FAIRCHILD 74ABT2541

Revised November 1999
74ABT2541
Octal Buffer/Line Driver with
25Ω Series Resistors in the Outputs
General Description
Features
The ABT2541 is an octal buffer and line driver designed to
drive the capacitive inputs of MOS memory drivers,
address drivers, clock drivers, and bus-oriented transmitters/receivers. Functionally identical to the ABT541.
■ Guaranteed output skew
The 25Ω series resistors in the outputs reduce ringing and
eliminate the need for external resistors.
■ Guaranteed simultaneously switching noise level and
dynamic threshold performance
■ Guaranteed multiple output switching specifications
■ Output switching specified for both 50 pF and
250 pF loads
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Nondestructive hot insertion capability
■ Disable time less than enable time to avoid bus
contention
Ordering Code:
Order Number
74ABT2541CSC
74ABT2541CSJ
Package Number
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ABT2541CMSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT2541CMTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
Description
OE1, OE2
Output Enable Input (Active LOW)
I0–I7
Inputs
O0–O7
Outputs
Truth Table
Schematic of Each Output
Inputs
OE1
OE2
I
Outputs
L
L
H
H
H
X
X
Z
X
H
X
Z
L
L
L
L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
© 1999 Fairchild Semiconductor Corporation
DS011502
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74ABT2541 Octal Buffer/Line Driver with 25Ω Series Resistors in the Outputs
September 1992
74ABT2541
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
Storage Temperature
−65°C to +150°C
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 2)
−0.5V to +7.0V
Input Current (Note 2)
−30 mA to +5.0 mA
−40°C to +85°C
+4.5V to +5.5V
Minimum Input Edge Rate (∆V/∆t)
Data Input
50 mV/ns
Enable Input
20 mV/ns
Voltage Applied to Any Output
in the Disabled or
Power-Off State
−0.5V to 5.5V
in the HIGH State
−0.5V to VCC
Current Applied to Output
in LOW State (Max)
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
twice the rated IOL (mA)
−500 mA
DC Latchup Source Current
Over Voltage Latchup (I/O)
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
10V
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
2.0
Units
VCC
V
Conditions
VIH
Input HIGH Voltage
Recognized HIGH Signal
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
IIN = −18 mA
VOH
Output HIGH Voltage
2.5
V
Min
IOH = −3 mA
2.0
V
Min
IOH = −32 mA
IOL = 15 mA
Recognized LOW Signal
VOL
Output LOW Voltage
0.8
V
Min
IIH
Input HIGH Current
1
µA
Max
IBVI
Input HIGH Current
7
Breakdown Test
IIL
−1
Input LOW Current
−1
4.75
VIN = 2.7V (Note 3)
VIN = VCC
1
µA
Max
µA
Max
V
0.0
VIN = 7.0V
VIN = 0.5V (Note 3)
VIN = 0.0V
IID = 1.9 µA
VID
Input Leakage Test
IOZH
Output Leakage Current
10
µA
0 − 5.5V
IOZL
Output Leakage Current
−10
µA
0 − 5.5V
IOS
Output Short-Circuit Current
−275
mA
Max
ICEX
Output High Leakage Current
50
µA
Max
VOUT = VCC
IZZ
Bus Drainage Test
100
µA
0.0
VOUT = 5.5V; All Others GND
ICCH
Power Supply Current
50
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
All Other Pins Grounded
−100
VOUT = 2.7V; OEn = 2.0V
VOUT = 0.5V; OEn = 2.0V
VOUT = 0.0V
OEn = VCC;
All Others at VCC or GND
ICCT
Additional ICC/Input
Outputs Enabled
2.5
mA
Outputs 3-STATE
2.5
mA
Outputs 3-STATE
50
µA
VI = VCC − 2.1V
Max
Enable Input VI = VCC − 2.1V
Data Input VI = VCC − 2.1V
All Others at VCC or GND
ICCD
Dynamic ICC
No Load
mA/
(Note 4)
0.1
MHz
Max
Outputs OPEN
OEn = GND
(Note 3)
One Bit Toggling, 50% Duty Cycle
Note 3: Guaranteed, but not tested.
Note 4: For 8 bit toggling, ICCD < 0.8 mA/MHz.
