AN4502 Application Note AN4502 IGBT Electrostatic Handling Precautions Application Note Replaces September 2000 version, AN4502-3.0 AN4502-3.1 July 2002 The IGBT has been developed to combine the properties of both MOSFET and Bipolar devices. This overcomes some of the limitations of both enabling high voltages to be switched and high currents to be controlled with the use of relatively simple gate drive circuitry. The active component, the silicon chip, has a metal gate contact which is isolated from the underlying p-n structure by a thin oxide layer (see fig 1.) Care should be taken to ensure that any tools used, particularly soldering irons, have a low resistance to earth. Note 1: For further detail regarding the protection of electrostatic sensitive devices the reader is recommended to consult British Standard BS CECC 00015 entitled Basic Specification: Protection of Electrostatic Sensitive Devices. Gate polysilicon Oxide Emitter contact n+ n+ p+ n- base n+ buffer layer p+ substrate layer Collector contact Fig. 1 Device silicon cross section In order to achieve the required switching characteristics, this structure requires a design in which the oxide layer is a few hundred angstroms thick. For this reason manufacturers limit the gate-emitter voltage to < ± 20V. If this voltage is exceeded there is a danger that the chip will be destroyed and its control action lost due to the gate-emitter structure becoming degraded. As well as the possibility of such voltages occurring in the circuit they can result from the accumulation of electrostatic charge. Precautions must therefore be taken to avoid such damage. IGBT products shipped from the Dynex Semiconductor factory have a physical conducting material connecting the gate to emitter and/or are packed in anti static conducting material. It is important that the terminals are not touched by hand unless the individual handling them is on an anti-static surface and /or is grounded by an earthing wrist strap. Modules should only be handled by their base. If it is necessary to touch the terminals the individual should take the precaution of discharging themselves to earth via a high value resistor (typically 2 to 4MΩ) or preferably be earthed via a wrist strap. The conductive link between the gate and emitter should be retained in place and only removed immediately prior to wiring. This documentation is available from: BSI Customer Services, BSI Standards, 389 Chiswick High Road, London. W4 4AL. United Kingdom. Tel: + 44 (0) 208 996 7000 Fax: + 44 (0)208 996 7001 1/2 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com