CY62146CV18 MoBL2™ 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption by 99% when addresses are not toggling. The device can also be put into standby mode when deselected (CE HIGH). The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE HIGH), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a write operation (CE LOW and WE LOW). • High Speed — 55 ns and 70 ns availability • Low voltage range: — CY62146CV18: 1.65V−1.95V • Pin Compatible w/ CY62146V18/BV18 • Ultra-low active power — Typical Active Current: 0.5 mA @ f = 1 MHz • • • • — Typical Active Current: 2 mA @ f = fmax (70 ns speed) Low standby power Easy memory expansion with CE and OE features Automatic power-down when deselected CMOS for optimum speed/power Functional Description The CY62146CV18 is a high-performance CMOS static RAM organized as 256K words by 16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ (MoBL™) in portable applications such as cellular telephones. The device also has Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A17). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A17). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the Truth Table at the back of this data sheet for a complete description of read and write modes. The CY62146CV18 is available in 48-ball FBGA packaging. Logic Block Diagram 256K x 16 RAM Array 2048 X 2048 SENSE AMPS A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 ROW DECODER DATA IN DRIVERS I/O0–I/O7 I/O8–I/O15 BHE WE CE OE BLE A16 A17 A14 A15 A12 A13 A11 COLUMN DECODER MoBL, MoBL2, and More Battery Life are trademarks of Cypress Semiconductor Corporation. Cypress Semiconductor Corporation Document #: 38-05010 Rev. *B • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 Revised October 31, 2001 CY62146CV18 MoBL2™ Pin Configuration[1, 2] FBGA Top View 1 2 3 4 5 6 BLE OE A0 A1 A2 NC A I/O8 BHE A3 A4 CE I/O0 B I/O9 I/O10 A5 A6 I/O1 I/O2 C VSS I/O11 A17 A7 I/O3 Vccq D VCC I/O12 DNU A16 I/O4 Vssq E I/O14 I/O13 A14 A15 I/O5 I/O6 F I/O15 NC A12 A13 WE I/O7 G NC A8 A9 A10 A11 NC H Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ..................................... −65°C to +150°C Ambient Temperature with Power Applied.................................................. −55°C to +125°C Supply Voltage to Ground Potential .................−0.2V to +2.4V DC Voltage Applied to Outputs in High Z State[3] ....................................... −0.2V to VCC + 0.2V DC Input Voltage[3].................................... −0.2V to VCC + 0.2V Output Current into Outputs (LOW)............................. 20 mA Static Discharge Voltage .......................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current.................................................... >200 mA Operating Range Device CY62146CV18 Range Ambient Temperature VCC Industrial −40°C to +85°C 1.65V to 1.95V Product Portfolio Power Dissipation (Industrial) Operating (ICC) VCC Range f = 1 MHz Standby (ISB2) f = fmax Product VCC(min) VCC(typ)[4] VCC(max) Speed Typ.[4] Max. Typ.[4] Max. Typ.[4] Max. CY62146CV18 1.65V 1.80V 1.95V 55 ns 0.5 mA 3 mA 2.5 mA 7 mA 1 µA 10 µA 70 ns 0.5 mA 3 mA 2 mA 6 mA Notes: 1. NC pins are not connected to the die. 2. E3 (DNU) can be left as NC or VSS to ensure proper application. 3. VIL(min) = −2.0V for pulse durations less than 20 ns. 