CM1213 1, 2, 4, 6 and 8-Channel Low Capacitance ESD Protection Arrays Features Product Description • • The CM1213 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1213 will protect against ESD pulses up to +8kV per the IEC 61000-4-2 standard. • • • • • • • • 1, 2, 4, 6 and 8 channels of ESD protection Provides +8 kV ESD protection on each channel per the IEC 61000-4-2 ESD requirements Low loading capacitance of 1.0pF typical Minimal capacitance change with temperature and voltage Channel I/O to GND capacitance difference of 0.02pF typical Channel I/O to I/O capacitance 0.8pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes Available in SOT, SOIC and MSOP packages Lead-free version available Applications • • • • • • This device is particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire, iLink), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection The CM1213 family of devices is available with optional lead-free finishing. Electrical Schematics VP CH1 CH1 VN CH4 CH1 CH5 CH4 CH2 VN CM1213-01ST/SO VP CH6 VP CH1 CM1213-02ST/SO CM1213-02SS/SR VP CH3 CH8 VN CH2 CH1 CM1213-04ST/SO CH7 CH2 VN CH2 CH3 CM1213-06MS/MR CM1213-06SN/SM CH6 VP CH5 CH3 CH4 VN CM1213-08MS/MR © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CM1213 PACKAGE / PINOUT DIAGRAMS Top View CH1 1 VP 2 3 CH2 1 VN 2 CH1 3 4-Lead SOT143-4 3-Lead SOT23-3 5 VP 4 CH2 CH1 1 VN 2 CH2 3 5-Lead SOT23-5 D124 / D134 CH1 2 NC D123 / D133 VN Top View Top View D122 / D132 3 4 1 VN D121 / D131 VP Top View 6 CH4 5 VP 4 CH3 6-Lead SOT23-6 Top View Top View VN 3 CH3 4 8 CH6 CH1 1 7 VP CH2 2 6 CH5 VN 3 5 CH4 CH3 4 8-pin SOIC-8 CH1 1 10 CH8 9 CH7 8 VP 8 CH6 CH2 2 7 VP CH3 3 6 CH5 CH4 4 5 CH4 VN 5 D128 / D138 2 D127 / D137 1 CH2 D126 / D136 CH1 Top View 7 CH6 6 CH5 10-pin MSOP-10 8-pin MSOP-8 Note: These drawings are not to scale. 1-CHANNEL SOT23-3 PACKAGE PIN DESCRIPTIONS PIN NAME TYPE DESCRIPTION 1 CH1 I/O 2 VP PWR Positive voltage supply rail 3 VN GND Negative voltage supply rail PIN NAME 1 NC ESD Channel 2 VN GND 3 CH1 I/O 4 CH2 I/O 5 VP PWR 1 NAME CH1 2 TYPE I/O 3 VN GND ESD Channel ESD Channel Negative voltage supply rail ESD Channel ESD Channel No connect 6 CH5 I/O 7 VP PWR 8 CH6 I/O PIN NAME TYPE 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 CH3 I/O ESD Channel 4 CH4 I/O 5 VN GND 6 CH5 I/O 7 CH6 I/O 8 VP PWR 9 CH7 I/O ESD Channel 10 CH8 I/O ESD Channel Negative voltage supply rail ESD Channel DESCRIPTION ESD Channel I/O ESD Channel I/O ESD Channel Negative voltage supply rail Positive voltage supply rail ESD Channel 2-CHANNEL SOT143-4 PACKAGE PIN DESCRIPTIONS PIN NAME TYPE DESCRIPTION 1 VN GND Negative voltage supply rail 2 CH1 I/O 3 CH2 I/O 4 VP PWR ESD Channel Positive voltage supply rail ESD Channel 8-CHANNEL MSOP-10 PACKAGE PIN DESCRIPTIONS ESD Channel Positive voltage supply rail CH3 I/O I/O I/O CH2 CH4 CH2 I/O 4 6 2 DESCRIPTION CH4 3 PWR I/O CH3 GND VP TYPE CH1 5 VN 5 NAME 1 4 4-CHANNEL SOT23-6 PACKAGE PIN DESCRIPTIONS PIN PIN DESCRIPTION 2-CHANNEL SOT23-5 PACKAGE PIN DESCRIPTIONS TYPE 6-CHANNEL MSOP-8/SOIC-8 PACKAGE PIN DESCRIPTIONS DESCRIPTION ESD Channel Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail ESD Channel ESD Channel Positive voltage supply rail © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish # of Channels Pins Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 1 3 SOT23-3 CM1213-01ST D121 CM1213-01SO D131 2 4 SOT143-4 CM1213-02SS D122 CM1213-02SR D132 2 5 SOT23-5 CM1213-02ST D123 CM1213-02SO D133 4 6 SOT23-6 CM1213-04ST D124 CM1213-04SO D134 6 8 SOIC-8 CM1213-06SN D126 CM1213-06SM D136 6 8 MSOP-8 CM1213-06MS D127 CM1213-06MR D137 8 10 MSOP-10 CM1213-08MS D128 CM1213-08MR D138 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Operating Supply Voltage (VP - VN) 6.0 V Diode Forward DC Current (Note 1) 8 mA -40 to +85 °C -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Temperature Range Storage Temperature Range DC Voltage at any channel input Note 1: Only one diode conducting at a time. STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT23-3 Package (CM1213-01ST/SO) SOT143-4 Package (CM1213-02SS/SR) SOT23-5 Package (CM1213-02ST/SO) SOT23-6 Package (CM1213-04ST/SO) MSOP8 Package (CM1213-06MS/MR) SOIC8 