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(SOIC Package)
Symbol
Parameter
Min
Typ
Max
Units
VCC
0.6
0.8
Conditions
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
V
5.0
TA = 25°C (Note 5)
VOLV
Quiet Output Minimum Dynamic VOL
−0.5
−0.4
V
5.0
TA = 25°C (Note 5)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.7
3.1
V
5.0
TA = 25°C (Note 6)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.0
1.4
V
5.0
TA = 25°C (Note 7)
VILD
Maximum LOW Level Dynamic Input Voltage
V
5.0
TA = 25°C (Note 7)
1.2
0.8
Note 5: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested.
Note 6: Max number of data inputs (n) switching. n-1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD).
Guaranteed, but not tested.
Note 7: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
AC Electrical Characteristics
Symbol
tPLH
Parameter
Propagation Delay Data to Outputs
tPHL
tPZH
Output Enable Time
tPZL
tPHZ
Output Disable Time
tPLZ
TA = +25°C
TA = −40°C to +85°C
VCC = +5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
Min
Typ
Max
Min
Max
1.0
2.3
3.6
1.0
3.6
1.0
3.3
4.1
1.0
4.1
1.5
3.7
6.0
1.5
6.0
1.5
4.3
6.5
1.5
6.5
1.0
3.5
6.0
1.0
6.0
1.0
3.7
5.6
1.0
5.6
Units
ns
ns
ns
Extended AC Electrical Characteristics
(SOIC Package)
Symbol
−40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
V CC = 4.5V–5.5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
CL = 250 pF
8 Outputs Switching
1 Output Switching
8 Outputs Switching
Parameter
(Note 8)
Min
(Note 9)
Typ
(Note 10)
Max
Min
Max
Min
Max
fTOGGLE
Maximum Toggle Frequency
tPLH
Propagation Delay
1.5
5.0
1.5
6.0
2.5
8.5
tPHL
Data to Outputs
1.5
5.5
1.5
10.0
2.5
11.0
tPZH
Output Enable Time
1.5
6.5
2.5
7.5
2.5
9.5
1.5
7.0
2.5
11.0
2.5
12.5
1.0
6.0
1.0
6.0
tPZL
tPHZ
tPLZ
Output Disable Time
Units
100
MHz
(Note 11)
(Note 11)
ns
ns
ns
Note 8: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 9: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 10: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 11: The 3-STATE delays are dominated by the RC network (500Ω, 250 pF) on the output and have been excluded from the datasheet.
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74ABT2541
DC Electrical Characteristics
74ABT2541
Skew
(SOIC Package)
Symbol
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
8 Outputs Switching
8 Outputs Switching
(Note 12)
(Note 13)
Max
Max
1.3
2.3
ns
1.0
1.8
ns
2.0
5.0
ns
2.0
5.0
ns
2.0
5.0
ns
Parameter
tOSHL
Pin to Pin Skew
(Note 14)
HL Transitions
tOSLH
Pin to Pin Skew
(Note 14)
LH Transitions
tPS
Duty Cycle
(Note 15)
LH–HL Skew
tOST
Pin to Pin Skew
(Note 14)
LH/HL Transitions
tPV
Device to Device Skew
(Note 16)
LH/HL Transitions
Units
Note 12: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.)
Note 13: These specifications guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 14: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGHto-LOW (tOST). The specification is guaranteed but not tested.
Note 15: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Note 16: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not
tested.
Capacitance
Symbol
Parameter
Typ
Units
Conditions
TA = 25°C
CIN
Input Capacitance
5.0
pF
VCC = 0V
COUT (Note 17)
Output Capacitance
9.0
pF
VCC = 5.0V
Note 17: COUT is measured at frequency f = 1 MHz; per MIL-STD-883, Method 3012.
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74ABT2541
AC Loading
*Includes jig and probe capacitance.
FIGURE 2. Test Input Signal Levels
FIGURE 1. Standard AC Test Load
Amplitude
Rep. Rate
tW
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 3. Test Input Signal Requirements
AC Waveforms
FIGURE 4. Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
FIGURE 6. 3-STATE Output HIGH and
LOW Enable and Disable Times
FIGURE 5. Propagation Delay, Pulse Width Waveforms
FIGURE 7. Setup Time, Hold Time
and Recovery Time Waveforms
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74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Body
Package Number M20B
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6
74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
7
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74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
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8
74ABT2541 Octal Buffer/Line Driver with 25Ω Series Resistors in the Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
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to perform when properly used in accordance with
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user.
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