MAXIM MAX3866E/D

19-1433; Rev 1; 3/99
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
Features
The MAX3866 combined transimpedance preamplifier
and limiting postamplifier is intended for application in
SDH/SONET systems operating at 2.488Gbps. It operates from a single +3.3V or +5V supply and provides a
differential output signal. The differential outputs are
each 50Ω reverse terminated (100Ω differential termination) for low-noise and high-speed signal performance.
The small-signal bandwidth and noise performance is
specified for a source capacitance of 0.5pF. When the
MAX3866 is used with the PIN photodetector, sensitivities better than -22dBm can be achieved. The
MAX3866 is equipped with a programmable TTL lossof-power (LOP) output.
♦ Input Sensitivities Better than -22dBm (7.8µAp-p)
♦ Overdrive Capability Better than +1.4dBm
(2.5mAp-p)
♦ Single +3.3V or +5V Supply
♦ 165mW Power Dissipation (at 3.3V)
♦ 1.8GHz Analog Input Bandwidth
♦ Programmable Loss-of-Power Indicator
♦ 100Ω Differential Output
Ordering Information
Applications
SDH/SONET Transmission Systems
PART
PIN/Preamplifier Receivers
TEMP. RANGE
MAX3866E/D
(see Note)
PIN-PACKAGE
Dice
Note: Dice are designed to operate over a -40°C to +120°C
junction temperature (Tj) range, but are tested and guaranteed
at TA = +25°C.
2.488Gbps ATM Receivers
Regenerators for SDH/SONET
Pad Configuration appears at end of data sheet.
Typical Application Circuit
+3.3V
VCCS
VCCD
FIL
PHOTODIODE
200Ω
OUT+
LIMITING
POSTAMP
PREAMP
IN+
Zo = 50Ω
MAX3875
CLOCK AND DATA
RECOVERY
OUTZo = 50Ω
MAX3866
CHF+
CHF-
PDC
LOP
INV
CHF
RPD
________________________________________________________________ Maxim Integrated Products
1
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For small orders, phone 1-800-835-8769.
MAX3866
General Description
MAX3866
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
ABSOLUTE MAXIMUM RATINGS
VCCD Voltage .......................................................-0.5V to +7.0V
VCCS Voltage ...............0 ≤ VCCS ≤ VCCD and if VCCD ≥ 3.13V
then 3.13V ≤ VCCS ≤ VCCD
CHF+, CHF-, FIL, INV, LOP Voltage .......-0.5V to (VCCD + 0.5V)
IN-, IN+ Voltage.....................................................-0.5V to +1.0V
CPD+, CPD- Voltage ................(VCCD - 1.6V) to (VCCD + 0.5V)
OUT+, OUT- Voltage ................(VCCD - 1.1V) to (VCCD + 0.5V)
IN Current.......................................................................0 to 3mA
PDC Current..................................................................-1mA to 0
Operating Junction Temperature Range (Tj ).....-55°C to +125°C
Storage Temperature Range .............................-60°C to +160°C
Processing Temperature (Die).........................................+400°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCCD = VCCS = +3.3V ±5% or VCCD = +5.0V ±10%, VCCS = open, Tj = -40°C to +120°C, unless otherwise noted. Typical values
are at +3.3V and Tj = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
mA
Supply Current
IVCC
50
73
Input Bias Voltage
VIN
0.84
0.95
V
105
120
Ω
VCCD
V
Differential Output Impedance
ZOUT
90
LOP Output High Voltage
VOH
Load = 4.7kΩ to VCCD (Note 7)
LOP Output Low Voltage
VOL
Load = 4.7kΩ to VCCD (Note 7)
Differential Output Voltage Swing
VOD
RL = 100Ω (differential), IIN ≥ 7µAp-p
Output Common-Mode Voltage
VCM
RL = 100Ω (differential)
VCCD - 0.1
0.4
100
V
145
mVp-p
VCCD - 0.12
V
AC ELECTRICAL CHARACTERISTICS
(VCCD = VCCS = +3.3V ±5% or VCCD = +5.0V ±10%, VCCS = open, Tj = -40°C to +120°C, unless otherwise noted. Typical values
are at +3.3V and Tj = +25°C.) (Notes 1, 2)
PARAMETER
Small-Signal Bandwidth
SYMBOL
Input Sensitivity
IIN
Input-Referred RMS Noise
NIN
Low-Frequency Cutoff
CONDITIONS
MIN
BW
2.5Gbps, 223 - 1 PRBS, BER ≤ 10-10,
7.8
CIN = 0.5pF, Tj = +120°C
CIN = 0.5pF, Tj = +120°C
433
fL
25
LOP Hysteresis
Electrical (Note 4), low LOP assert,
RPD = 510Ω
3
LOP Assert Level
RPD = 510Ω
LOP Deassert Level
RPD = 510Ω
PSRR
MAX
1.8
f ≤ 2MHz, 100mVp-p
Power-Supply Rejection Ratio
TYP
UNITS
GHz
(Note 3)
µAp-p
566
nA
100
kHz
30
dB
dB
0.9
µA
8.0
µA
Output Edge Speed
tr, tf
20% to 80% (Note 5)
50
70
ps
Pulse-Width Distortion
PWD
(Notes 5, 6)
21
80
ps
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
2
CIN = total capacitance on IN.
