EVALUATION KIT AVAILABLE MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod General Description The MAX2021 low-noise, high-linearity, direct upconversion/downconversion quadrature modulator/demodulator is designed for RFID handheld and portal readers, as well as single and multicarrier 650MHz to 1200MHz GSM/EDGE, cdma2000 ® , WCDMA, and iDEN ® base-station applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double conversion systems. In addition to offering excellent linearity and noise performance, the MAX2021 also yields a high level of component integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, two LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2021 operates from a single +5V supply. It is available in a compact 36-pin TQFN package (6mm x 6mm) with an exposed pad. Electrical performance is guaranteed over the extended -40°C to +85°C temperature range. Applications Features ♦ 650MHz to 1200MHz RF Frequency Range ♦ Scalable Power: External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/Reduced-Performance Mode ♦ 36-Pin, 6mm x 6mm TQFN Provides High Isolation in a Small Package Modulator Operation: ♦ Meets 4-Carrier WCDMA 65dBc ACLR ♦ +21dBm Typical OIP3 ♦ +58dBm Typical OIP2 ♦ +16.7dBm Typical OP1dB ♦ -32dBm Typical LO Leakage ♦ 43.5dBc Typical Sideband Suppression ♦ -174dBm/Hz Output Noise Density ♦ DC to 550MHz Baseband Input Allows a Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers ♦ DC-Coupled Input Allows Ability for Customer Offset Voltage Control Demodulator Operation: ♦ +35.2dBm Typical IIP3 ♦ +76dBm Typical IIP2 RFID Handheld and Portal Readers ♦ > 30dBm IP1dB Single and Multicarrier WCDMA 850 Base Stations ♦ 9.2dB Typical Conversion Loss Single and Multicarrier cdmaOne™ and cdma2000 Base Stations ♦ 9.3dB Typical NF GSM 850/GSM 900 EDGE Base Stations ♦ 0.15° I/Q Typical Phase Imbalance ♦ 0.06dB Typical I/Q Gain Imbalance Predistortion Transmitters and Receivers Ordering Information WiMAX Transmitters and Receivers Fixed Broadband Wireless Access Military Systems PART TEMP RANGE PIN-PACKAGE MAX2021ETX+ -40°C to +85°C 36 TQFN-EP* (6mm x 6mm) MAX2021ETX+T -40°C to +85°C 36 TQFN-EP* (6mm x 6mm) Microwave Links Digital and Spread-Spectrum Communication Systems Video-on-Demand (VOD) and DOCSIS Compliant Edge QAM Modulation Cable Modem Termination Systems (CMTS) +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. T = Tape and reel. cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association. iDEN is a registered trademark of Motorola Trademark Holdings, LLC. cdmaOne is a trademark of CDMA Development Group. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. 19-3918; Rev 2; 4/13 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V BBI+, BBI-, BBQ+, BBQ- to GND...............-3.5V to (VCC + 0.3V) LO, RF to GND Maximum Current ......................................30mA RF Input Power ...............................................................+30dBm Baseband Differential I/Q Input Power...........................+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA Note 1: Note 2: RBIASLO3 Maximum Current .............................................10mA Continuous Power Dissipation (Note 1) ...............................7.6W Operating Case Temperature Range (Note 2) ....-40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Ambient Thermal Resistance (θJA) (Notes 3, 4) .......................+34°C/W Note 3: Note 4: Junction-to-Case Thermal Resistance (θJC) (Notes 1, 4) ......................+8.5°C/W Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50Ω to GND, LO input terminated into 50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.) PARAMETER Supply Voltage Total Supply Current SYMBOL CONDITIONS VCC ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC MIN TYP MAX 4.75 5.00 5.25 V 230 271 315 mA 1355 1654 mW TYP MAX UNIT Total Power Dissipation UNITS RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN RF Frequency (Note 5) fRF 650 1200 MHz LO Frequency (Note 5) fLO 750 1200 MHz IF Frequency (Note 5) f IF 550 MHz +3 dBm LO Power Range 2 PLO -6 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod AC ELECTRICAL CHARACTERISTICS (Modulator) (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz, fLO = 900MHz, TC = +25°C, unless otherwise noted.) (Note 6) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS BASEBAND INPUT Baseband Input Differential Impedance f IQ = 1MHz 53 BB Common-Mode Input Voltage Range -3.5 0 +3.5 V LO INPUT LO Input Return Loss RF and IF terminated (Note 7) 12 dB I/Q MIXER