FAIRCHILD 74ABT373CMTC

Revised November 1999
74ABT373
Octal Transparent Latch with 3-STATE Outputs
General Description
Features
The ABT373 consists of eight latches with 3-STATE outputs for bus organized system applications. The flip-flops
appear transparent to the data when Latch Enable (LE) is
HIGH. When LE is LOW, the data that meets the setup
times is latched. Data appears on the bus when the Output
Enable (OE) is LOW. When OE is HIGH the bus output is in
the high impedance state.
■ 3-STATE outputs for bus interfacing
■ Output sink capability of 64 mA, source capability of
32 mA
■ Guaranteed output skew
■ Guaranteed multiple output switching specifications
■ Output switching specified for both 50 pF and 250 pF
loads
■ Guaranteed simultaneous switching, noise level and
dynamic threshold performance
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down
■ Nondestructive hot insertion capability
Ordering Code:
Order Number
74ABT373CSC
74ABT373CSJ
Package Number
M20B
M20D
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ABT373CMSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT373CMTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74ABT373CPC
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
D0–D7
© 1999 Fairchild Semiconductor Corporation
DS011547
Description
Data Inputs
LE
Latch Enable Input (Active HIGH)
OE
Output Enable Input (Active LOW)
O0–O7
3-STATE Latch Outputs
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74ABT373 Octal Transparent Latch with 3-STATE Outputs
January 1993
74ABT373
Functional Description
Truth Table
The ABT373 contains eight D-type latches with 3-STATE
output buffers. When the Latch Enable (LE) input is HIGH,
data on the Dn inputs enters the latches. In this condition
the latches are transparent, i.e., a latch output will change
state each time its D input changes. When LE is LOW, the
latches store the information that was present on the D
inputs at setup time preceding the HIGH-to-LOW transition
of LE. The 3-STATE buffers are controlled by the Output
Enable (OE) input. When OE is LOW, the buffers are in the
bi-state mode. When OE is HIGH the buffers are in the high
impedance mode but this does not interfere with entering
new data into the latches.
Inputs
Output
LE
OE
Dn
On
H
L
H
H
H
L
L
L
L
L
X
On (no change)
X
H
X
Z
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = HIGH Impedance State
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
Recommended Operating
Conditions
−65°C to +150°C
Storage Temperature
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
−40°C to +85°C
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
+4.5V to +5.5
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 2)
−0.5V to +7.0V
Input Current (Note 2)
−30 mA to +5.0 mA
Minimum Input Edge Rate (∆V/∆t)
Data Input
50 mV/ns
Enable Input
20 mV/ns
Voltage Applied to Any Output
in the Disabled or
−0.5V to +5.5V
Power-Off State
−0.5V to VCC
in the HIGH State
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
OE Pin
−150 mA
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Other Pins
−500 mA
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Latchup Source Current:
(Across Comm Operating Range)
Over Voltage Latchup (I/O)
10V
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
2.0
Units
VCC
VIH
Input HIGH Voltage
V
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
VOH
Output HIGH Voltage
V
Min
V
Min
2.5
2.0
VOL
Output LOW Voltage
0.55
IIH
Input HIGH Current
1
1
IBVI
Input HIGH Current Breakdown Test
7
IIL
Input LOW Current
−1
−1
VID
Input Leakage Test
IOZH
Output Leakage Current
IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
ICEX
4.75
Conditions
Recognized HIGH Signal
Recognized LOW Signal
µA
Max
µA
Max
µA
Max
V
0.0
IIN = −18 mA
IOH = −3 mA
IOH = −32 mA
IOL = 64 mA
VIN = 2.7V (Note 4)
VIN = VCC
VIN = 7.0V
VIN = 0.5V (Note 4)
VIN = 0.0V
IID = 1.9 µA
All Other Pins Grounded
10
µA
0 − 5.5V VOUT = 2.7V; OE = 2.0V
0 − 5.5V VOUT = 0.5V; OE = 2.0V
−10
µA
−275
mA
Max
VOUT = 0.0V
Output High Leakage Current
50
µA
Max
VOUT = VCC
IZZ
Bus Drainage Test
100
µA
0.0
VOUT = 5.5V; All Others GND
ICCH
Power Supply Current
50
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
−100
OE = VCC
All Others at VCC or GND
ICCT
Additional ICC/Input
Outputs Enabled
2.5
mA
Outputs 3-STATE
2.5
mA
Outputs 3-STATE
2.5
mA
VI = VCC − 2.1V
Max
Enable Input VI = VCC − 2.1V
Data Input VI = VCC − 2.1V
All Others at VCC or GND
ICCD
Dynamic ICC
No Load
mA/
(Note 4)
0.12
MHz
Max
Outputs Open, LE = VCC
OE = GND, (Note 3)
One Bit Toggling, 50% Duty Cycle
Note 3: For 8 bits toggling, ICCD < 0.8 mA/MHz.
Note 4: Guaranteed, but not tested.
3
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74ABT373
Absolute Maximum Ratings(Note 1)
74ABT373
DC Electrical Characteristics
(SOIC Package)
Symbol
Parameter
Min
Typ
Max
Units
VCC
0.4
0.8
Conditions
CL = 50 pF, RL = 500Ω
TA = 25°C (Note 5)
VOLP
Quiet Output Maximum Dynamic VOL
V
5.0
VOLV
Quiet Output Minimum Dynamic VOL
−1.2
−0.8
V
5.0
TA = 25°C (Note 5)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.5
3.0
V
5.0
TA = 25°C (Note 6)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.0
VILD
Maximum LOW Level Dynamic Input Voltage
1.7
0.9
0.6
V
5.0
TA = 25°C (Note 7)
V
5.0
TA = 25°C (Note 7)
Note 5: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output at Low. Guaranteed, but not tested.