AC parameters are guaranteed by design and characterization.
See Typical Operating Characteristics for worst-case distribution.
Hysteresis = 20 log (VDEASSERT / VASSERT).
IIN = 2.5mA.
PWD = [(2 · Pulse Width) - Period] / 2.
External load not required for normal operation.
_______________________________________________________________________________________
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
12
PWD (ps)
DEASSERT
ASSERT
40
8
6
30
4
20
10
2
0
0
-20
0
20
40
60
TEMPERATURE (¡C)
DIFFERENTIAL OUTPUT VOLTAGE
vs. TEMPERATURE
SUPPLY CURRENT
vs. TEMPERATURE
135
130
125
120
115
MAX3866 TOC05
80
70
60
3.47V
50
40
100
3.14V
-40
-20
0
20
40
60
80
3.10
-50
-30
-20
0
20
40
60
140
135
125
120
115
110
-30
-10
10
30
50
70
90
1
10
100
1k
PULSE-WIDTH DISTORTION
vs. INPUT CURRENT
ELECTRICAL EYE DIAGRAM
ELECTRICAL EYE DIAGRAM
MAX3866 TOC07
10k
MAX3866 TOC09
INPUT CURRENT (µA)
MAX3866 TOC08
TEMPERATURE (°C)
15
100
130
TEMPERATURE (°C)
20
80
100
-50
100
OUT-
3.15
105
30
-60
OUT+
3.20
100
110
105
3.25
OUTPUT VOLTAGE vs. INPUT CURRENT
90
SUPPLY CURRENT (mA)
140
3.30
TEMPERATURE (°C)
100
MAX3866 TOC04
145
80
OUTPUT VOLTAGE (mVp-p)
-40
RPD (Ω)
150
3.35
3.00
-60
100
3.40
3.05
IN+ = 100µA
10
DIFFERENTIAL OUTPUT VOLTAGE (mVp-p)
10
3.45
MAX3866 TOC06
60
MAX3866 toc03
14
3.50
COMMON-MODE VOLTAGE (V)
70
MAX3866 TOC02
80
ASSERT/DEASSERT (µA)
16
MAX3866 TOC01
90
50
OUTPUT COMMON-MODE VOLTAGE
vs. TEMPERATURE
PULSE-WIDTH DISTORTION
vs. TEMPERATURE
LOP ASSERT/DEASSERT
vs. RPD
PWD (ps)
10
5
20mV/
div
0
INPUT = 8µAp-p, 2.5Gbps,
223-1PRBS
RL = 100Ω DIFFERENTIAL
-5
20mV/
div
INPUT = 2.5mAp-p, 2.5Gbps,
223-1PRBS
RL = 100Ω DIFFERENTIAL
-10
-15
-20
1
10
100
1k
10k
50ps
50ps
INPUT CURRENT (µA)
_______________________________________________________________________________________
3
MAX3866
Typical Operating Characteristics
(VCCD = VCCS = +3.3V, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VCCD = VCCS = +3.3V, TA = +25°C, unless otherwise noted.)
30
MAX3866 toc10
99
98
25
PERCENT OF UNITS (%)
97
96
95
94
93
92
91
MAX3866 toc11
DISTRIBUTION OF ELECTRICAL
SENSITIVITY (WORST CASE)
SMALL-SIGNAL IMPEDANCE
vs. FREQUENCY
TRANSIMPEDANCE
(20log (VOUTp-p/IN+))
MAX3866
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
VCC = +3.14V TO +5.5V
Tj = +120°C
20
15
10
5
90
0
89
0.01
0.1
1
10
100
1000
7.28
FREQUENCY (MHz)
7.71
8.14
8.57
ELECTRICAL SENSITIVITY (µAp-p)
Pad Description
PAD NAME
FUNCTION
VCCS
Positive Supply Voltage of Input Stage. Apply +3.3V if VCCD = +3.3V. If VCCD > +3.47V, disconnect from supply and decouple to GND.