OUTPUTS Output IP3 OIP3 Output IP2 OIP2 Output P1dB Output Power fBB1 = 1.8MHz, fBB2 = 1.9MHz fLO = 900MHz 21.1 fLO = 1000MHz 22.3 dBm fBB1 = 1.8MHz, fBB2 = 1.9MHz 57.9 dBm fBB = 25MHz, PLO = 0dBm 16.7 dBm 0.7 dBm -0.016 dB/°C 0.15 dB POUT Output Power Variation Over Temperature TC = -40°C to +85°C Output-Power Flatness Sweep fBB, PRF flatness for fBB from 1MHz to 50MHz ACLR (1st Adjacent Channel 5MHz Offset) Single-carrier WCDMA (Note 8) 65 dBc LO Leakage No external calibration, with each baseband input terminated in 50 -32 dBm Sideband Suppression No external calibration, PLO = 0dBm fLO = 920MHz PLO = -3dBm Output Noise Density Each baseband input terminated in 50 (Note 9) -174 dBm/Hz Output Noise Floor POUT = 0dBm, fLO = 900MHz (Note 10) -168 dBm/Hz RF Return Loss (Note 7) 15 dB Maxim Integrated 30 39.6 43.5 dBc 3 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod AC ELECTRICAL CHARACTERISTICS (Demodulator) (MAX2021 Typical Application Circuit when operated as a demodulator, VCC = 4.75V to 5.25V, GND = 0V, I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. VDC for BBI+. BBI-, BBQ+, BBQ- = 0V, PRF = PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.) (Note 6) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF INPUT Conversion Loss LC Noise Figure NF Noise Figure Under-Blocking NFBLOCK fBB = 25MHz (Note 11) 9.2 dB fLO = 900MHz 9.3 dB fBLOCKER = 900MHz, PRF = 11dBm, fRF = fLO = 890MHz (Note 12) 17.8 dB Input Third-Order Intercept IIP3 fRF1 = 925MHz, fRF2 = 926MHz, fLO = 900MHz, PRF = PLO = 0dBm, fSPUR = 24MHz 35.2 dBm Input Second-Order Intercept IIP2 fRF1 = 925MHz, fRF2 = 926MHz, fLO = 900MHz, PRF = PLO = 0dBm, fSPUR = 51MHz 76 dBm Input 1dB Compression P1dB fIF = 50MHz, fLO = 900MHz, PLO = 0dBm 30 dBm fBB = 1MHz, fLO = 900MHz, PLO = 0dBm 0.06 dB I/Q Gain Mismatch PLO = 0dBm 1.1 PLO = -3dBm 0.15 I/Q Phase Mismatch fBB = 1MHz, fLO = 900MHz Minimum Demodulation 3dB Bandwidth LO = 1160MHz LO > RF > 550 MHz Minimum 1dB Gain Flatness LO = 1160MHz LO > RF > 450 MHz Degrees AC ELECTRICAL CHARACTERISTICS (Demodulator LO = 965MHz) (Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for TA = +25°C, VCC = 5.0V, I/Q DC voltage return = 0V, PRF = 0dBm, PLO = 0dBm, fRF = 780MHz, fLO = 965MHz, fIF = 185MHz, unless otherwise noted.) PARAMETER Conversion Loss Noise Figure Noise Figure Under Blocking Input Third-Order Intercept Point 4 SYMBOL CONDITIONS MIN TYP MAX UNITS Lc 10.1 dB NFSSB 10.4 dB 19 dB NFBLOCK fBLOCKER = 700MHz, PBLOCKER = 11dBm, fLO = 965MHz, fRF = 865MHz, (Note 12) fRF1 = 780MHz, fRF2 = 781MHz, PRF1 = PRF2 = 0dBm, fIF1 = 185MHz, fIF2 = 184MHz 34.5 IIP3 dBm fRF1 = 780MHz, fRF2 = 735MHz, PRF1 = PRF2 = 0dBm, fIF1 = 185MHz, fIF2 = 230MHz 34.6 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod AC ELECTRICAL CHARACTERISTICS (Demodulator LO = 965MHz) (continued) (Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for TA = +25°C, VCC = 5.0V, I/Q DC voltage return = 0V, PRF = 0dBm, PLO = 0dBm, fRF = 780MHz, fLO = 965MHz, fIF = 185MHz, unless otherwise noted.) PARAMETER Input Second-Order Intercept Point Spurious Relative to a Fundamental at 780MHz Input Compression from Linear SYMBOL CONDITIONS fRF1 = 780MHz, fRF2 = 781MHz, PRF1 = PRF2 = 0dBm, fIF1 = 185MHz, fIF2 = 184MHz, fIF1+ fIF2 term MIN TYP MAX UNITS 70.1 IIP2 dBm fRF1 = 780MHz, fRF2 = 735MHz, PRF1 = PRF2 = 0dBm, fIF1 = 185MHz, fIF2 = 230MHz, fIF1+ fIF2 term 70.2 2LO - 2RF, fRF = 872.5MHz, PRF = -10dBm 84 3LO - 3RF, fRF = 903.333MHz, PRF = -10dBm 99 3RF - 2LO, fRF = 705MHz, PRF = -10dBm 105 4RF - 3LO, fRF = 770MHz, PRF = -10dBm 114 5RF - 4LO, fRF = 809MHz, PRF = -10dBm 115 PRF = 0dBm to 21dBm 0.17 dBc dB I/Q Gain Mismatch 0.05 dB I/Q Phase Mismatch 0.4 Degrees 1dB Conversion Loss Flatness 400 MHz RF Return Loss fLO = 965MHz, fLO > fRF 17 dB LO Return Loss 12 dB Recommended functional range. Not production tested. Operation outside this range is possible, but with degraded performance of some parameters. Note 6: Guaranteed by design and characterization. Note 7: Parameter also applies to demodulator topology. Note 8: Single-carrier WCDMA with 10.5dB peak-to-average ratio at 0.1% complementary cumulative distribution function, PRF = -10dBm (PRF is chosen to give -65dBc ACLR). Note 9: No baseband drive input. Measured with the inputs terminated in 50Ω. At low output levels, the output noise is thermal. Note 10: The output noise versus POUT curve has the slope of LO noise (Ln dBc/Hz) due to reciprocal mixing. Note 11: Conversion loss is measured from the single-ended RF input to single-ended combined