LJXUH &RPSRQHQW3ODFHPHQWRQWKH$SSOLFDWLRQ3&% 35 µm Cu 0.2 mm FR4 35 µm Cu for mechanical rigidity of PCB 0.8 mm FR4 35 µm Cu )LJXUH 3&%&URVV6HFWLRQ 6 2002-02-07