CHF+
External Filter Capacitor. A capacitor connected between CHF+ and CHF- is used for setting the low-frequency
cutoff.
CHF-
External Filter Capacitor. A capacitor connected between CHF+ and CHF- is used for setting the low-frequency
cutoff.
FIL
GND
Electrical Ground
IN+
Signal Input
IN-
No Connect
PDC
The voltage at this node programs the gain of the power detector. Connect a resistor between PDC and INV to
adjust the LOP threshold.
INV
Used for programming the gain of the power detector. Connect a resistor between PDC and INV to adjust the
LOP threshold.
CPD-
Filter Node for Power Detector. A capacitor connected between CPD+ and CPD- will provide additional filtering
to the rectifier output within the power detector.
CPD+
Filter Node for Power Detector. A capacitor connected between CPD+ and CPD- will provide additional filtering
to the rectifier output within the power detector.
OUT-
Inverted Data-Signal Output
OUT+
Noninverted Data-Signal Output
LOP
VCCD
4
On-Chip Resistor for Filtering Photodiode Supply Voltage (connected to VCCD on chip)
TTL Output, Loss-of-Power, active high
Power-Supply Voltage
_______________________________________________________________________________________
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
3.3V
5.0V
CHF
100nF
CHF
100nF
10nF
CHF-
CHF+
CHF-
VCCD
VCCS
FIL
IN+
OUT+
IN-
LOP
IN+
100nF
MAX3866
OUT+
OUT+
IN-
GND
PDC
VCCD
FIL
100nF
OUT+
MAX3866
CHF+
VCCS
LOP
OUTINV
CPD-
CPD+
OUT-
GND
100nF
PDC
OUTINV
CPD-
CPD+
OUT100nF
RPD*
510Ω
RPD*
510Ω
5.0V OPERATION
3.3V OPERATION
* NOTE: IF LOP OPERATION IS NOT DESIRED, RPD = 0Ω
Circuit Description
Data Path
The combined preamplifier and limiting postamplifier
(Figure 1) accepts an input current from a photodiode
attached to the input pad IN+. The transimpedance
input amplifier stage converts the input current to an
output voltage with a typical transimpedance of 1.4kΩ.
The second stage of the data path is an active highpass filter. This filter converts the single-ended input
signal to a differential signal, eliminating the DC component and adding approximately 16dB of gain. The
output of the highpass filter drives the power detector
and limiting amplifier circuitry.
The limiting amplifier circuit is the third stage of the
data signal path. It amplifies and limits the differential
input signal. The output stage is a differential pair with
internal 50Ω load resistors. The limited output voltage is
typically 145mVp-p.
Power Detector
The power detect circuit consists of an adjustable-gain
amplifier and combined rectifier with a lowpass filter.
The adjustable-gain amplifier is controlled by an op amp.
The gain is adjusted by means of an external resistor
connected between the PDC and INV pins.
The output voltage of the adjustable gain amplifier
drives the combined rectifier and lowpass filter circuitry. The resulting DC voltage is fed to a Schmitt trigger,
which generates a high-level output signal if the DC
input signal is below the LOP assert level, thus causing
an LOP condition on the LOP output.
Design Procedure
Power Supply
The complete amplifier is supplied by a single supply
voltage, VCCD. For operation at 3.3V, the supply voltage is applied at both the VCCD and VCCS pins (see
Typical Operating Circuit). For operation at 5.0V, the
voltage is only applied at VCCD. In this case, VCCS is
on-chip controlled to approximately 3.2V. In the 5.0V
configuration, an external 10nF grounded capacitor is
required at the VCCS pin.
External Filter Capacitor CHF
The value of CHF affects the maximum speed at which
the compensation loop adjusts the input offset current.
CHF should be chosen between 10nF and 100nF. The
loop should be as slow as possible to reduce patterndependent jitter. Maxim recommends a value of CHF =
100nF.