baseband output. Note 12: The LO noise (L = 10(Ln/10)), determined from the modulator measurements can be used to deduce the noise figure under-blocking at operating temperature (Tp in Kelvin), FBLOCK = 1 + (Lcn - 1) Tp / To + LPBLOCK / (1000kTo), where To = 290K, PBLOCK in mW, k is Boltzmann’s constant = 1.381 x 10(-23) J/K, and Lcn = 10(Lc/10), Lc is the conversion loss. Noise figure under-blocking in dB is NFBLOCK = 10 x log (FBLOCK). Refer to Application Note 3632: Wideband LO Noise in Passive Transmit-Receive Mixer ICs. Note 5: Maxim Integrated 5 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Operating Characteristics (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz, fLO = 900MHz, TC = +25°C, unless otherwise noted.) MODULATOR -62 -64 VCC = 5.0V 240 VCC = 4.75V 220 -15 10 35 60 -72 -70 -72 -74 -74 -76 -76 -78 SINGLE-CARRIER WCDMA -47 -37 ALTERNATE CHANNEL -80 -27 -17 -7 TWO-CARRIER WCDMA -47 -37 -27 -7 -17 OUTPUT POWER PER CARRIER (dBm) ACLR vs. OUTPUT POWER PER CARRIER SIDEBAND SUPPRESSION vs. LO FREQUENCY SIDEBAND SUPPRESSION vs. LO FREQUENCY -68 ALTERNATE CHANNEL -72 -74 -76 50 40 30 PLO = 0dBm -7 750 825 975 1050 1125 750 1200 825 PLO = 0dBm, VCC = 5.0V 40 TC = +25°C 1050 1125 30 TC = -40°C TC = +25°C 1200 VCC = 5.25V 25 TC = +25°C OUTPUT IP3 (dBm) OUTPUT IP3 (dBm) 50 975 OUTPUT IP3 vs. LO FREQUENCY OUTPUT IP3 vs. LO FREQUENCY 25 900 LO FREQUENCY (MHz) 30 MAX2021 toc07 TC = +85°C 20 TC = +85°C 20 VCC = 5.0V VCC = 4.75V 15 15 20 VCC = 4.75V, 5.0V, 5.25V 30 LO FREQUENCY (MHz) SIDEBAND SUPPRESSION vs. LO FREQUENCY 70 900 MAX2021 toc08 -17 OUTPUT POWER PER CARRIER (dBm) 30 40 10 10 -27 60 50 PLO = +3dBm FOUR-CARRIER WCDMA -37 60 20 20 -47 MAX2021 toc06 PLO = -6dBm PLO = -3dBm MAX2021 toc09 -70 60 70 SIDEBAND SUPPRESSION (dBc) -66 SIDEBAND SUPPRESSION (dBc) MAX2021 toc04 ADJACENT CHANNEL -64 70 MAX2021 toc05 OUTPUT POWER PER CARRIER (dBm) -62 -80 ALTERNATE CHANNEL -68 TEMPERATURE (°C) -60 -78 ADJACENT CHANNEL -70 85 ADJACENT CHANNEL -66 -68 -80 -40 ACLR (dB) -64 ACLR (dB) ACLR (dB) 260 -78 SIDEBAND SUPPRESSION (dBc) -62 -66 200 TC = -40°C 10 10 10 750 825 900 975 1050 LO FREQUENCY (MHz) 6 ACLR vs. OUTPUT POWER PER CARRIER -60 MAX2021 toc02 VCC = 5.25V 280 -60 MAX2021 toc01 TOTAL SUPPLY CURRENT (mA) 300 ACLR vs. OUTPUT POWER PER CARRIER MAX2021 toc03 TOTAL SUPPLY CURRENT vs. TEMPERATURE (TC) 1125 1200 750 825 900 975 1050 LO FREQUENCY (MHz) 1125 1200 750 825 900 975 1050 1125 1200 LO FREQUENCY (MHz) Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Operating Characteristics (continued) (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz, fLO = 900MHz, TC = +25°C, unless otherwise noted.) MODULATOR PLO = 0dBm PLO = -6dBm 24 23 22 900 975 1050 1125 -3.50 1200 OUTPUT IP2 vs. LO FREQUENCY 0 1.75 TC = -40°C VCC = 5.25V 50 VCC = 5.0V 975 1050 1125 1200 40 750 825 900 975 1050 1125 750 1200 825 900 975 1050 1125 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) OUTPUT IP2 vs. COMMON-MODE VOLTAGE OUTPUT IP2 vs. COMMON-MODE VOLTAGE MODULATOR OUTPUT POWER vs. INPUT POWER 75 fLO = 1000MHz 65 60 55 60 -1.75 0 1.75 COMMON-MODE VOLTAGE (V) Maxim Integrated 3.50 15 10 5 VCC = 4.75V, 5.0V, 5.25V 0 -5 50 55 INPUT SPLIT BETWEEN I AND Q, fIF = 25MHz, fLO = 900MHz OUTPUT POWER (dBm) OUTPUT IP2 (dBm) 65 70 20 1200 MAX2021 toc18 fLO = 900MHz MAX2021 toc17 70 MAX2021 toc16 80 -3.50 PLO = 0dBm PLO = -3dBm 40 900 PLO = -6dBm 60 VCC = 4.75V 40 825 PLO = +3dBm 50 50 TC = +85°C 3.50 1.75 OUTPUT IP2 vs. LO FREQUENCY 70 60 0 80 OUTPUT IP2 (dBm) TC = +25°C 60 -1.75 COMMON-MODE VOLTAGE (V) 70 OUTPUT IP2 (dBm) 70 OUTPUT IP2 (dBm) -3.50 3.50 OUTPUT IP2 vs. LO FREQUENCY 80 MAX2021 toc13 80 750 22 COMMON-MODE VOLTAGE (V) LO FREQUENCY (MHz) OUTPUT IP2 (dBm) -1.75 MAX2021 toc14 825 23 20 20 750 24 21 21 10 MAX2021 toc12 fLO = 1000MHz 25 MAX2021 toc15 20 15 25 OUTPUT IP3 (dBm) OUTPUT IP3 (dBm) PLO = +3dBm fLO = 900MHz, PLO = 0dBm OUTPUT IP3 (dBm) PLO = -3dBm 26 MAX2021 toc11 TC = +25°C 25 26 MAX2021 toc10 30 OUTPUT IP3 vs. COMMON-MODE VOLTAGE OUTPUT IP3 vs. COMMON-MODE VOLTAGE OUTPUT IP3 vs. LO FREQUENCY -3.50 -1.75 0 1.75 COMMON-MODE VOLTAGE (V) 3.50 10 13 16 19 22 25 28 INPUT POWER (dBm) 7 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Operating Characteristics (continued) (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz, fLO = 900MHz, TC = +25°C, unless otherwise noted.) MODULATOR MODULATOR OUTPUT POWER vs. LO FREQUENCY 5 PLO = -6dBm, -3dBm, 0dBm, +3dBm 0 1 -1 TC = +85°C 19 22 25 750 28 825 LO LEAKAGE vs. LO FREQUENCY MAX2021 toc22 -40 900 975 1050 1125 1200 -60 TC = +85°C -80 TC = +25°C 915 926 937 948 926 PLO = -6dBm PLO = -3dBm -60 -70 -80 PLO = +3dBm 959 970 -150 TC = +25°C, fLO = 900MHz -155 PLO = -6dBm -160 PLO = -3dBm -165 -170 PLO = 0dBm PLO = +3dBm PLO = 0dBm 915 970 948 -175 -100 959 937 OUTPUT NOISE vs. OUTPUT POWER -90 -90 -100 915 LO FREQUENCY (MHz) PRF = -1dBm, LO LEAKAGE NULLED AT PLO = 0dBm -50 LO LEAKAGE (dBm) LO LEAKAGE (dBm) TC = -40°C -70 PRF = -1dBm LO LEAKAGE vs. LO FREQUENCY PRF = -1dBm, LO LEAKAGE NULLED AT TC = +25°C -50 -80 LO FREQUENCY (MHz) OUTPUT NOISE (dBm/Hz) 16 PRF = -7dBm -70 -100 MAX2021 toc23 13 -60 -90 INPUT POWER (dBm) -40 TC = +25°C -5 10 MAX2021 toc21 TC = -40°C -3 -5 LO LEAKAGE NULLED AT PRF = -1dBm PRF = -40dBm PRF = +5dBm -50 MAX2021 toc24 10 VBBI = VBBQ = 1.4VP-P DIFFERENTIAL 3 OUTPUT POWER (dBm) 15 LO LEAKAGE vs. LO FREQUENCY -40 LO LEAKAGE (dBm) INPUT SPLIT BETWEEN I AND Q, fIF = 25MHz, fLO = 900MHz OUTPUT POWER (dBm) 5 MAX2021 toc19 20 MAX2021 toc20 MODULATOR OUTPUT POWER vs. INPUT POWER 926 937 -180 948 959 970 -15 -10 -5 0 5 10 15 OUTPUT POWER (dBm) LO FREQUENCY (MHz) LO FREQUENCY (MHz) MAX2021 toc25 OUTPUT NOISE vs. OUTPUT POWER -150 PLO = 0dBm, fLO = 900MHz OUTPUT NOISE (dBm/Hz) -155 -160 -165 TC = +85°C -170 TC = -40°C -175 TC = +25°C -180 -15 -10 -5 0 5 10 15 OUTPUT POWER (dBm) 8 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Operating Characteristics (MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. PRF = 5dBm, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, fLO = 900MHz, TC = +25°C, unless otherwise noted.) DEMODULATOR (VARIABLE LO) TC = +25°C TC = +85°C 10 9 8 TC = -40°C 36 34 VCC = 5.0V 32 825 900 975 1050 1125 1200 TC = +25°C 38 TC = -40°C 36 34 32 TC = +85°C 30 750 825 900 975 1050 1125 750 1200 825 900 975 1050 1125 1200 DEMODULATOR INPUT IP2 vs. LO FREQUENCY DEMODULATOR PHASE IMBALANCE vs. LO FREQUENCY DEMODULATOR AMPLITUDE IMBALANCE vs. LO FREQUENCY 70 TC = +85°C 60 TC = -40°C 50 PLO = -3dBm 6 4 PLO = 0dBm 2 0 -2 PLO = -6dBm -4 -6 -8 -10 900 975 1050 1125 1200 825 900 975 1050 1125 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO PORT RETURN LOSS vs. LO FREQUENCY RF PORT RETURN LOSS vs. LO FREQUENCY +5 PLO = 0dBm +10 +15 PLO = -6dBm, -3dBm +20 +5 +10 +15 +20 +25 PLO = -6dBm, -3dBm, 0dBm, +3dBm +30 +35 900 975 1050 LO FREQUENCY (MHz) Maxim Integrated 1125 1200 0 PLO = -6dBm, -3dBm, 0dBm, +3dBm -0.05 -0.10 -0.15 750 825 900 975 1050 1125 LO FREQUENCY (MHz) 1200 -4 PLO = 0dBm -5 fLO = 900MHz -6 -7 -8 -9 fLO = 1000MHz -10 -11 -12 +45 825 0.05 IF FLATNESS vs. BASEBAND FREQUENCY +40 +25 0.10 1200 MAX2021 toc33 PLO = +3dBm 0 RF PORT RETURN LOSS (dB) MAX2021 toc32 0 0.15 -0.20 750 IF OUTPUT POWER (dBm) 825 0.20 MAX2021 toc31 PLO = +3dBm 8 MAX2021 toc34 TC = +25°C DEMODULATOR PHASE IMBALANCE (deg) MAX2021 toc29 80 10 DEMODULATOR AMPLITUDE IMBALANCE (dB) LO FREQUENCY (MHz) MAX2021 toc30 LO FREQUENCY (MHz) PLO = 0dBm, VCC = 5.0V 750 PLO = 0dBm, VCC = 5.0V LO FREQUENCY (MHz) 90 750 MAX2021 toc28 VCC = 5.25V 30 750 DEMODULATOR INPUT IP2 (dBm) 38 40 VCC = 4.75V 7 LO PORT RETURN LOSS (dB) PLO = 0dBm, TC = +25°C DEMODULATOR INPUT IP3 (dBm) 11 40 MAX2021 toc27 PLO = 0dBm, VCC = 5.0V DEMODULATOR INPUT IP3 (dBm) DEMODULATOR CONVERSION LOSS (dB) 12 DEMODULATOR INPUT IP3 vs. LO FREQUENCY DEMODULATOR INPUT IP3 vs. LO FREQUENCY MAX2021 toc26 DEMODULATOR CONVERSION LOSS vs. LO FREQUENCY 750 845 940 1035 LO FREQUENCY (MHz) 1130 1225 0 10 20 30 40 50 60 70 80 BASEBAND FREQUENCY (MHz) 9 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Operating Characteristics (MAX2021 Typical Application Circuit, VCC = 5.0V, GND = 0V, I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. PRF = 0dBm, PLO = 0dBm, fLO = 965MHz, fIF = fLO - fRF, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TA = +25°C, unless otherwise noted.) DEMODULATOR (FIXED LO) 9 fLO = 965MHz 0.05 0 -0.05 8 1.0 0.5 0 -0.5 7 -1.0 -0.10 695 740 785 830 875 90 135 RF FREQUENCY (MHz) 180 225 180 36 1MHz TONE DELTA 35 34 270 315 INPUT IP2 vs. RF FREQUENCY MAX2021 toc38 PRF = 0dBm/TONE fLO = 965MHz 225 IF FREQUENCY (MHz) 90 85 INPUT IP2 (dBm) INPUT IP3 (dBm) 37 135 IF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY 38 90 315 270 45MHz TONE DELTA PRF = 0dBm/TONE fLO = 965MHz 80 1MHz TONE DELTA 75 70 45MHz TONE DELTA 65 33 MAX2021 toc39 650 60 32 650 725 800 875 RF FREQUENCY (MHz) 10 fLO = 965MHz 1.5 PHASE MISMATCH (DEG) 10 2.0 MAX2021 toc36 MAX2021 toc35 11 GAIN MISMATCH (dB) CONVERSION LOSS (dB) fLO = 965MHz I/Q PHASE MISMATCH vs. IF FREQUENCY I/Q GAIN MISMATCH vs. IF FREQUENCY 0.10 MAX2021 toc37 CONVERSION LOSS vs. RF FREQUENCY 12 950 650 725 800 875 950 RF FREQUENCY (MHz) Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Pin Description PIN NAME 1, 5, 9–12, 14, 16–19, 22, 24, 27–30, 32, 34–36 GND 2 3 4 6 7 8 FUNCTION Ground RBIASLO3 3rd LO Amplifier Bias. Connect a 332 resistor to ground. VCCLOA LO LO Input Buffer Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF capacitors as close as possible to the pin. Local Oscillator Input. 