INFINEON BGA622GPS

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100nF
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Supply current
Insertion power gain
Out
3
9
6\PERO
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8QLW
ICC
5.8
mA
|S21|
2
15.4
dB
NF
1.3
dB
Input return loss
|S11|2
13.7
dB
Output return loss
|S22|2
14.5
dB
2
27.5
dB
Noise figure
Reverse isolation
|S12|
Input 1 dB-compression point
IP1dB
-16
dBm
Input third order intercept point1)
IIP3
1
dBm
1)
∆f = 1 MHz; Pin = -25 dBm
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2002-02-07
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C1
47 pF
0402
various
DC block
C2
100 nF
0603
various
Improve linearity
C3
10 nF
0402
various
RF bypass
C4
47 pF
0402
various
RF bypass
IC1
BGA622 SOT343
Infineon Technologies SiGe MMIC
L1
3.9 nH
0402
Toko LL 1005-FH
Input matching
L2
47 nH
0402
Toko LL 1005-FH
RF choke
R1
0Ω
0402
various
Jumper
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All presented measurement values include losses of both PCB and connectors - in other
words, the reference planes used for measurements are the PCB’s RF SMA connectors.
Noise figure and gain results shown do not have any PCB loss extracted from them.
18
17
16
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)LJXUH shows the placement of the specific components on the application PCB.
)LJXUH displays the cross section of the application board. The actually used
microstrip structure is the one with the 0.2 mm FR4 dielectric. The 0.8 mm FR4 are for
mechanical rigidity purposes only.
Vcc
NA
C3
L2
C2
L1
C1
1
4
2
3
4
R1
9.5 mm
C4
In
Out
NA
NA
NA
8 mm
PD
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35 µm Cu
0.2 mm FR4
35 µm Cu
for mechanical
rigidity of PCB
0.8 mm FR4
35 µm Cu
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2002-02-07