Package (CM1213-06SN/SM) MSOP10 Package (CM1213-08MS/MR) RATING UNITS -40 to +85 °C 225 225 225 225 400 600 400 mW mW mW mW mW mW mW © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CM1213 ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 3.3 5.5 V 8.0 µA 0.80 0.80 0.95 0.95 V V VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C Channel Leakage Current TA=25°C; VP=5V, VN=0V ±0.1 ±1.0 µA Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 1.0 1.5 pF ILEAK CIN 0.60 0.60 ∆CIN Channel I/O to GND capacitance 0.02 pF ∆CIO Channel I/O to I/O capacitance 0.80 pF VESD ESD Protection Peak Discharge Voltage at any channel input, in system, contact discharge per IEC 61000-42 standard Notes 2, 4 and 5; TA=25°C Channel Clamp Voltage Positive Transients Negative Transients At 8kV ESD HBM; TA=25°C; Notes 2 & 3 Dynamic Resistance Positive Transients Negative Transients TA=25°C; Notes 5 & 6 VCL RDYN Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: ±8 kV +9.0 -9.0 V V 1.2 0.6 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7mS, maximum current = 1.5A. © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Performance Information Input Channel Capacitance Performance Curves Input Capacitance (pF) 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Input Voltage (V) Typical Variation of CIN vs. VIN Input Capacitance (pF) (f=1MHz, VP = 3.3V, VN = 0V, 0.1 µF chip capacitor between VP and VN, 25°C) 1.25 1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0V DC Input Bias 1.65V DC Input Bias -50 -25 0 25 50 75 100 Temperature (°C) Typical Variation of CIN vs. Temp (f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V, 0.1 µF chip capacitor between VP and VN) © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CM1213 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt + L2 x d(IESD ) / dt where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. Additional Information An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here d(IESD)/dt can be approximated by See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.calmicro.com. ∆IESD/∆t, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1213 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail L2 POSITIVE SUPPLY RAIL VP VCC PATH OF ESD CURRENT PULSE IESD 0.22µF L1 D1 ONE CHANNEL D2 OF LINE BEING PROTECTED SYSTEM OR CIRCUITRY BEING PROTECTED CHANNEL INPUT 25A CM1213 VCL 0A GROUND RAIL VN CHASSIS GROUND Figure 3. Application of Positive ESD Pulse between Input Channel and Ground © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 CM1213 Mechanical Details The CM1213 is available in SOT23-3, SOT143-4, SOT23-5, SOT23-6, MSOP-8, SOIC-8 and MSOP-10 packages with a lead-free finishing option.The various package drawings are presented below. SOT23-3 Mechanical Specifications Dimensions for CM1213-01ST/SO devices packaged in 3-pin SOT23 packages are presented below. Mechanical Package Diagrams For complete information on the SOT23-3 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW b 3 PACKAGE DIMENSIONS E1 E Package SOT23-3 (JEDEC name is TO-236) Pins 3 Dimensions Millimeters Min Max Min Max A 0.89 1.12 0.0350 0.0441 0.01 0.10 0.0004 0.0039 b 0.30 0.50 0.0118 0.0197 c 0.08 0.20 0.0031 0.0079 D 2.80 3.04 0.1102 0.1197 E 2.10 2.64 0.0827 0.1039 E1 1.20 1.40 0.0472 0.0551 e1 L L1 # per tape and reel 0.95 BSC e SIDE VIEW D A1 A 0.0374 BSC 1.90 BSC 0.40 2 e1 Inches A1 e 1 0.0748 BSC 0.60 0.54 REF 0.0157 END VIEW 0.0236 0.0213 REF 3000 pieces c L1 L Controlling dimension: millimeters Package Dimensions for SOT23-3. © 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Mechanical Details (cont’d) SOT143 Mechanical Specifications Dimensions for CM1213-02SS/SR devices packaged in 4-pin SOT143 packages are presented below. Mechanical Package Diagrams For complete information on the SOT143 package, see the California Micro Devices SOT143 Package Information document. TOP VIEW e 4 3 PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions E1 E 1 Millimeters Min Max Min Max 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 0.047 0.055 e 1.92 BSC 0.075 BSC e1 0.20 BSC 0.008 BSC L L1 # per tape and reel 0.4 0.6 0.54 REF e1 Inches A 0.016 2 SIDE VIEW D A b2 b A1 END VIEW 