50 input impedance. Requires a DC-blocking capacitor. RBIASLO1 1st LO Input Buffer Amplifier Bias. Connect a 432 resistor to ground. N.C. No Connection. Leave unconnected. RBIASLO2 2nd LO Amplifier Bias. Connect a 619 resistor to ground. 13 VCCLOI1 I-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF capacitors as close as possible to the pin. 15 VCCLOI2 I-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF capacitors as close as possible to the pin. 20 BBI+ Baseband In-Phase Noninverting Port 21 BBI- Baseband In-Phase Inverting Port 23 RF 25 BBQ- Baseband Quadrature Inverting Port RF Port. This port is matched to 50. Requires a DC-blocking capacitor. 26 BBQ+ Baseband Quadrature Noninverting Port 31 VCCLOQ2 Q-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF capacitors as close as possible to the pin. 33 VCCLOQ1 Q-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF capacitors as close as possible to the pin. EP GND Exposed Ground Pad. The exposed pad MUST be soldered to the ground plane using multiple vias. Detailed Description The MAX2021 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 650MHz to 1200MHz RF frequency range. The device can also be used as a demodulator, downconverting an RF input signal directly to baseband. Applications include RFID handheld and portal readers, as well as single and multicarrier GSM/EDGE, cdma2000, WCDMA, and iDEN base stations. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double conversion systems. The MAX2021 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. The MAX2021’s high-linearity mixers, in conjunction with the part’s precise in-phase and quadrature channel matching, enable the device to possess excellent dynamic range, ACLR, 1dB compression Maxim Integrated point, and LO and sideband suppression characteristics. These features make the MAX2021 ideal for fourcarrier WCDMA operation. LO Input Balun, LO Buffer, and Phase Splitter The MAX2021 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer’s input impedance to 50Ω over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90° with respect to the original. The 0° and 90° LO signals drive the I and Q mixers, respectively. LO Driver Following the phase splitter, the 0° and 90° LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO 11 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. The MAX2021 can tolerate LO level swings from -6dBm to +3dBm. I/Q Modulator The MAX2021 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to 550MHz with differential amplitudes up to 4VP-P. The wide input bandwidths allow operation of the MAX2021 as either a direct RF modulator or as an image-reject mixer. The wide common-mode compliance range allows for direct interface with the baseband DACs. No active buffer circuitry is required between the baseband DACs and the MAX2021 for cdma2000 and WCDMA applications. The I and Q signals directly modulate the 0° and 90° LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to produce a singled-ended RF output. Applications Information LO Input Drive The LO input of the MAX2021 is internally matched to 50Ω, and requires a single-ended drive at a 750MHz to 1200MHz frequency range. An integrated balun converts the singled-ended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -6dBm to +3dBm range. An LO input power of -3dBm is recommended for best overall peformance. Modulator Baseband I/Q Input Drive Drive the MAX2021 I and Q baseband inputs differentially for best performance. The baseband inputs have a 53Ω differential input impedance. The optimum source impedance for the I and Q inputs is 100Ω differential. This source impedance achieves the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2021 can accept input power levels of up to +20dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA carriers or GSM signals, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2021. The four baseband ports need some form of DC return to establish a common mode that the on-chip circuitry drives. This can be achieved by directly DC-coupling to the baseband ports (staying within the ±3.5V common12 mode