KIT ATION EVALU E L B A IL AVA 19-3435; Rev 0; 10/04 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch Features The MAX9994 high-linearity downconversion mixer provides 8.3dB gain, +26.2dBm IIP3, and 9.7dB NF for 1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS base-station receiver applications. With a 1400MHz to 2000MHz LO frequency range, this particular mixer is ideal for low-side LO injection receiver architectures. High-side LO injection is supported by the MAX9996*, which is pin-for-pin and functionally compatible with the MAX9994. In addition to offering excellent linearity and noise performance, the MAX9994 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9994 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 235mA. ♦ 1700MHz to 2200MHz RF Frequency Range ♦ 1400MHz to 2000MHz LO Frequency Range (MAX9994) ♦ 1900MHz to 2400MHz LO Frequency Range (MAX9996) ♦ 40MHz to 350MHz IF Frequency Range ♦ 8.3dB Conversion Gain ♦ +26.2dBm Input IP3 ♦ +12.6dBm Input 1dB Compression Point ♦ 9.7dB Noise Figure ♦ 67dBc 2RF - 2LO Spurious Rejection at PRF = -10dBm ♦ Integrated LO Buffer ♦ Integrated RF and LO Baluns for Single-Ended Inputs ♦ Low -3dBm to +3dBm LO Drive ♦ Built-In SPDT LO Switch with 45dB LO1 to LO2 Isolation and 50ns Switching Time ♦ Pin Compatible with MAX9984/MAX9986 815MHz to 995MHz Mixers ♦ Functionally Compatible with MAX9993 ♦ External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode ♦ Lead-Free Package Available The MAX9994/MAX9996 are pin compatible with the MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9994 is also functionally compatible with the MAX9993. The MAX9994 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40°C to +85°C temperature range. Ordering Information Applications UMTS/WCDMA Base Stations PART TEMP RANGE PIN-PACKAGE DCS1800/PCS1900 EDGE Base Stations cdmaOne™ and cdma2000® Base Stations MAX9994ETP 20 Thin QFN-EP** -40°C to +85°C 5mm × 5mm T2055-3 bulk MAX9994ETP-T 20 Thin QFN-EP** -40°C to +85°C 5mm × 5mm T2055-3 T/R MAX9994ETP+D 20 Thin QFN-EP** -40°C to +85°C 5mm × 5mm T2055-3 lead-free bulk PHS/PAS Base Stations Predistortion Receivers Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. *Future product—contact factory for availability. PKG CODE 20 Thin QFN-EP** MAX9994ETP+TD -40°C to +85°C 5mm × 5mm T2055-3 lead-free T/R **EP = Exposed paddle. + = Lead free. D = Dry pack. Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX9994 General Description MAX9994 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS θJA .................................................................................+38°C/W θJC ...................................................................................+8°C/W Operating Temperature Range (Note A) ....TC = -40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering 10s) ..................................+300°C VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70°C) 20-Pin Thin QFN-EP (derate 20mW/°C above +70°C)..............1.8W Note A: TC is the temperature on the exposed paddle of the package. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX9994 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 806Ω, R2 = 549Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25°C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LO_SEL Input-Logic Low VIL LO_SEL Input-Logic High VIH CONDITIONS MIN TYP MAX 4.75 5.00 5.25 V 206 235 mA 0.8 V 2 UNITS V AC ELECTRICAL CHARACTERISTICS (MAX9994 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, fRF > fLO, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, TC = +25°C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL RF Frequency Range fRF LO Frequency Range fLO IF Frequency Range fIF Conversion Gain GC Input Third-Order Intercept Point (Note 4) Input IP3 Variation Over Temperature 2 CONDITIONS UNITS 1700 MIN TYP 2200 MHz (Note 3) 1400 2000 MAX9996 1900 2400 40 PRF < +2dBm, TA = +25°C (Note 4) 7.2 350 8.3 9.2 MHz MHz dB TC = -40°C to +85°C ±0.75 