FAIRCHILD 74ABT245CSJ

Revised November 1999
74ABT245
Octal Bi-Directional Transceiver with 3-STATE Outputs
General Description
Features
The ABT245 contains eight non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus-oriented
applications. Current sinking capability is 64 mA on both
the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional
transceiver. Transmit (active HIGH) enables data from A
Ports to B Ports; Receive (active LOW) enables data from
B Ports to A Ports. The Output Enable input, when HIGH,
disables both A and B ports by placing them in a HIGH Z
condition.
■ Bidirectional non-inverting buffers
■ A and B output sink capability of 64 mA, source
capability of 32 mA
■ Guaranteed output skew
■ Guaranteed multiple output switching specifications
■ Output switching specified for both 50 pF and 250 pF
loads
■ Guaranteed simultaneous switching, noise level and
dynamic threshold performance
■ Guaranteed latchup protection
■ High impedance glitch-free bus loading during entire
power up and power down cycle
■ Non-destructive hot insertion capability
■ Disable time is less than enable time to avoid bus
contention
Ordering Code:
Order Number
74ABT245CSC
74ABT245CSJ
Package Number
M20B
M20D
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ABT245CMSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT245CMTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74ABT245CPC
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
© 1999 Fairchild Semiconductor Corporation
DS010945
Description
OE
Output Enable Input (Active LOW)
T/R
Transmit/Receive Input
A0–A7
Side A Inputs or 3-STATE Outputs
B0–B7
Side B Inputs or 3-STATE Outputs
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74ABT245 Octal Bi-Directional Transceiver with 3-STATE Outputs
September 1991
74ABT245
Logic Symbol
Truth Table
Inputs
OE
L
L
Bus B Data to Bus A
L
H
Bus A Data to Bus B
H
X
HIGH Z State
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Logic Diagram
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2
Output
T/R
Recommended Operating
Conditions
Storage Temperature
−65°C to +150°C
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 2)
−0.5V to +7.0V
Input Current (Note 2)
−30 mA to +5.0 mA
−40°C to +85°C
+4.5V to +5.5V
Minimum Input Edge Rate (∆V/∆t)
Data Input
50 mV/ns
Enable Input
20 mV/ns
Voltage Applied to Any Output
in the Disabled or
Power-off State
−0.5V to 5.5V
in the HIGH State
−0.5V to VCC
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
−500 mA
DC Latchup Source Current
Over Voltage Latchup (I/O)
10V
Note 2: Either voltage limit or current limit is sufficient to protect inputs
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
2.0
Units
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
VOH
Output HIGH Voltage
Recognized LOW Signal
Min
IIN = −18 mA (OE, T/R)
2.5
V
Min
IOH = −3 mA (An, Bn)
V
Min
IOH = −32 mA (An, Bn)
V
Min
IOL = 64 mA (A n, Bn)
µA
Max
7
µA
Max
VIN = 7.0V (OE, T/R)
µA
Max
VIN = 5.5V (An, Bn)
µA
Max
V
0.0
Output LOW Voltage
0.55
IIH
Input HIGH Current
1
1
IBVI
Input HIGH Current Breakdown Test
IBVIT
Input HIGH Current Breakdown Test (I/O)
100
IIL
Input LOW Current
−1
−1
Input Leakage Test
Conditions
Recognized HIGH Signal
2.0
VOL
VID
VCC
V
4.75
VIN = 2.7V (OE, T/R)
VIN = VCC (OE, T/R)
VIN = 0.5V (OE, T/R)
VIN = 0.0V (OE, T/R)
IID = 1.9 µA (OE, T/R)
All Other Pins Grounded
IIH + IOZH
Output Leakage Current
10
µA
0 − 5.5V VOUT = 2.7V (An, Bn); OE = 2.0V
IIL + I OZL
Output Leakage Current
−10
µA
0 − 5.5V VOUT = 0.5V (An, Bn); OE = 2.0V
IOS
Output Short-Circuit Current
−275
mA
Max
VOUT = 0.0V (An, Bn)
ICEX
Output HIGH Leakage Current
50
µA
Max
VOUT = V CC (An, Bn)
IZZ
Bus Drainage Test
100
µA
0.0
−100
VOUT = 5.5V (An, Bn);
All Others GND
ICCH
Power Supply Current
50
µA
Max
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
OE = V CC, T/R = GND or VCC;
ICCT
Additional
Outputs Enabled
2.5
mA
I CC/Input
Outputs 3-STATE
2.5
mA
Outputs 3-STATE
50
µA
No Load
0.1
mA/
All Outputs HIGH
All Other GND or VCC
VI = V CC − 2.1V
Max
OE, T/R V I = VCC − 2.1V
Data Input VI = VCC − 2.1V
All Others at VCC or GND.