range), through an inductor to ground, or through a low-value resistor to ground. The MAX2021 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements. Such DACs include the MAX5875 series of dual DACs, and the MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50Ω load resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 50MHz at -0.1dB response. The direct connection of the DAC to the MAX2021 ensures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC’s output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC’s output noise floor and interpolation filter stopband attenuation are sufficiently good to ensure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2021 with a Maxim DAC (in this case the MAX5895 dual 16-bit interpolating-modulating DAC) and with Maxim VGA and VCO/Synth ICs. The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2021 quadrature modulator. RF Output The MAX2021 utilizes an internal passive mixer architecture that enables the device to possess an exceptionally low-output noise floor. With such architectures, the total output noise is typically a power summation of the theoretical thermal noise (KTB) and the noise contribution from the on-chip LO buffer circuitry. As demonstrated in the Typical Operating Characteristics, the MAX2021’s output noise approaches the thermal limit of -174dBm/Hz for lower output power levels. As the output power increases, the noise level tracks the noise contribution from the LO buffer circuitry, which is approximately -168dBc/Hz. Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod 50I I 12 DAC 50I MAX2021 31dB MAX5873 DUAL DAC 0 90 17dB 31dB RFOUT C 50I MAX2058 RF DIGITAL VGA Q 12 DAC SPI LOGIC 50I MAX9491 VCO + SYNTH 45, 80, OR 95MHz LO LOOPBACK OUT (FEEDS BACK INTO Rx CHAIN FRONT END) Rx OFF SPI CONTROL Figure 1. Transmitter Lineup The I/Q input power levels and the insertion loss of the device determine the RF output power level. The input power is a function of the delivered input I and Q voltages to the internal 50Ω termination. For simple sinusoidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in a -17dBm input power level delivered to the I and Q internal 50Ω terminations. This results in an RF output power of -23.2dBm. C = 6.8pF 100Ω I MAX2021 RF-MODULATOR L = 40nH 100Ω C = 6.8pF LO External Diplexer 0° 90° ∑ RF 100Ω Q L = 40nH 100Ω C = 6.8pF Figure 2. Diplexer Network Recommended for GSM 900 Transmitter Applications Maxim Integrated LO leakage at the RF port can be nulled to a level less than -80dBm by introducing DC offsets at the I and Q ports. However, this null at the RF port can be compromised by an improperly terminated I/Q IF interface. Care must be taken to match the I/Q ports to the driving DAC circuitry. Without matching, the LO’s second-order (2fLO) term may leak back into the modulator’s I/Q input port where it can mix with the internal LO signal to produce additional LO leakage at the RF output. This leakage effectively counteracts against the LO nulling. In addition, the LO signal reflected at the I/Q IF port produces a residual DC term that can disturb the nulling condition. As demonstrated in Figure 2, providing an RC termination on each of the I+, I-, Q+, Q- ports reduces the amount of LO leakage present at the RF port under 13 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod varying temperature, LO frequency, and baseband drive conditions. See the Typical Operating Characteristics for details. Note that the resistor value is chosen to be 100Ω with a corner frequency 1 / (2πRC) selected to adequately filter the fLO and 2fLO leakage, yet not affecting the flatness of the baseband response at the highest baseband frequency. The commonmode fLO and 2fLO signals at I+/I- and Q+/Q- effectively see the RC networks and thus become terminated in 50Ω (R/2). The RC network provides a path for absorbing the 2fLO and fLO leakage, while the inductor provides high impedance at f LO and 2f LO to help the diplexing process. (staying within the ±3.5V common-mode range), through an inductor to ground, or through a low-value resistor to ground. Figure 4 shows a typical network that would be used to connect to each baseband port for demodulator operation. This network provides a common-mode DC return, implements a high-frequency diplexer to terminate unwanted RF terms, and also provides an impedance transformation to a possible higher impedance baseband amplifier. The network Ca, Ra, La and Cb form a highpass/lowpass network to terminate the high frequencies into a load while passing the