DCR1575SY / DCR1575SV DCR1575SY / DCR1575SV Phase Control Thyristor Advance Information Replaces July 2001 version, DS4401-5.0 DS4401-6.0 OCtober 2003 KEY PARAMETERS PACKAGE OUTLINE VDRM 4200V IT(AV) 2536A ITSM 44000A dVdt* 1000V/µs dI/dt 300A/µs *Higher dV/dt selections available Outline type code: Y Outline type code: V See Package Details for further information. Fig. 1 Package outline VOLTAGE RATINGS Part Number Repetitive Peak Voltages VDRM VRRM Conditions V DCR1575SY42 or DCR1575SV42 4200 4200 Tvj = 0˚ to 125˚C. IDRM = IRRM = 500mA. VDRM, VRRM = 10ms 1/2 sine. VDSM & VRSM = VDRM & VRRM + 100V respectively. Lower voltage grades available. ORDERING INFORMATION When ordering select the required part number shown in the Voltage Ratings selection table. For example: DCR1575SY42 for a 4200V 'Y' outline variant or DCR1575SV42 for a 4200V 'V' outline variant If a lower voltage grade is required, then use VDRM/100 for the grade required e.g.: DCR1575SY36 for a 3600V 'Y' outline variant etc. Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. 1/9 www.dynexsemi.com DCR1575SY / DCR1575SV CURRENT RATINGS Tcase = 60˚C unless stated otherwise Symbol Parameter Conditions Max. Units 2536 A Double Side Cooled Half wave resistive load IT(AV) Mean on-state current IT(RMS) RMS value - 3983 A Continuous (direct) on-state current - 3729 A 1680 A IT Single Side Cooled (Anode side) IT(AV) Mean on-state current IT(RMS) RMS value - 2639 A Continuous (direct) on-state current - 2295 A Conditions Max. Units 2010 A IT Half wave resistive load CURRENT RATINGS Tcase = 80˚C unless stated otherwise Symbol Parameter Double Side Cooled Half wave resistive load IT(AV) Mean on-state current IT(RMS) RMS value - 3155 A Continuous (direct) on-state current - 2850 A 1310 A IT Single Side Cooled (Anode side) IT(AV) Mean on-state current IT(RMS) RMS value - 2050 A Continuous (direct) on-state current - 1740 A IT Half wave resistive load 2/9 www.dynexsemi.com DCR1575SY / DCR1575SV SURGE RATINGS ITSM I2t ITSM I2t Conditions Max. Units 10ms half sine; Tcase = 125oC 35.0 kA VR = 50% VRRM - 1/4 sine 6.13 x 106 A2s 10ms half sine; Tcase = 125oC 44.0 kA VR = 0 9.68 x 106 A2s Parameter Symbol Surge (non-repetitive) on-state current I2t for fusing Surge (non-repetitive) on-state current I2t for fusing THERMAL AND MECHANICAL DATA Min. Max. dc - 0.0095 o Anode dc - 0.019 o Cathode dc - 0.019 o C/W Double side - 0.002 o C/W Single side - 0.004 o C/W On-state (conducting) - 135 o Reverse (blocking) - 125 o Storage temperature range -55 150 o Clamping force 45.0 55.0 Parameter Symbol Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case Units C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 50.0kN with mounting compound C Virtual junction temperature C C kN 3/9 www.dynexsemi.com DCR1575SY / DCR1575SV DYNAMIC CHARACTERISTICS Symbol Parameter Conditions Typ. Max. Units Peak reverse and off-state current At VRRM/VDRM, Tcase = 125oC - 300 mA dV/dt Maximum linear rate of rise of off-state voltage To 67% VDRM Tj = 125oC. - 1000 V/µs - 150 A/µs Rate of rise of on-state current From 67% VDRM to 2x IT(AV) Gate source 20V, 20Ω tr < 0.5µs. Repetitive 50Hz dI/dt Non-repetitive - 300 A/µs IRRM/IDRM Threshold voltage At Tvj = 125oC - 0.94 V rT On-state slope resistance At Tvj = 125oC - 0.24 mΩ tgd Delay time VD = 67% VDRM, Gate source 30V, 15Ω Rise time 0.5µs, Tj = 25oC - 2.5 µs IL Latching current Tj = 25oC, VD = 5V 550 1000 mA IH Holding current Tj = 25oC, Rg - k = ∞ 150 