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C. Document #: 38-05010 Rev. *B Page 2 of 12 CY62146CV18 MoBL2™ Electrical Characteristics Over the Operating Range CY62146CV18-55 Parameter Description Test Conditions Min. [4] Typ. Max. VOH Output HIGH Voltage IOH = −0.1 mA VCC = 1.65V VOL Output LOW Voltage IOL = 0.1 mA VCC = 1.65V VIH Input HIGH Voltage 1.4 VCC + 0.2V VIL Input LOW Voltage −0.2 IIX Input Leakage Current GND < VI < VCC IOZ Output Leakage Current GND < VO < VCC, Output Disabled ICC VCC Operating Supply Current f = fMAX = 1/tRC ISB1 Automatic CE Power-Down Current— CMOS Inputs CE > VCC – 0.2V, VIN > VCC – 0.2V, VIN < 0.2V f = fMAX (Address and Data Only), f = 0 (OE, WE, BHE, and BLE) Automatic CE Power-Down Current— CMOS Inputs CE > VCC−0.2V VIN > VCC−0.2V or VIN < 0.2V, f = 0, VCC = 1.95V ISB2 f = 1 MHz CY62146CV18-70 Min. Typ.[4] 1.4 Max. Unit 1.4 V 0.2 0.2 V 1.4 VCC + 0.2V V 0.4 −0.2 0.4 V −1 +1 −1 +1 µA −1 +1 −1 +1 µA VCC = 1.95V IOUT = 0 mA CMOS levels 2.5 7 2 6 mA 0.5 3 0.5 3 mA 1 10 1 10 µA Capacitance[5] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions Max. Unit 6 pF 8 pF TA = 25°C, f = 1 MHz, VCC= VCC(typ) Thermal Resistance Description Thermal Resistance (Junction to Ambient)[5] Test Conditions Symbol BGA Unit Still Air, soldered on a 4.25 x 1.125 inch, 4-layer printed circuit board ΘJA 55 °C/W ΘJC 16 °C/W Thermal Resistance (Junction to Case)[5] Note: 5. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05010 Rev. *B Page 3 of 12 CY62146CV18 MoBL2™ AC Test Loads and Waveforms R1 ALL INPUT PULSES VCC VCC Typ OUTPUT 10% 90% 10% 90% GND R2 30 pF Equivalent to: Fall Time: 1 V/ns Rise Time: 1 V/ns INCLUDING JIG AND SCOPE THÉVENIN EQUIVALENT RTH OUTPUT V Parameters 1.8V UNIT R1 13500 Ohms R2 10800 Ohms RTH 6000 Ohms VTH 0.80 Volts Data Retention Characteristics (Over the Operating Range) Parameter Description Conditions VDR VCC for Data Retention ICCDR Data Retention Current tCDR[5] Chip Deselect to Data Retention Time tR[6] Operation Recovery Time Min. Typ.[4] 1.0 VCC = 1.0V CE > VCC − 0.2V, VIN > VCC − 0.2V or VIN < 0.2V 1 Max. Unit 1.95 V 8 µA 0 ns tRC ns Data Retention Waveform DATA RETENTION MODE VCC VCC(min.) VDR > 1.0 V tCDR VCC(min.) tR CE Note: 6. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs. Document #: 38-05010 Rev. *B Page 4 of 12 CY62146CV18 MoBL2™ Switching Characteristics Over the Operating Range[7] 55 ns Parameter Description Min. 70 ns Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid 55 70 ns tDOE OE LOW to Data Valid 25 35 ns tLZOE OE LOW to Low Z 55 55 [8] 10 OE HIGH to High Z tLZCE CE LOW to Low Z[8] 70 20 ns 25 10 ns ns tHZCE CE HIGH to High Z tPU CE LOW to Power-Up tPD CE HIGH to Power-Down 55 70 ns tDBE BLE/BHE LOW to Data Valid 25 35 ns tLZBE BLE/BHE LOW to Low Z tHZBE 20 ns ns 5 5 [8, 9] ns 10 5 [8, 9] tHZOE 70 0 [8] BLE/BHE HIGH to High Z 0 5 [8, 9] 25 ns 5 20 ns ns 25 ns [10] WRITE CYCLE tWC Write Cycle Time 55 70 ns tSCE CE LOW to Write End 40 60 ns tAW Address Set-Up to Write End 40 60 ns tHA Address Hold from Write End 0 0 ns tSA Address Set-Up to Write Start 0 0 ns tPWE WE Pulse Width 40 50 ns tBW BLE/BHE LOW to Write End 40 60 ns tSD Data Set-Up to Write End 25 30 ns tHD Data Hold from Write End 0 0 ns tHZWE tLZWE WE LOW to High Z [8, 9] WE HIGH to Low Z [8] 15 5 25 10 ns ns Notes: 7. Test conditions assume signal transition time of 3ns or less, timing reference levels of VCC(typ)/2, input pulse levels of 0 to VCC(typ), and output loading of the specified IOL/IOH and 30-pF load capacitance 8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 9. tHZOE, tHZCE, tHZBE and tHZWE transitions are measured when the outputs enter a high impedance state. 10. The internal write time of the memory is defined by the overlap of WE, CE = VIL, BHE and/or BLE =VIL. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the write. Document #: 38-05010 Rev. *B Page 5 of 12 CY62146CV18 MoBL2™ Switching Waveforms Read Cycle No. 1(Address Transition Controlled) [11, 12] tRC ADDRESS tAA tOHA DATA OUT DATA VALID PREVIOUS DATA VALID Read Cycle No. 2 (OE Controlled) [12, 13] ADDRESS tRC CE tPD tHZCE tACE OE tHZOE tDOE BHE/BLE tLZOE tHZBE tDBE tLZBE DATA OUT HIGH IMPEDANCE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT tPU ICC 50% 50% ISB Notes: 11. Device is continuously selected. OE, CE = VIL, BHE and/or BLE = VIL.. 12. WE is HIGH for read cycle. 