desired lower IF frequencies. Elements La, Cb, Lb, Cc, Lc, and Cd provide a possible impedance transformer. Depending on the impedance being transformed and the desired bandwidth, a fewer number of elements could be used. It is suggested that La and Cb always be used since they are part of the high frequency diplexer. If power matching is not a concern then this would reduce the elements to just the diplexer. RF Demodulator The MAX2021 can also be used as an RF demodulator (see Figure 3), downconverting an RF input signal directly to baseband. The single-ended RF input accepts signals from 650MHz to 1200MHz with power levels up to +30dBm. The passive mixer architecture produces a conversion loss of typically 9.2dB. The downconverter is optimized for high linearity and excellent noise performance, typically with a +35.2dBm IIP3, a P1dB of greater than +30dBm, and a 9.3dB noise figure. A wide I/Q port bandwidth allows the port to be used as an image-reject mixer for downconversion to a quadrature IF frequency. The RF and LO inputs are internally matched to 50Ω. Thus, no matching components are required, and only DC-blocking capacitors are needed for interfacing. Resistor Rb provides a DC return to set the common mode voltage. In this case, due to the on-chip circuitry, the voltage would be approx 0V DC. It can also be used to reduce the load impedance of the next stage. Inductor Ld can provide a bit of high frequency gain peaking for wideband IF systems. Capacitor Ce is a DC block. Typical values for Ca, Ra, La, and Cb would be 1.5pF, 50Ω, 11nH, and 4.7pF, respectively. These values can change depending on the LO, RF, and IF frequencies used. Resistor Rb is in the 50Ω to 200Ω range Demodulator Output Port Considerations The circuitry presented in Figure 4 does not allow for LO leakage at RF port nulling. Depending on the LO at RF leakage requirement, a trim voltage might need to be introduced on the baseband ports to null the LO leakage. Much like in the modulator case, the four baseband ports require some form of DC return to establish a common mode that the on-chip circuitry drives. This can be achieved by directly DC-coupling to the baseband ports MAX2021 RF DIPLEXER/ DC RETURN 90 0 MATCHING ADC MATCHING ADC LO DIPLEXER/ DC RETURN Figure 3. MAX2021 Demodulator Configuration 14 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Ld Ra Ca MAX2021 I/Q OUTPUTS Rb La Lb Cb Ce Lc Cc Cd EXTERNAL STAGE Figure 4. Baseband Port Typical Filtering and DC Return Network I+ 3dB PAD DC BLOCK 0° MINI-CIRCUITS ZFSCJ-2-1 I- 3dB PAD DC BLOCK 180° 3dB PADS LOOK LIKE 160I TO GROUND AND PROVIDES THE COMMON-MODE DC RETURN FOR THE ON-CHIP CIRCUITRY. Q+ 3dB PAD DC BLOCK 0° MINI-CIRCUITS ZFSCJ-2-1 Q- 3dB PAD DC BLOCK MINI-CIRCUITS ZFSC-2-1W-S+ 0° COMBINER 90° 180° Figure 5. Demodulator Combining Diagram Power Scaling with Changes to the Bias Resistors Bias currents for the LO buffers are optimized by fine tuning resistors R1, R2, and R3. Maxim recommends using ±1%-tolerance resistors; however, standard ±5% values can be used if the ±1% components are not readily available. The resistor values shown in the Typical Application Circuit were chosen to provide peak performance for the entire 650MHz to 1200MHz band. If desired, the current can be backed off from this nominal value by choosing different values for R1, R2, and R3. Tables 1 and 2 outline the performance trade-offs that can be expected for various combinations of these bias resistors. As noted within the tables, the performance trade-offs may be more pronounced for different operating frequencies. Contact the factory for additional details. Maxim Integrated Layout Considerations A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PCB exposed pad MUST be connected to the ground plane of the PCB. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX2021 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maximintegrated.com. 15 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Table 1. Typical Performance Trade-Offs as a Function of Current Draw—Modulator Mode LO FREQ (MHz) 800 900 1000 RF FREQ (MHz) 801.8 901.8 1001.8 R1 Ω) (Ω R2 Ω) (Ω R3 Ω) (Ω ICC (mA) OIP3 (dBm) LO LEAK (dBm) IMAGE REJ (dBc) OIP2 (dBm) 420 620 330 271 19.6 -32.1 23.9 50.5 453 665 360 253 21.9 -32.7 34.0 51.0 499 698 402 229 18.9 -33.7 30.0 52.6 549 806 464 205 15.7 -34.4 23.7 46.0 650 1000 550 173 13.6 -34.2 23.3 32.3 420 620 330 271 20.7 -31.4 43.4 54.0 453 665 360 253 21.6 -31.6 42.4 55.4 499 698 402 229 20.6 -31.8 42.7 59.8 549 806 464 205 19.0 -31.9 40.3 50.7 650 