300 mA tq Turn-off time IT = 800A, tp = 1ms, Tj = 125˚C, VRM = 50V, dIRR/dt = 20A/µs, VDR = 67% VDRM, dVDR/dt = 20V/µs linear 1.2 - ms Max. Units VT(TO) GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Conditions VGT Gate trigger voltage VDRM = 5V, Tcase = 25oC 3.0 V IGT Gate trigger current VDRM = 5V, Tcase = 25oC 300 mA VGD Gate non-trigger voltage At VDRM Tcase = 125oC 0.25 V VFGM Peak forward gate voltage Anode positive with respect to cathode 30 V VFGN Peak forward gate voltage Anode negative with respect to cathode 0.25 V VRGM Peak reverse gate voltage 5 V IFGM Peak forward gate current Anode positive with respect to cathode 30 A PGM Peak gate power See table, gate characteristics curve 150 W PG(AV) Mean gate power 10 W 4/9 www.dynexsemi.com DCR1575SY / DCR1575SV CURVES 5000 8000 Measured under pulse conditions Tj = 125˚C Min. Max. 6 phase 3 phase Halfwave d.c. Mean power dissipation - (W) Instantaneous on-state current, IT - (A) 4000 6000 4000 3000 2000 2000 1000 0 0.0 0 1.0 2.0 Instantaneous on-state voltage, VT - (V) Fig.2 Maximum (limit) on-state characteristics 3.0 0 1000 2000 3000 Mean on-state current, IT(AV) - (A) Fig.3 Dissipation curves VTM Equation:VTM = A + Bln (IT) + C.IT+D.√IT Where A = 1.659647 B = –0.2206499 C = 7.427997 x 10–5 D = 0.02837417 these values are valid for Tj = 125˚C for IT 500A to 7600A 5/9 www.dynexsemi.com DCR1575SY / DCR1575SV 100 Conditions: Tj = 125˚C, VR = 800V, IT = 2000A Snubber 1µF, 11 Ohms Table gives pulse power PGM in Watts Pulse Width 10000 Gate trigger voltage, VGT - (V) Stored charge, QS - (µC) 100000 Max. QS Min. QS 1000 µs 100 200 500 1ms 10ms Frequency Hz 50 150 150 150 150 20 100 150 150 150 100 - 400 150 125 100 25 - 10 2W 50W 20W 10W 5W Tj = 125˚C p Up 1 it 9 im rL 9% e imi rL we IT t1 Tj = -40˚C T = 25˚C % j Lo QS tp = 2ms dI/dt IRM 100 0.1 1.0 0.1 0.001 100 10 0.01 0.1 1.0 Gate trigger current, IGT - (A) Rate of decay of on-state current, dI/dt - (A/µs) Fig.4 Stored charge 10 Fig.5 Gate characteristics 100 0.1 0.01 Double side cooled 0.001 Conduction d.c. Halfwave 3 phase 120˚ 6 phase 60˚ 0.0001 0.001 0.01 Effective thermal resistance Junction to case ˚C/W Double side 0.0095 0.0105 0.0112 0.0139 0.1 1 Time - (s) 80 7.0 60 6.0 5.0 40 4.0 I2t 3.0 20 2.0 Anode side 0.019 0.020 0.0207 0.0234 10 I2t value for fusing - (A2s x 106) Thermal impedance - (˚C/W) Anode side cooled Peak half sinewave on-state current - (kA) Tcase = 125˚C With 50% VRRM 1.0 100 0 1 10 ms Fig.6 Transient thermal impedance - junction to case 1 5 10 0 50 Cycles at 50Hz Duration Fig.7 Surge (non-repetitive) on-state current vs time (with 50% VRRM at Tcase = 125˚C) 6/9 www.dynexsemi.com DCR1575SY / DCR1575SV PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hole Ø3.6 x 2.0 deep (One in each electrode) Cathode tab Cathode Ø112.5 max Ø73 nom 37.7 36.0 Ø1.5 Gate Ø73 nom Anode Nominal weight: 1600g Clamping force: 50kN ±10% Lead length: 420mm Lead terminal connector: M4 ring Package outine type code: Y Fig.8 Package details 7/9 www.dynexsemi.com DCR1575SY / DCR1575SV PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes Ø3.6 x 2.0 deep (In both electrodes) Cathode tab Cathode Ø112.5 max Ø73 nom 27.0 25.4 Ø1.5 Gate Ø73 nom Anode Nominal weight: 1100g Clamping force: 50kN ±10% Lead length: 420mm Lead terminal connector: M4 ring Package outline type code: V Fig.9 Package details 8/9 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 53. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com