UC2950 Half-Bridge Bipolar Switch FEATURES DESCRIPTION • Source or Sink 4.0A • Supply Voltage to 35V • High-Current Output Diodes • Tri-State Operation This device is a monolithic integrated circuit designed to provide high-current switching with low saturation voltages when activated by low-level logic signals. Source and sink switches may be independently activated without regard to timing as a built-in interlock will keep the sink off if the source is on. • TTL and CMOS Input Compatibility • Thermal Shutdown Protection • 300kHz Operation • Low-Cost TO-220 Package This driver has the high current capability to drive large capacitive loads with fast rise and fall times; but with high-speed internal flyback diodes, it is also ideal for inductive loads. Two UC2950s can be used together to form a full bridge, bipolar motor driver compatible with high frequency chopper current control. ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage Range, VC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V to 35V Output Voltage Range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3.0V to VC+3V Input Voltage Range, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7.0V Peak Output Current (100 ms, 10% DC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±4.0A Continuous Output Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2.0A Power Dissipation with Heat Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15W Power Dissipation in Free Air . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2W Operating Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . -20°C to +100°C Storage Temperature Range, TS . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Note 1: Consult Packaging section of databook for thermal limitations and considerations of package. CONNECTION DIAGRAM TRUTH TABLE 5-PIN TO-220 (TOP VIEW) T Package Source Drive Pin 2 Low Low High High Sink Drive Pin 5 Low High Low High Output Pin 4 Low Off High High Note: With no load, output voltage will be HIGH in the OFF state. SIMPLIFIED SCHEMATIC 5/93 Powered by ICminer.com Electronic-Library Service CopyRight 2003 UC2950 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VC = 35V, TA = -20°C to +100°C, VIL = 0.8V, VIH = 2.4V PARAMETERS Output Leakage to VC Output Leakage to Ground Output Sink Saturation Output Source Saturation Sink Diode Forward Voltage Source Diode Forward Voltage Input Current Supply Current for either input, TA =TJ. TEST CONDITIONS Output Off Output Off VOL, IL = 2.0A (VC-VOL), IL = -2.0A ID = -2.0A ID = 2.0A Either Input, VI = 5V Either Input, VI = 0V Output High Output Low MIN TYP 20 -200 1.2 1.2 1.4 1.4 20 -1.0 20 10 MAX UNITS 500 µA -500 µA 2.0 V 2.0 V 2.0 V 2.0 V 100 µA -1.6 mA 30 mA 20 mA SWITCHING CHARACTERISTICS: See Test Circuit. VC = 12V, RL = 5Ω, TA = 25°C. Guaranteed by design, not 100% tested in production. PARAMETERS Source Turn-On Delay, tD1 Source Turn-Off Delay, tD2 Sink Turn-On Delay, tD3 Sink Turn-Off Delay, tD4 Cross-Conduction Current Spike When Source and Sink are Activated Together MIN SWITCHING TEST CIRCUIT UNITRODE INTEGRATED CIRCUITS 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 • FAX (603) 424-3460 Powered by ICminer.com Electronic-Library Service CopyRight 2003 2 TYP 300 1.0 200 100 0.6 MAX UNITS 500 ns 2.0 µs 400 ns 300 ns 1.0 µs IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated Powered by ICminer.com Electronic-Library Service CopyRight 2003