0.024 c 0.021 REF 3000 pieces L L1 Controlling dimension: millimeters Package Dimensions for SOT143. © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 9 CM1213 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications Dimensions for CM1213-02ST/SO devices packaged in 5-pin SOT23 packages are presented below. Mechanical Package Diagrams For complete information on the SOT23-5 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 e 5 4 E1 E PACKAGE DIMENSIONS 1 Package SOT23-5 (JEDEC name is MO-178) Pins 5 Dimensions Inches Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L1 # per tape and reel 0.30 0.60 0.60 REF 3 b Millimeters Min L 2 0.0118 0.0236 SIDE VIEW D A A1 END VIEW c 0.0236 REF L1 L 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-5. © 2004 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1213-04ST/SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. Mechanical Package Diagrams For complete information on the SOT23-6 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 6 PACKAGE DIMENSIONS SOT23-6 (JEDEC name is MO-178) Pins 6 Min Max Min Max -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L1 # per tape and reel 0.30 0.60 0.60 REF 0.0118 2 3 b Inches A L 4 E1 E 1 Millimeters 5 Pin 1 Marking Package Dimensions e SIDE VIEW D A A1 END VIEW 0.0236 0.0236 REF 3000 pieces c L1 L Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 11 CM1213 Mechanical Details SOIC-8 Mechanical Specifications Dimensions for CM1213-06SN/SM devices packaged in 8-pin SOIC packages are presented below. Mechanical Package Diagrams For complete information on the SOIC-8 package, see the California Micro Devices SOIC Package Information document. TOP VIEW D 8 7 6 5 PACKAGE DIMENSIONS Package Pins Dimensions H SOIC Pin 1 Marking E 8 Millimeters Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 1 2 3 4 SIDE VIEW E e 3.80 4.19 0.150 1.27 BSC A A1 SEATING PLANE B 0.165 e 0.050 BSC H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 # per tube 100 pieces* # per tape and reel 2500 pieces Controlling dimension: inches END VIEW C L * This is an approximate number which may vary. Package Dimensions for SOIC-8 © 2004 California Micro Devices Corp. All rights reserved. 12 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04 CM1213 Mechanical Details MSOP-8 Mechanical Specifications: CM1213-06MS/MR devices are packaged in 8-pin MSOP packages. Dimensions are presented below. Mechanical Package Diagrams TOP VIEW For complete information on the MSOP-8 package, see the California Micro Devices MSOP Package Information document. D 8 PACKAGE DIMENSIONS Package MSOP Pins 8 Dimensions 6 5 E H Pin 1 Marking Millimeters Inches Min Max Min Max A 0.87 1.17 0.034 0.046 A1 0.05 0.25 0.002 0.010 B 0.30 (typ) 0.012 (typ) C 0.18 0.007 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 0.65 BSC 1 2 3 4 SIDE VIEW A D e 7 SEATING PLANE A1 B e 0.025 BSC H 4.78 4.98 0.188 0.196 L 0.52 0.54 0.017 0.025 # per tube 80 pieces* # per tape and reel 4000 pieces END VIEW C L Controlling dimension: inches Package Dimensions for MSOP-8 * This is an approximate amount which may vary. © 2004 California Micro Devices Corp. All rights reserved. 01/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 13 CM1213 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications CM1213-08MS/MR devices are packaged in 10-pin MSOP packages. Dimensions are presented below. Mechanical Package Diagrams For complete information on the MSOP-10 package, see the California Micro Devices MSOP Package Information document. TOP VIEW D 10 9 8 6 7 PACKAGE DIMENSIONS Package MSOP Pins Dimensions 10 Inches Min Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.18 0.40 0.006 0.016 C 0.18 Pin 1 Marking 1 0.007 D 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 e E H Millimeters 0.50 BSC 0.0196 BSC H 4.76 5.00 0.187 0.197 L 0.40 0.70 0.0137 0.029 # per tube 80 pieces* # per tape and reel 4000 Controlling dimension: inches * This is an approximate number which may vary. 2 3 4 5 SIDE VIEW A SEATING PLANE A1 B e END VIEW C L Package Dimensions for MSOP-10 © 2004 California Micro Devices Corp. All rights reserved. 14 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/13/04