MF35 MF35 Fast Recovery Diode Replaces March 1998 version, DS4625-3.1 DSDS4625-4.0 January 2000 APPLICATIONS KEY PARAMETERS VRRM 1200V IF(AV) 40A IFSM 400A Qr 10µC trr 0.2ns ■ Inverse, Parallel Or Series Connected Diode ■ Power Supplies ■ High Frequency Applications FEATURES ■ Glass Passivation ■ High Voltage Capability ■ Fast Recovery Characteristics VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V MF35 - 1200 MF35 - 1000 MF35 - 800 MF35 - 600 1200 1000 800 600 Conditions VRSM = VRRM +100V Lower voltage grades available. For stud anode add suffix 'R' to type number. e.g. MF35-1200R. Outline type code: DO5. See Package Details for further information. CURRENT RATINGS Symbol Parameter Conditions Max. Units IF(AV) Mean forward current Half sine wave resistive load, Tcase = 65oC 40 A IF(RMS) RMS value Tcase = 65oC 63 A Continuous (direct) forward current Tcase = 65oC 50 A IF 1/8 MF35 SURGE RATINGS Symbol Conditions Parameter Max. Units IFSM Surge (non-repetitive) forward current 10ms half sine; with VRRM ≤ 10V, Tj = 125oC 400 A I2t I2t for fusing 10ms half sine; Tj = 125oC 800 A2s THERMAL AND MECHANICAL DATA Conditions Parameter Symbol Min. Max. Units Rth(j-c) Thermal resistance - junction to case dc - 0.8 o Rth(c-h) Thermal resistance - case to heatsink Mounting torque 3.5Nm with mounting compound - 0.2 o Forward (conducting) - 125 o Reverse (blocking) - 125 o Storage temperature range -55 125 ˚C Mounting torque 3.2 3.8 Nm Typ. Max. Units Tvj Tstg - C/W C/W C Virtual junction temperature C CHARACTERISTICS Symbol 2/8 Parameter Conditions o VFM Forward voltage At 120A peak, Tcase = 25 C - 2.0 V IRM Peak reverse current At VRRM, Tcase = 100oC - 5 mA trr Reverse recovery time IF = 1A, diRR/dt = 25A/µs, Tcase = 25˚C, VR = 100V - 200 ns QR Recovered charge IF = 50A, diRR/dt = 50A/µs, Tcase = 25˚C, VR = 100V - 10 µC VTO Threshold voltage At Tvj = 125 C - 1.2 V rT Slope resistance At Tvj = 125 C - 7.0 mΩ o o MF35 CURVES 80 Measured under pulse conditions Tj = 25˚C 150 Tj = 125˚C 100 50 0 1.0 2.0 3.0 Instantaneous forward voltage - (V) 5% 40 20 400 350 300 250 2 3 45 10 200 400 600 800 1000 1200 Rate of rise of forward current - (A/µs) 1.00 Tcase = 125˚C VR = VRRM 1 0 Fig.2 Forward recovery voltage vs rate of rise of forward voltage Thermal impedance - ˚C/W Peak half sinewave forward current - (A) Fig.1 Maximum (limit) forward characteristics 200 60 0 0 Tcase = 25˚C 95% Transient forward voltage - (V) Instantaneous forward current - (A) 200 50 Cycles at 50Hz Duration Fig.3 Surge (non-repetitive) forward current vs time d.c. 0.75 0.50 0.25 0 0.001 0.01 0.1 Time - (s) 1.0 10 Fig.4 Maximum transient thermal impedance 3/8 MF35 1200 Tcase = 125˚C (No snubber) Recovery time - (ns) 1000 800 IF = 100A IF = 50A 600 IF = 10A 400 200 1 10 100 Rate of rise of reverse current - (A/µs) 1000 Fig.5 Recovery time vs dIR/dt Peak reverse current - (A) 60 Tcase = 125˚C (No snubber) IF = 100A 50 IF = 50A 40 30 IF = 10A 20 10 0 1 10 100 Rate of change of reverse current - (A/µs) 1000 Recovered charge - (µC) Fig.6 Peak reverse current vs dIR/dt 20 IF = 100A T = 125˚C (No snubber) 18 case 16 IF = 50A 14 12 10 8 IF = 10A 6 4 2 0 1 10 100 Rate of change of reverse current - (A/µs) Fig.7 Recovered charge vs dIR/dt 4/8 1000 MF35 Peak current - (A) 500 Tcase = 65˚ 100 50 10 00 0 10 10 50 00 25 10 00 00 50 0 H 10 z 0 30 0 100 1000 Pulse width - (µs) 10000 Fig.8 Frequency curves - square waveform Peak current - (A) 500 Tcase = 85˚ 100 50 10 00 0 10 10 50 00 25 10 00 00 50 0 30 100 1000 Pulse width - (µs) 0 H 10 z 0 10000 Fig.9 Frequency curves - square waveform 500 Peak current - (A) 0.05 0.1 0.2 0.5 1.0 2.0J 100 10 10 100 1000 Pulse width - (µs) 10000 Fig.10 Energy per pulse - square waveform 5/8 MF35 Peak current - (A) 500 Tcase = 65˚ 100 10 00 0 10 10 50 00 25 00 10 00 50 0 50 H 10 z 0 30 0 100 1000 Pulse width - (µs) 10000 Fig.11 Frequency curves - sine waveform Peak current - (A) 500 Tcase = 85˚ 100 10 00 0 10 10 50 00 25 00 10 00 50 0 100 1000 Pulse width - (µs) 50 H 10 z 0 30 0 10000 Fig.12 Frequency curves - sine waveform 500 Peak current - (A) 0.05 0.1 0.2 0.5 2.0J 100 10 10 100 1000 Pulse width - (µs) Fig.13 Energy per pulse - sine waveform 6/8 1.0 10000 MF35 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hex. 17.35mm AF max 23 Ø4.0 11.5 Thread 1/4 in 28 UNF 2A Weight: 20g Package outline type code: DO5 ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors AN4506 Thyristor and diode measurement with a multi-meter AN4853 Use of V , r on-state characteristic AN5001 TO T 7/8 MF35 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4625-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 8/8