dB P1dB (Note 5) 12.6 dBm IIP3 Two tones: fRF1 = 2000MHz, fRF2 = 2001MHz, PRF = -5dBm/tone, fLO = 1800MHz, PLO = 0dBm, TA = +25°C 26.2 dBm ±0.5 dB Gain Variation Over Temperature Input Compression Point MAX (Note 3) TC = -40°C to +85°C 23.5 _______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch (MAX9994 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, fRF > fLO, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, TC = +25°C, unless otherwise noted.) (Notes 1, 2) PARAMETER Noise Figure SYMBOL NF Noise Figure Under-Blocking CONDITIONS MIN TYP UNITS 9.7 dB PRF = 5dBm, fRF = 2000MHz, fLO = 1810MHz, fblock = 2100MHz (Note 6) 19 dB LO Drive -3 2x2 2RF - 2LO 3x3 3RF - 3LO Spurious Response at IF LO1 to LO2 Isolation (Note 1) MAX Single sideband +3 PRF = -10dBm 67 PRF = -5dBm 62 PRF = -10dBm 82 PRF = -5dBm 72 LO2 selected, 1500MHz < fLO < 1700MHz 40 52 LO1 selected, 1500MHz < fLO < 1700MHz 40 45 dBm dBc dB Maximum LO Leakage at RF Port PLO = +3dBm -17 dBm Maximum LO Leakage at IF Port PLO = +3dBm -30 dBm 35 dB 50 ns 21 dB Minimum RF-to-IF Isolation LO Switching Time 50% of LOSEL to IF settled to within 2° RF Port Return Loss LO1/2 port selected, LO2/1 and IF terminated 16 LO1/2 port unselected, LO2/1 and IF terminated 26 LO driven at 0dBm, RF terminated into 50Ω, differential 200Ω 20 dB LO Port Return Loss IF Port Return Loss Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: dB Guaranteed by design and characterization. All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Operation outside this range is possible, but with degraded performance of some parameters. Production tested. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021. _______________________________________________________________________________________ 3 MAX9994 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 200MHz, unless otherwise noted.) 8 TC = +25°C PLO = -3dBm, 0dBm, +3dBm 8 6 1800 1950 2100 2250 2400 1650 RF FREQUENCY (MHz) 2100 2250 1500 2400 TC = -25°C 24 TC = +85°C PLO = -3dBm, 0dBm 24 1950 2100 2250 1650 NOISE FIGURE vs. RF FREQUENCY 1800 1950 2100 2250 TC = +85°C 11 NOISE FIGURE (dB) TC = +25°C 10 9 TC = -25°C 8 PLO = -3dBm 2400 6 PLO = 0dBm 9 PLO = +3dBm 2100 RF FREQUENCY (MHz) 24 1500 1650 2250 2400 1800 1950 2100 2250 12 11 VCC = 5.25V 2400 10 9 VCC = 4.75V VCC = 5.0V 8 7 7 1950 VCC = 5.0V, 5.25V NOISE FIGURE vs. RF FREQUENCY 10 8 7 1800 25 NOISE FIGURE vs. RF FREQUENCY 11 1650 VCC = 4.75V RF FREQUENCY (MHz) 12 MAX9994 toc07 12 1500 26 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 13 2400 22 1500 2400 NOISE FIGURE (dB) 1800 2250 23 MAX9994 toc08 1650 2100 27 22 21 1950 INPUT IP3 vs. RF FREQUENCY 26 25 1800 28 23 22 1500 1650 RF FREQUENCY (MHz) PLO = +3dBm 27 INPUT IP3 (dBm) 26 INPUT IP3 (dBm) 1950 28 MAX9994 toc04 TC = +25°C 27 4 1800 INPUT IP3 vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY 23 VCC = 4.75V, 5.0V, 5.25V RF FREQUENCY (MHz) 28 25 8 6 1500 INPUT IP3 (dBm) 1650 MAX9994 toc05 1500 9 7 7 6 MAX9994 toc03 MAX9994 toc02 9 10 MAX9994 toc06 TC = +85°C CONVERSION GAIN vs. RF FREQUENCY 11 MAX9994 toc09 9 7 10 CONVERSION GAIN (dB) CONVERSION GAIN (dB) MAX9994 toc01 TC = -25°C 10 CONVERSION GAIN vs. RF FREQUENCY 11 CONVERSION GAIN (dB) CONVERSION GAIN vs. RF FREQUENCY 11 NOISE FIGURE (dB) MAX9994 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) _______________________________________________________________________________________ 2250 2400 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 2RF - 2LO RESPONSE vs. RF FREQUENCY TC = +25°C TC = -25°C 65 60 55 70 65 60 PLO = 0dBm TC = +85°C PLO = -3dBm 50 50 1800 1950 2100 2250 1650 3RF - 3LO RESPONSE vs. RF FREQUENCY PRF = -5dBm TC = +85°C 80 75 70 60 1950 2100 2250 PRF = -5dBm TC = +25°C 1950 85 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 2250 2400 1650 1800 1950 2100 2250 INPUT P1dB (dBm) 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 MAX9994 toc12 80 75 70 65 VCC = 5.25V VCC = 5.0V 1500 1650 1800 1950 2100 