ICCD
Dynamic ICC
MHz
Max
Outputs Open
OE = GND, T/R = GND or VCC
One Bit Toggling, 50% Duty Cycle
3
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74ABT245
Absolute Maximum Ratings(Note 1)
74ABT245
DC Electrical Characteristics
(SOIC package)
Symbol
Parameter
Min
Typ
Max
Units
VCC
0.7
1.0
Conditions
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
V
5.0
TA = 25°C (Note 3)
VOLV
Quiet Output Minimum Dynamic VOL
−1.3
−1.0
V
5.0
TA = 25°C (Note 3)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.7
3.1
V
5.0
TA = 25°C (Note 5)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.0
1.7
V
5.0
TA = 25°C (Note 4)
VILD
Maximum LOW Level Dynamic Input Voltage
V
5.0
TA = 25°C (Note 4)
0.9
0.6
Note 3: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested.
Note 4: Max number of data inputs (n) switching. n-1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (V ILD), 0V to threshold (VIHD ).
Guaranteed, but not tested.
Note 5: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
AC Electrical Characteristics
(SOIC and SSOP package)
Symbol
Parameter
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Min
Typ
Max
Min
Max
Min
tPLH
Propagation Delay
1.0
2.1
3.6
1.0
4.8
1.0
3.6
tPHL
Data to Outputs
1.0
2.4
3.6
1.0
4.8
1.0
3.6
Units
Max
tPZH
Output Enable
1.5
3.2
6.0
1.0
6.7
1.5
6.0
tPZL
Time
1.5
3.7
6.0
2.0
7.5
1.5
6.0
tPHZ
Output Disable
1.0
3.6
6.1
1.7
7.4
1.0
6.1
tPLZ
Time
1.0
3.3
5.6
1.7
6.5
1.0
5.6
ns
ns
ns
Extended AC Electrical Characteristics
(SOIC package)
Symbol
−40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
CL = 250 pF
8 Outputs Switching
1 Output Switching
8 Outputs Switching
Parameter
(Note 6)
Min
Typ
(Note 7)
(Note 8)
Max
Min
Max
Min
Max
fTOGGLE
Max Toggle Frequency
tPLH
Propagation Delay
1.5
5.0
1.5
6.0
2.5
8.5
tPHL
Data to Outputs
1.5
5.0
1.5
6.0
2.5
8.5
tPZH
Output Enable Time
1.5
6.5
2.5
7.5
2.5
9.5
1.5
6.5
2.5
7.5
2.5
11.0
1.0
6.5
1.0
5.6
tPZL
tPHZ
Output Disable Time
tPLZ
Units
100
MHz
(Note 9)
(Note 9)
ns
ns
ns
Note 6: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 7: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 8: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 9: The 3-STATE delays are dominated by the RC network (500Ω, 250 pF) on the output and have been excluded from the datasheet.
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4
74ABT245
Skew
(SOIC package)
Symbol
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
8 Outputs Switching
8 Outputs Switching
(Note 12)
(Note 13)
Max
Max
1.3
2.3
ns
1.0
1.8
ns
2.0
3.5
ns
2.0
3.5
ns
2.0
3.5
ns
Parameter
tOSHL
Pin to Pin Skew
(Note 10)
HL Transitions
tOSLH
Pin to Pin Skew
(Note 10)
LH Transitions
tPS
Duty Cycle
(Note 14)
LH–HL Skew
tOST
Pin to Pin Skew
(Note 10)
LH/HL Transitions
tPV
Device to Device Skew
(Note 11)
LH/HL Transitions
Units
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (t OSLH), or any combination switching LOW-to-HIGH and/or
HIGH-to-LOW (tOST). The specification is guaranteed but not tested.
Note 11: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not
tested.
Note 12: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.)
Note 13: These specifications guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 14: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Capacitance
Conditions
Symbol
Parameter
Typ
Units
TA = 25°C
CIN
Input Capacitance
5.0
pF
V CC = 0V (OE, T/R)
CI/O (Note 15)
I/O Capacitance
11.0
pF
V CC = 5.0V (An, Bn)
Note 15: CI/O is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
5
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74ABT245
AC Loading
*Includes jig and probe capacitance
FIGURE 1. Standard AC Test Load
FIGURE 2. Test Input Signal Levels
Amplitude
Rep. Rate
tW
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 3. Test Input Signal Requirements
AC Waveforms
FIGURE 4. Propagation Delay Waveforms
for Inverting and Non-Inverting Functions
FIGURE 6. 3-STATE Output HIGH
and LOW Enable and Disable Times
FIGURE 5. Propagation Delay,
Pulse Width Waveforms
FIGURE 7. Setup Time, Hold Time
and Recovery Time Waveforms
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74ABT245
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
Package Number M20B
7
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74ABT245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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8
74ABT245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
9
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74ABT245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
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10
74ABT245 Octal Bi-Directional Transceiver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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