1000 550 173 14.9 -30.5 25.0 34.6 420 620 330 271 22.4 -32.8 39.3 55.5 453 665 360 253 22.2 -33.2 39.1 56.3 499 698 402 229 19.9 -33.8 43.5 55.0 549 806 464 205 17.6 -34.8 40.5 51.4 650 1000 550 173 14.6 -33.9 36.8 32.8 Note: VCC = 5V, PLO = 0dBm, TA = +25°C, I/Q voltage levels = 1.4VP-P differential. Power-Supply Bypassing Exposed Pad RF/Thermal Considerations Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all VCC_ pins with 33pF and 0.1µF capacitors placed as close to the pins as possible. The smallest capacitor should be placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2021 has several RF processing stages that use the various VCC_ pins, and while they have on-chip decoupling, offchip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability. The EP of the MAX2021’s 36-pin TQFN-EP package provides a low thermal-resistance path to the die. It is important that the PCB on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed pad (EP) MUST be soldered to a ground plane on the PCB either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible. 16 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Table 2. Typical Performance Trade-Offs as a Function of Current Draw—Demodulator Mode LO FREQ (MHz) RF FREQ (MHz) 800 900 1000 771 871 971 R1 Ω) (Ω R2 Ω) (Ω R3 Ω) (Ω ICC (mA) CONVERSION LOSS (dB) IIP3 (dBm) 57MHz IIP2 (dBm) 420 620 330 269 9.8 33.85 62.1 453 665 360 254 9.83 33.98 62.9 499 698 402 230 9.81 32.2 66.6 549 806 464 207 9.84 31.1 66.86 650 1000 550 173 9.95 29.87 65.25 420 620 330 269 9.21 33.1 68 453 665 360 254 9.25 33.9 66.87 499 698 402 230 9.36 34.77 66.7 549 806 464 207 9.39 35.3 66.6 650 1000 550 173 9.46 32 64.64 420 620 330 269 9.47 34.9 > 77.7 453 665 360 254 9.5 35.4 > 77.5 499 698 402 230 9.53 34.58 > 76.5 549 806 464 207 9.5 33.15 > 76.5 650 1000 550 173 9.61 31.5 76 Note: Used on PCB 180° combiners and off PCB quadrature combiner with VCC = 5V, PRF = -3dBm, PLO = 0dBm, TA = +25°C, IF1 = 28MHz, IF2 = 29MHz. Maxim Integrated 17 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod GND GND VCCLOQ1 GND VCCLOQ2 GND GND GND 36 35 34 33 32 31 30 29 28 1 RBIASLO3 2 VCCLOA 3 LO 4 GND 5 RBIASLO1 6 N.C. 7 RBIASLO2 GND + GND Pin Configuration/Functional Diagram MAX2021 BIAS LO3 90° 0° Σ BIAS LO1 BIAS LO2 8 27 GND 26 BBQ+ 25 BBQ- 24 GND 23 RF 22 GND 21 BBI- 20 BBI+ 19 GND EP 15 16 17 18 GND GND 14 GND GND 13 VCCLOI2 12 GND 11 VCCLOI1 10 GND 9 GND GND TQFN (6mm x 6mm) Package Information Chip Information PROCESS: SiGe BiCMOS 18 For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. TQFN T3666+2 21-0141 90-0049 Maxim Integrated MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Typical Application Circuit + C1 33pF VCC VCCLOA C3 82pF LO LO GND RBIASLO1 R1 432Ω N.C. RBIASLO2 R2 619Ω GND 35 VCCLOQ2 GND 34 GND 33 32 GND GND 30 31 1 GND 28 29 27 MAX2021 BIAS LO3 2 26 3 25 90° 4 24 0° 5 GND BBQ+ BBQGND Q+ QC9 8.2pF RF 23 RF Σ BIAS LO1 6 22 7 21 BIAS LO2 8 20 GND BBIBBI+ II+ EP 9 19 10 GND VCC C5 0.1µF 11 GND 12 GND 13 14 GND C6 33pF 15 VCCLOI2 RBIASLO3 36 VCCLOI1 GND C2 0.1µF GND GND R3 332Ω C11 0.1µF VCC C10 33pF C13 33pF VCCLOQ1 VCC C12 0.1µF 16 GND 18 17 GND GND GND C7 33pF C8 0.1µF VCC Table 3. Component List Referring to the Typical Application Circuit COMPONENT VALUE C1, C6, C7, C10, C13 33pF C2, C5, C8, C11, C12 0.1µF 0.1µF ±10%, 16V X7R ceramic capacitors (0603) C3 82pF 82pF ±5%, 50V C0G ceramic capacitor (0402) C9 8.2pF 8.2pF ±0.1pF, 50V C0G ceramic capacitor (0402) R1 432Ω 432Ω ±1% resistor (0402) R2 619Ω 619Ω ±1% resistor (0402) R3 332Ω 332Ω ±1% resistor (0402) Maxim Integrated DESCRIPTION 33pF ±5%, 50V C0G ceramic capacitors (0402) 19 MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod Revision History REVISION NUMBER REVISION DATE 0 7/06 Initial release 1 6/12 Updated Features section; updated Ordering Information, Absolute Maximum Ratings, DC Electrical Characteristics, Pin Description, AC Electrical Characteristics table, Typical Operating Characteristics globals, Detailed Description section, I/Q Modulator section, Baseband I/Q Input Drive section, Power Scaling with the Changes to the Bias Resistors section, Typical Application Circuit, Figures 1–3, and Table 1 2 4/13 Updated Electrical Characteristics table; updated TOCs 35–39; updated title and Features section DESCRIPTION PAGES CHANGED — 1–3, 9–11, 14 1, 2, 4, 8, 9, 12, 13 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 20 ________________________________Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 © 2013 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.