13. Address valid prior to or coincident with CE, BHE, BLE, transition LOW. Document #: 38-05010 Rev. *B Page 6 of 12 CY62146CV18 MoBL2™ Switching Waveforms Write Cycle No. 1(WE Controlled) [10, 14, 15] tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tBW BHE/BLE OE tSD DATA I/O tHD DATAIN VALID NOTE 16 tHZOE Write Cycle No. 2 (CE Controlled) [10, 14, 15] tWC ADDRESS tSCE CE tSA tAW tHA tPWE WE tBW BHE/BLE OE tSD DATA I/O tHD DATAIN VALID NOTE 16 tHZOE Notes: 14. Data I/O is high impedance if OE = VIH. 15. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state. 16. During this period, the I/Os are in output state and input signals should not be applied. Document #: 38-05010 Rev. *B Page 7 of 12 CY62146CV18 MoBL2™ Switching Waveforms [15] Write Cycle No. 3 (WE Controlled, OE LOW) tWC ADDRESS tSCE CE tBW BHE/BLE tAW tHA tSA tPWE WE tHD tSD DATAI/O NOTE 16 DATAIN VALID tLZWE tHZWE Write Cycle No. 4 (BHE/BLE Controlled, OE LOW) [15] tWC ADDRESS CE1 tSCE tAW tHA tBW BHE/BLE tSA tPWE WE tSD DATA I/O NOTE 16 Document #: 38-05010 Rev. *B tHD DATAIN VALID Page 8 of 12 CY62146CV18 MoBL2™ Typical DC and AC Characteristics (Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC Typ, TA = 25°C.) Standby Current vs. Supply Voltage Operating Current vs. Supply Voltage (f = fmax, 55 ns) 3.5 2.4 MoBL2 (f = fmax, 70 ns) 3.0 ISB (µA) ICC (mA) 2.0 1.6 1.2 MoBL2 2.0 1.5 1.0 0.8 (f = 1 MHz) 0.4 0.0 1.65 0.5 0 1.80 SUPPLY VOLTAGE (V) 1.95 1.65 1.80 1.95 SUPPLY VOLTAGE (V) Access Time vs. Supply Voltage 40 MoBL2 35 TAA (ns) 30 25 20 15 10 1.65 1.8 1.95 SUPPLY VOLTAGE (V) Truth Table CE WE OE BHE BLE H X X X X High Z Deselect/Power-Down Standby (ISB) L X X H H High Z Output Disabled Active (ICC) L H L L L Data Out (I/OO–I/O15) Read Active (ICC) L H L H L Data Out (I/OO–I/O7); I/O8–I/O15 in High Z Read Active (ICC) L H L L H Data Out (I/O8–I/O15); I/O0–I/O7 in High Z Read Active (ICC) L H H L L High Z Output Disabled Active (ICC) L H H H L High Z Output Disabled Active (ICC) L H H L H High Z Output Disabled Active (ICC) L L X L L Data In (I/OO–I/O15) Write Active (ICC) L L X H L Data In (I/OO–I/O7); I/O8–I/O15 in High Z Write Active (ICC) L L X L H Data In (I/O8–I/O15); I/O0 –I/O7 in High Z Write Active (ICC) Document #: 38-05010 Rev. *B Inputs/Outputs Mode Power Page 9 of 12 CY62146CV18 MoBL2™ Ordering Information[17] Speed (ns) 70 55 Package Name Package Type Operating Range CY62146CV18LL-70BAI BA48B 48-Ball Fine Pitch BGA (7mm x 8.5mm x 1.2mm) Industrial CY62146CV18LL-70BVI BV48A 48-Ball Fine Pitch BGA (6mm x 8mm x 1mm) CY62146CV18LL-55BAI BA48B 48-Ball Fine Pitch BGA (7mm x 8.5mm x 1.2mm) CY62146CV18LL-55BVI BV48A 48-Ball Fine Pitch BGA (6mm x 8mm x 1mm) Ordering Code Package Diagrams 48-Ball (7 mm x 8.5 mm x 1.2 mm) Fine Pitch BGA BA48B 51-85106-B Note: 17. Gray Shading represents preliminary information. Document #: 38-05010 Rev. *B Page 10 of 12 CY62146CV18 MoBL2™ Package Diagrams (continued) 48-Ball (6 mm x 8 mm x 1 mm) Fine Pitch BGA BV48A Bottom View PR EL IM IN AR Y Top View Document #: 38-05010 Rev. *B Page 11 of 12 © Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY62146CV18 MoBL2™ Document Title: CY62146CV18 MoBL2™, 256K x 16 Static RAM Document Number: 38-05072 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 107265 09/15001 SZV Change from Spec number: 38-01046 to 38-05072 *A 107702 06/15/01 MGN Deactivated spec. *B 111468 11/02/01 MGN Die Rev (R5 to R7), Change part number from CY62146BV18 to CY62146CV18 Document #: 38-05010 Rev. *B Page 12 of 12