Note 6: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
Note 7: Max number of data inputs (n) switching. n − 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD ).
Guaranteed, but not tested.
AC Electrical Characteristics
(SOIC and SSOP Packages)
Symbol
Parameter
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V to 5.5V
VCC = 4.5V to 5.5V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Min
Typ
Max
Min
Max
Min
Max
tPLH
Propagation Delay
1.9
2.7
4.5
1.0
6.8
1.9
4.5
tPHL
Dn to On
1.9
2.8
4.5
1.0
7.0
1.9
4.5
tPLH
Propagation Delay
2.0
3.1
5.0
1.0
7.7
2.0
5.0
tPHL
LE to On
2.0
3.0
5.0
1.5
7.7
2.0
5.0
tPZH
Output Enable Time
1.5
3.1
5.3
1.0
6.7
1.5
5.3
1.5
3.1
5.3
1.5
7.2
1.5
5.3
2.0
3.6
5.4
1.7
8.0
2.0
5.4
2.0
3.4
5.4
1.0
7.0
2.0
5.4
tPZL
tPHZ
Output Disable Time
tPLZ
Units
ns
ns
ns
ns
AC Operating Requirements
(SOIC and SSOP Packages)
Symbol
Parameter
Min
fTOGGLE
Max Toggle Frequency
tS(H)
Setup Time, HIGH
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V to 5.5V
VCC = 4.5V to 5.5V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Typ
Max
100
Min
Max
Min
100
1.5
2.5
tS(L)
or LOW Dn to LE
1.5
2.5
1.5
Hold Time, HIGH
1.0
2.5
1.0
tH(L)
or LOW Dn to LE
1.0
2.5
1.0
tW(H)
Pulse Width,
3.0
3.3
3.0
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4
Max
MHz
1.5
tH(H)
LE HIGH
Units
ns
ns
ns
74ABT373
Extended AC Electrical Characteristics
(SOIC Package)
Symbol
TA = −40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V to 5.5V
VCC = 4.5V to 5.5V
VCC = 4.5V to 5.5V
CL = 50 pF
CL = 250 pF
Parameter
CL = 250 pF
8 Outputs Switching
(Note 8)
(Note 9)
(Note 10)
Min
Max
Min
Max
Min
Max
tPLH
Propagation Delay
1.5
5.2
2.0
6.8
2.0
9.0
tPHL
Dn to On
1.5
5.2
2.0
6.8
2.0
9.0
tPLH
Propagation Delay
1.5
5.5
2.0
7.5
2.0
9.5
tPHL
LE to On
1.5
5.5
2.0
7.5
2.0
9.5
tPZH
Output Enable Time
1.5
6.2
2.0
8.0
2.0
10.5
1.5
6.2
2.0
8.0
2.0
10.5
tPZL
Output Disable Time
tPHZ
tPZL
1.0
5.5
1.0
5.5
Units
8 Outputs Switching
(Note 11)
(Note 11)
ns
ns
ns
ns
Note 8: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 9: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 10: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 11: The 3-STATE delay times are dominated by the RC network (500Ω, 250 pF) on the output and has been excluded from the datasheet.
Skew
(SOIC Package)
Symbol
Parameter
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
8 Outputs Switching
8 Outputs Switching
(Note 12)
(Note 13)
Max
Max
Units
tOSHL (Note 14)
Pin to Pin Skew, HL Transitions
1.0
1.5
ns
tOSLH (Note 14)
Pin to Pin Skew, LH Transitions
1.0
1.5
ns
tPS (Note 16)
Duty Cycle, LH–HL Skew
1.4
3.5
ns
tOST (Note 14)
Pin to Pin Skew, LH/HL Transitions
1.5
3.9
ns
tPV (Note 15)
Device to Device Skew, LH/HL Transitions
2.0
4.0
ns
Note 12: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 13: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 14: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or
HIGH-to-LOW (tOST). This specification is guaranteed but not tested.
Note 15: Propagation delay variation is for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but
not tested.
Note 16: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Capacitance
Symbol
Parameter
Typ
Units
Conditions
(TA = 25°C)
CIN
Input Capacitance
5
pF
VCC = 0V
COUT (Note 17)
Output Capacitance
9
pF
VCC = 5.0V
Note 17: COUT is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
5
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74ABT373
AC Loading
*Includes jig and probe capacitance
FIGURE 1. Standard AC Test Load
FIGURE 2. Test Input Signal Levels
Amplitude
Rep. Rate
tw
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 3. Test Input Signal Requirements
AC Waveforms
FIGURE 4. Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
FIGURE 6. 3-STATE Output HIGH
and LOW Enable and Disable Times
FIGURE 5. Propagation Delay,
Pulse Width Waveforms
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FIGURE 7. Setup Time, Hold Time
and Recovery Time Waveforms
6
74ABT373
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
Package Number M20B
7
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74ABT373
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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8
74ABT373
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
9
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74ABT373
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
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10
74ABT373 Octal Transparent Latch with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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