TI SN74HC377DW

 SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
D
D
D
D
D
D
D
D
D
SN54HC377 . . . J OR W PACKAGE
SN74HC377 . . . DW, N, OR NS PACKAGE
(TOP VIEW)
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 12 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Eight Flip-Flops With Single-Rail Outputs
Clock Enable Latched to Avoid False
Clocking
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
CLKEN
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
SN54HC377 . . . FK PACKAGE
(TOP VIEW)
1D
1Q
CLKEN
VCC
8Q
description/ordering information
These devices are positive-edge-triggered octal
D-type flip-flops with an enable input. The ’HC377
devices are similar to the ’HC273 devices, but
feature a latched clock-enable (CLKEN) input
instead of a common clear.
2D
2Q
3Q
3D
4D
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
Information at the data (D) inputs meeting the
setup time requirements is transferred to the
Q outputs on the positive-going edge of the clock
(CLK) pulse, if CLKEN is low. Clock triggering
occurs at a particular voltage level and is not
directly related to the transition time of the
positive-going pulse. When CLK is at either the
high or low level, the D input has no effect at the
output. These devices are designed to prevent
false clocking by transitions at CLKEN.
4
ORDERING INFORMATION
PDIP – N
–40°C
40°C to 85°C
–55°C
55 C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube
SN74HC377N
Tube
SN74HC377DW
Tape and reel
SN74HC377DWR
SOP – NS
Tape and reel
SN74HC377NSR
HC377
CDIP – J
Tube
SNJ54HC377J
SNJ54HC377J
CFP – W
Tube
SNJ54HC377W
SNJ54HC377W
SOIC – DW
SN74HC377N
HC377
LCCC – FK
Tube
SNJ54HC377FK
SNJ54HC377FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
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1
SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
FUNCTION TABLE
(each flip-flop)
INPUTS
CLKEN
CLK
D
OUTPUT
Q
H
X
X
Q0
L
↑
H
H
L
↑
L
L
X
L
X
Q0
logic diagram (positive logic)
CLKEN
CLK
1
11
C1
1D
3
C1
2D
4
3D
4D
13
14
7D
8D
2
16
1D
C1
18
15
1D
C1
17
12
1D
C1
6D
9
1D
C1
5D
6
1D
C1
8
5
1D
C1
7
2
1D
1D
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19
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC377
VCC
VIH
Supply voltage
High-level
High
level in
input
ut voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VIL
VI
VO
∆t/∆v
Low-level
Low
level in
input
ut voltage
MIN
NOM
MAX
2
5
6
MIN
NOM
MAX
2
5
6
1.5
1.5
3.15
3.15
4.2
4.2
VCC = 4.5 V
VCC = 6 V
Input voltage
0
Output voltage
0
Input
In
ut transition rise/fall time
SN74HC377
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
0.5
1.35
1.35
1.8
1.8
0
0
V
V
0.5
VCC
VCC
UNIT
VCC
VCC
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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3
SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –20
20 µA
VOH
VI = VIH or VIL
IOH = –4 mA
IOH = –5.2 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 4 mA
IOL = 5.2 mA
II
ICC
VI = VCC or 0
VI = VCC or 0,
IO = 0
VCC
MIN
TA = 25°C
TYP
MAX
MIN
MAX
SN74HC377
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
MAX
UNIT
V
5.34
2V
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
8
160
80
µA
3
10
10
10
pF
6V
Ci
SN54HC377
2 V to 6 V
V
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
fclock
tw
Clock frequency
Pulse duration, CLK high or low
D
tsu
Set p time before CLK↑
Setup
CLKEN high or low
th
4
Hold time after CLK↑
CLKEN inactive or active,, data
POST OFFICE BOX 655303
TA = 25°C
MIN
MAX
SN54HC377
MIN
MAX
SN74HC377
MIN
MAX
2V
5
3
4
4.5 V
25
16
20
6V
29
19
23
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
5
5
5
4.5 V
5
5
5
6V
5
5
5
• DALLAS, TEXAS 75265
UNIT
MHz
ns
ns
ns
SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
d
tt
CLK
Any
Any
y
VCC
MIN
TA = 25°C
TYP
MAX
SN54HC377
MIN
MAX
SN74HC377
MIN
2V
5
11
3
4
4.5 V
25
54
16
20
6V
29
64
19
23
MAX
UNIT
MHz
2V
56
160
240
200
4.5 V
15
32
48
40
6V
12
27
41
34
2V
38
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per flip-flop
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
30
UNIT
pF
5
SCLS307B– JANUARY 1996 – REVISED JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
High-Level
Pulse
Test
Point
50%
50%
0V
tw
CL = 50 pF
(see Note A)
VCC
Low-Level
Pulse
50%
50%
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
VCC
50%
50%
0V
tPLH
Reference
Input
VCC
50%
In-Phase
Output
0V
tsu
Data
Input 50%
10%
90%
tr
tPHL
VCC
50%
10% 0 V
90%
90%
tr
th
90%
50%
10%
tPHL
Out-of-Phase
Output
90%
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
tPLH
50%
10%
tf
tf
VOH
50%
10%
VOL
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-87807012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-8780701RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
SN54HC377J
ACTIVE
CDIP
J
20
1
TBD
Call TI
SN74HC377DW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74HC377DWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74HC377N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74HC377NSR
ACTIVE
SO
NS
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SNJ54HC377FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54HC377J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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