2250 2400 INPUT P1dB vs. RF FREQUENCY 13 12 PLO = -3dBm, 0dBm, +3dBm 15 VCC = 5.25V 14 13 12 11 10 1500 VCC = 4.75V 85 2400 11 10 2400 PRF = -5dBm MAX9994 toc17 14 TC = +25°C 11 2250 RF FREQUENCY (MHz) 15 MAX9994 toc16 12 2100 90 INPUT P1dB vs. RF FREQUENCY 13 1950 55 1500 INPUT P1dB vs. RF FREQUENCY TC = +85°C 1800 3RF - 3LO RESPONSE vs. RF FREQUENCY RF FREQUENCY (MHz) 15 TC = -25°C 1650 60 RF FREQUENCY (MHz) 14 VCC = 4.75V, 5.0V, 5.25V 95 60 2100 55 1500 INPUT P1dB (dBm) 1800 60 2400 55 1650 65 RF FREQUENCY (MHz) 90 55 1500 70 3RF - 3LO RESPONSE vs. RF FREQUENCY 3RF - 3LO RESPONSE (dBc) 3RF - 3LO RESPONSE (dBc) 90 TC = -25°C 1800 95 MAX9994 toc13 95 65 75 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 85 80 45 1500 2400 3RF - 3LO RESPONSE (dBc) 1650 MAX9994 toc14 1500 PRF = -5dBm 50 45 45 INPUT P1dB (dBm) MAX9994 toc11 PLO = +3dBm 55 85 MAX9994 toc15 70 PRF = -5dBm 75 2RF - 2LO RESPONSE vs. RF FREQUENCY 90 MAX9994 toc18 75 80 2RF - 2LO RESPONSE (dBc) 2RF - 2LO RESPONSE (dBc) MAX9994 toc10 PRF = -5dBm 80 85 2RF - 2LO RESPONSE (dBc) 2RF - 2LO RESPONSE vs. RF FREQUENCY 85 VCC = 4.75V VCC = 5.0V 10 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 1500 1650 1800 1950 2100 2250 2400 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9994 Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 200MHz, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 200MHz, unless otherwise noted.) LO SWITCH ISOLATION vs. LO FREQUENCY 50 TC = -25°C 45 TC = +85°C TC = +25°C 40 PLO = +3dBm 50 45 PLO = -3dBm PLO = 0dBm 40 1450 1600 1750 1900 2050 50 45 VCC = 4.75V, 5.0V, 5.25V 40 35 1300 2200 1450 1600 1750 1900 2050 2200 1300 1450 1600 1750 1900 2050 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -30 -35 -40 TC = +25°C -45 -25 LO LEAKAGE (dBm) TC = -25°C -30 PLO = -3dBm -35 -40 -45 -50 -50 -55 -55 -20 2200 MAX9994 toc24 -25 -20 -25 LO LEAKAGE (dBm) TC = +85°C MAX9994 toc23 -20 MAX9994 toc22 1300 MAX9994 toc21 55 35 35 LO LEAKAGE (dBm) MAX9994 toc20 55 LO SWITCH ISOLATION (dB) MAX9994 toc19 LO SWITCH ISOLATION (dB) 55 LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION (dB) LO SWITCH ISOLATION vs. LO FREQUENCY VCC = 5.25V -30 -35 VCC = 5.0V -40 VCC = 4.75V -45 PLO = 0dBm -50 PLO = +3dBm -60 -60 1450 1600 1750 1900 2050 2200 1450 1600 1750 1900 2050 1450 1600 1750 1900 2050 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = -25°C, +25°C, +85°C -25 -30 -15 -20 PLO = -3dBm, 0dBm, +3dBm -25 -30 1450 1600 1750 1900 LO FREQUENCY (MHz) 2050 2200 2200 MAX9994 toc27 -10 LO LEAKAGE AT RF PORT (dBm) -20 -10 MAX9994 toc26 MAX9994 toc25 -15 1300 1300 2200 LO FREQUENCY (MHz) -10 6 -55 1300 LO LEAKAGE AT RF PORT (dBm) 1300 LO LEAKAGE AT RF PORT (dBm) MAX9994 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch -15 VCC = 5.0V -20 VCC = 4.75V -25 VCC = 5.25V -30 1300 1450 1600 1750 1900 LO FREQUENCY (MHz) 2050 2200 1300 1450 1600 1750 1900 LO FREQUENCY (MHz) _______________________________________________________________________________________ 2050 2200 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch RF-TO-IF ISOLATION vs. RF FREQUENCY 40 TC = +25°C 35 MAX9994 toc29 PLO = 0dBm 45 40 PLO = -3dBm 35 TC = -25°C 30 1650 1800 1950 2100 2250 2400 40 VCC = 5.25V 30 1500 1650 1800 1950 2100 2250 2400 1500 1650 1800 1950 2100 2250 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY LO SELECTED RETURN LOSS vs. LO FREQUENCY 20 25 PLO = -3dBm, 0dBm, +3dBm 15 25 30 35 45 40 50 1800 1950 2100 VCC = 5.0V 40 35 2250 VCC = 4.75V PLO = +3dBm 15 20 PLO = -3dBm 25 PLO = 0dBm 30 35 100 150 200 250 300 350 1300 1500 IF FREQUENCY (MHz) 2100 2300 240 10 15 20 PLO = -3dBm, 0dBm, +3dBm 30 MAX9994 toc35 5 1900 SUPPLY CURRENT vs. TEMPERATURE (TC) MAX9994 toc34 0 1700 LO FREQUENCY (MHz) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY 25 5 10 40 50 2400 RF FREQUENCY (MHz) LO UNSELECTED RETURN LOSS (dB) 1650 VCC = 5.25V 20 MAX9994 toc33 10 2400 0 MAX9994 toc32 5 LO SELECTED RETURN LOSS (dB) 15 0 IF PORT RETURN LOSS (dB) MAX9994 