_______________________________________________________________________________________
5
MAX3866
Typical Operating Circuits
MAX3866
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
CHF-
CHF+
ICC
MAX3866
RF
DATA SIGNAL PATH
OUT+
IN
OUTTIA
VCCS
LIM
HPF
OUT
FIL
VOLTAGE
REGULATOR
VCCD
GND
OP AMP
VREF
RMS DETECTOR
ADJ
LOP
RECTIFIER
PDC
INV
CPD+
CPD-
RPD
Figure 1. Functional Diagram of the Combined Preamplifier and Limiting Postamplifier
Loss-of-Power Threshold
If the LOP function is desired, Maxim recommends RPD
= 510Ω. If the LOP function is not desired, RPD = 0Ω
(shorted). See Figure 2 for LOP definitions. If desired,
the LOP threshold can be adjusted (see Assert/
Deassert vs. RPD in the Typical Operating Characteristics.
MAX. DEASSERT
INPUT CURRENT
External Filter Capacitor CPD
The LF cutoff of the power detector can be reduced by
adding external capacitance across the CPD pins. This
capacitor is only needed when this circuit is operated
at lower data rates and lower edge speeds. In this way,
the remaining ripple of power detector output voltage is
reduced.
DEASSERT
HYSTERESIS > 3dB
ASSERT
MIN. ASSERT
Figure 2. Loss-of-Power Definitions with RPD = 510Ω
6
_______________________________________________________________________________________
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
VCCS
VCCD
50Ω
50Ω
OUT+
OUTESD
STRUCTURE
IN+
IN-
ESD
STRUCTURE
ESD
STRUCTURE
GND
GND
Figure 3. OUT Pads
Figure 4. IN Pads
VCCD
CHF+ CHF-
VCCD
ESD
STRUCTURE
200Ω
ESD
STRUCTURES
FIL
GND
GND
Figure 5. FIL Pads
Figure 6. CHF Pads
_______________________________________________________________________________________
7
MAX3866
Internal Input/Output Schematics
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
MAX3866
Internal Input/Output Schematics (continued)
VCCD
PDC
VCCD
ESD
STRUCTURE
INV
ESD
STRUCTURE
GND
GND
Figure 8. PDC Pad
Figure 7. INV Pad
VCCD
CPD+ CPD-
VCCD
ESD
STRUCTURE
10k
LOP
ESD
STRUCTURES
GND
GND
Figure 9. LOP Pad
8
Figure 10. CPD Pad
_______________________________________________________________________________________
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
Converting Average Optical Power
to Signal Amplitude
Many of the MAX3866’s specifications relate to input
signal amplitude. When working with fiber optic
receivers, the input is usually expressed in terms of
average optical power and extinction ratio. The relations given in Table 1 are helpful for converting optical
power to input signal when designing with the
MAX3866.
In an optical receiver, the input current to the transimpedance amplifier can be found by multiplying the
power relationships in Table 1 with the photodiode
responsivity.
Wire Bonding
Table 1. Optical-Power Relations*
PARAMETER
SYMBOL
RELATION
Average
Power
PAVE
Extinction
Ratio
re
re = P1 / P0
Optical Power
of a “1”
P1
P1 = 2PAVE re
Optical Power
of a “0”
P0
P0 = 2PAVE / (re +1)
Signal
Amplitude
PIN
PIN = P1 - P0 = 2PAVE (re - 1)
PAVE = (P0 + P1) / 2
re + 1
(re + 1)
*Assuming a 50% average input mark density.
Make corrections to the die with gold wire only, using
ball bonding techniques. Die pad size is 4mils (100µm)
square and die thickness is 12mils (~300µm).
Pad Configuration
Layout Techniques
The MAX3866’s performance can be greatly affected
by circuit board layout and design. Use good high-frequency design techniques, including minimizing
ground inductances and using fixed-impedance transmission lines on all data signals.
MAX3866
Applications Information
LOP
GND
OUT+
GND
OUT-
VCCD
CPD+
VCCD
CPD-
VCCS
VCCS
GND 0.066"
GND (1.68mm)
CHF+
INV
CHF-
PDC
FIL GND IN+ IN- GND N.C.
0.057"
(1.45mm)
TRANSISTOR COUNT: 851
_______________________________________________________________________________________
9
MAX3866
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
NOTES
10
______________________________________________________________________________________
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
______________________________________________________________________________________
MAX3866
NOTES
11
MAX3866
2.5Gbps, +3.3V Combined
Transimpedance/Limiting Amplifier
NOTES
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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© 1999 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.