CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 D D D D D D D TSSOP PW PACKAGE (TOP VIEW) General-Purpose and PCI-X 1:4 Clock Buffer Operating Frequency: 0 MHz to 140 MHz Low Output Skew: <100 ps Distributes One Clock Input to One Bank of Four Outputs Output Enable Control That Drives Outputs Low When OE Is Low Operates From Single 3.3-V Supply 8-Pin TSSOP Package 1 2 3 4 CLKIN OE 1Y0 GND 8 7 6 5 1Y3 1Y2 VDD3.3V 1Y1 description The CDCV304 is a high-performance, low-skew, general-purpose and PCI-X clock buffer. It distributes one input clock signal (CLKIN) to the output clocks (1Y[0:3]). It is specifically designed for use with PCI-X applications. The CDCV304 operates at 3.3 V. The CDCV304 is characterized for operation from –40°C to 85°C for automotive and industrial applications. FUNCTION TABLE INPUTS OUTPUT CLKIN OE 1Y (0:3) L H L H L L H H L L L H functional block diagram OE CLKIN 2 Logic Control 3 1 5 7 8 1Y0 1Y1 1Y2 1Y3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 Terminal Functions TERMINAL NAME I/O NO. 1Y[0–3] 3, 5, 7, 8 CLKIN GND DESCRIPTION O Buffered output clocks 1 I Input reference frequency 4 Power OE 2 I VDD3.3V 6 Power Ground Outputs enable control 3.3-V supply absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.3 V Input voltage range, VI (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V Input clamp current, IIK (VI < 0 or VI > VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Output clamp current, IOK (VO < 0 or VO > VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous total output current, IO (VO = 0 to VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230.5°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions Supply voltage, VDD High-level input voltage, VIH MIN NOM MAX 3 3.3 3.6 0.7×VDD V V Low-level input voltage, VIL Input voltage, VI UNIT 0.3×VDD VDD 0 V V High-level output current, IOH –24 mA Low-level output current, IOL 24 mA 85 °C Operating free-air temperature, TA –40 timing requirements over recommended ranges of supply voltage and operating free-air temperature MIN fclk 2 Clock frequency 0 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 NOM MAX UNIT 140 MHz CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Input voltage VOH High-level output voltage VDD = 3 V, II = –18 mA VDD = min to max, IOH = –1 mA VDD = 3 V, IOH = –24 mA Low-level output voltage VDD = 3 V, IOH = –12 mA VDD = min to max, IOL = 1 mA VDD = 3 V, IOL = 24 mA VOL VDD = 3 V, VDD = 3 V, IOL = 12 mA VO = 1 V VDD = 3.3 V, VDD = 3 V, VO = 1.65 V VO = 2 V VO = 1.65 V IOH High level output current High-level IOL Low level output current Low-level II IDD Input current VDD = 3.3 V, VI = VO or VDD Dynamic current, See Figure 5 f = 67 MHz Ci Input capacitance VDD = 3.3 V, VDD = 3.3 V, Co Output capacitance † All typical values are at respective nominal VDD and 25°C. MIN TYP† MAX UNIT –1.2 V VDD–0.2 2 V 2.4 0.2 0.8 V 0.55 –50 mA –55 60 mA 70 VI = 0 V or VDD VI = 0 V or VDD ±5 µA 37 mA 3 pF 3.2 pF switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 10 pF, VDD = 3.3 V ± 0.3 V (see Note 6 and Figures 1 and 2) PARAMETER tPLH tPHL High-to-low propagation delay tsk(o) tsk(p) Output skew (see Note 4) tsk(pr) tsk(pp) Process skew Thi h high CLK high time, time See Figure 4 Tllow CLK low time time, See Figure 4 Low-to-high propagation delay Pulse skew TEST CONDITIONS See Figures 1 and 2 MIN TYP† MAX 1.8 2.5 3 ns 1.8 2.4 3 ns 50 100 ps 150 ps 0.2 0.3 ns 0.25 0.4 ns VIH = VDD, VIL = 0 V Part-to-part skew 66 MHz 6 140 MHz 3 66 MHz 6 140 MHz 3 tr Output rise slew rate‡ 0.2VDD to 0.6VDD tf Output fall slew rate‡ 0.6VDD to 0.2VDD † All typical values are at respective nominal VDD. ‡ This symbol is according to PCI-X terminology. NOTE 4: The tsk(o) specification is only valid for equal loading of all outputs. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT ns ns 1.5 2.7 4 V/ns 1.5 2.7 4 V/ns 3 CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 PARAMETER MEASUREMENT INFORMATION VDD 140 Ω Yn 140 Ω 10 pF Figure 1. Test Load Circuit VDD 50% VDD CLKIN 0V tPLH tPHL 0.6 VDD 50% VDD 0.2 VDD 1Y0 – 1Y3 VOH 0.6 VDD 50% VDD 0.2 VDD tr VOL tf Figure 2. Voltage Thresholds for Propagation Delay (tpd) Measurements 50% VDD Any Y 50% VDD Any Y tsk(0) Figure 3. Output Skew tcyc PARAMETER VIH(Min) VIL(Max) Vtest VALUE 0.5 VDD 0.35 VDD UNIT V 0.4 VDD V V thigh 0.6 VDD VIH(Min) tlow Vtest VIL(Max) 0.2 VDD 0.4 VDD Peak to Peak (Minimum) NOTE: All parameters in Figure 4 are according to PCI-X 1.0 specifications. Figure 4. Clock Waveform 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 PARAMETER MEASUREMENT INFORMATION SUPPLY CURRENT vs FREQUENCY 60 I CC – Supply Current – mA VDD = 3.6 V TA = 85°C 50 40 30 20 0 20 40 60 80 100 120 140 160 f – Frequency – MHz Figure 5 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT VOH – High-Level Output Voltage – V 3.5 3.0 VDD = 3.3 V TA = 25°C 2.5 2.0 1.5 1.0 0.5 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 IOH – High-Level Output Current – mA Figure 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 PARAMETER MEASUREMENT INFORMATION LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT VOL – Low-Level Output Voltage – V 3.5 3.0 VDD = 3.3 V TA = 25°C 2.5 2.0 1.5 1.0 0.5 0 –20 0 20 40 60 80 IOL – Low-Level Output Current – mA Figure 7 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 100 120 CDCV304 140-MHz PCI-X CLOCK BUFFER SCAS643B – SEPTEMBER 2000 REVISED JULY 2002 MECHANICAL DATA PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. 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