toc31 5 10 1500 45 RF FREQUENCY (MHz) 0 30 VCC = 5.0V 50 35 30 1500 RF PORT RETURN LOSS (dB) VCC = 4.75V 55 RF-TO-IF ISOLATION (dB) 45 60 50 230 SUPPLY CURRENT (mA) RF-TO-IF ISOLATION (dB) 50 PLO = +3dBm 55 RF-TO-IF ISOLATION (dB) TC = +85°C 55 60 MAX9994 toc28 60 RF-TO-IF ISOLATION vs. RF FREQUENCY MAX9994 toc30 RF-TO-IF ISOLATION vs. RF FREQUENCY VCC = 5.25V 220 210 200 190 35 VCC = 5.0V VCC = 4.75V 180 40 1300 1500 1700 1900 LO FREQUENCY (MHz) 2100 2300 -30 -10 10 30 50 70 90 TEMPERATURE (°C) _______________________________________________________________________________________ 7 MAX9994 Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 200MHz, unless otherwise noted.) SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9994 Pin Description PIN NAME FUNCTION 1, 6, 8, 14 VCC 2 RF Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. 3 TAP Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. 4, 5, 10, 12, 13, 17 GND Ground 7 LOBIAS Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Bias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply. 9 LOSEL 11 LO1 Local Oscillator Select. Logic control input for selecting LO1 or LO2. 15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2. 16 LEXT External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor carries approximately 100mA DC current. 18, 19 IF-, IF+ Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). 20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND. EP GND Local Oscillator Input 1. Drive LOSEL low to select LO1. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias. Detailed Description The MAX9994 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.2dBm of IIP3, with a typical 9.7dB noise figure. The integrated baluns and matching circuitry allow for 50Ω single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 45dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9994’s inputs to a range of -3dBm to +3dBm. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS, cdma2000, and 2G/2.5G/3G DCS1800 and PCS1900 base stations. The MAX9994 is specified to operate over a 1700MHz to 2200MHz RF frequency range, a 1400MHz to 2000MHz LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. 8 This device can operate in high-side LO injection applications with an extended LO range, but performance degrades as fLO continues to increase. See the Typical Operating Characteristics for measurements taken with fLO up to 2200MHz. The MAX9996—a variant of the MAX9994—provides better high-side performance since it is tuned for a higher LO range of 1900MHz to 2400MHz. Contact the factory for details. As a result of these higher LO frequencies, the MAX9996 may also be a better choice for extending the RF frequency range beyond 2200MHz. RF Input and Balun The MAX9994 RF input is internally matched to 50Ω, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. Input return loss is typically 21dB over the entire 1700MHz to 2200MHz RF frequency range. LO Inputs, Buffer, and Balun The MAX9994 can be used for either high-side or lowside injection applications with a 1400MHz to 2000MHz LO frequency range. For a device with a 1900MHz to 2400MHz LO frequency range, refer to the MAX9996 _______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch High-Linearity Mixer The core of the MAX9994 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF - 2LO rejection, and NF performance is typically 26.2dBm, 67dBc, and 9.7dB, respectively. Differential IF Output Amplifier The MAX9994 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF - 2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200Ω differential output impedance to a 50Ω singleended output. After the balun, the IF return loss is better than 15dB. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50Ω. No matching components are required. Return loss at the RF port is typically 21dB over the entire input range (1700MHz to 2200MHz) and return loss at the LO ports are typically better than 14dB (1400MHz to 2000MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200Ω (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50Ω singleended output (see the Typical Application Circuit). Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the ±1% bias resistor values are not readily available, substitute standard ±5% values. LEXT Inductor LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to optimize the performance for a particular frequency band. Since approximately 100mA flows through this inductor, it is important to use a low DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9994 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. _______________________________________________________________________________________ 9 MAX9994 data sheet. As an added feature, the MAX9994 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. LO1 and LO2 inputs are internally matched to 50Ω, requiring only a 22pF DC blocking capacitor. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9994’s 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9994 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION L1, L2 470nH Wire-wound high-Q inductors (0805) L3 10nH Wire-wound high-Q inductor (0603) C1 4pF Microwave capacitor (0603) C4 10pF Microwave capacitor (0603) C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603) C3, C5, C9, C11 0.01µF Microwave capacitors (0603) C13, C14 150pF Microwave capacitors (0603) C15 150pF Microwave capacitor (0402) R1 806Ω ±1% resistor (0603) R2 549Ω ±1% resistor (0603) R3 7.15Ω ±1% resistor (1206) T1 4:1 balun IF balun U1 MAX9994 Maxim IC 16 LEXT 17 GND 18 IF- 19 IF+ 20 IFBIAS Pin Configuration/Functional Diagram VCC 1 15 LO2 RF 2 MAX9994 11 LO1 VCC GND 10 GND 5 LOSEL 9 12 GND 8 GND 4 LOBIAS 7 13 GND 6 10 14 VCC TAP 3 VCC MAX9994 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch VCC T1 3 IF OUTPUT 6 R3 L1 2 L2 C2 VCC RF C5 TAP C4 GND LEXT C12 1 15 C1 RF INPUT 16 IF18 19 IF+ IFBIAS C3 4 L3 20 VCC 1 C15 R1 GND C14 17 C13 MAX9994 2 14 3 13 4 12 5 11 LO2 LO2 INPUT VCC VCC C11 GND GND LO1 INPUT 10 LO1 GND 9 LOSEL 8 VCC VCC LOBIAS 6 7 C10 GND R2 VCC C6 LOSEL INPUT C7 C8 VCC C9 ______________________________________________________________________________________ 11 MAX9994 Typical Application Circuit Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) QFN THIN.EPS MAX9994 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch D2 0.15 C A D b C L 0.10 M C A B D2/2 D/2 k 0.15 C B MARKING XXXXX E/2 E2/2 C L (NE-1) X e E E2 k L DETAIL A PIN # 1 I.D. e PIN # 1 I.D. 0.35x45 (ND-1) X e DETAIL B e L1 L C L C L L L e e 0.10 C A C 0.08 C A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 -DRAWING NOT TO SCALE- COMMON DIMENSIONS A1 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 A3 b D E L1 0 0.02 0.05 0 0.20 REF. 0.02 0.05 0 0.20 REF. 0.02 0.05 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. e k L 0.02 0.05 0.20 REF. 0.65 BSC. 0.50 BSC. 0.50 BSC. 0.25 - 0.25 - 0.25 - 0.25 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 - - - - - N ND NE 16 4 4 20 5 5 JEDEC WHHB WHHC - - 1 2 EXPOSED PAD VARIATIONS PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. A F - - - 28 7 7 WHHD-1 - - 32 8 8 WHHD-2 NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. D2 L E2 PKG. CODES MIN. NOM. MAX. MIN. NOM. MAX. –0.15 T1655-1 T1655-2 T1655N-1 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.10 3.20 3.10 3.20 T2055-2 T2055-3 T2055-4 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.10 3.10 3.20 3.20 3.20 ** ** ** ** T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 ** ** 0.40 DOWN BONDS ALLOWED NO YES NO NO YES NO Y ** NO NO YES YES NO ** ** 0.40 ** ** ** ** ** NO YES Y N NO YES NO NO ** ** ** ** ** SEE COMMON DIMENSIONS TABLE 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3 AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. -DRAWING NOT TO SCALE- PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 F 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.