DS2101SY / DS2101SV DS2101SY / DS2101SV Rectifier Diode Replaces October 2002 version, DS4170-6.0 DS4170-6.1 February 2003 FEATURES KEY PARAMETERS ■ Double Side Cooling VRRM 1500V ■ High Surge Capability IF(AV) 7810A IFSM APPLICATIONS 79000A ■ Rectification ■ Freewheel Diode ■ DC Motor Control ■ Power Supplies ■ Welding ■ Battery Chargers VOLTAGE RATINGS Type Number DS2101SY15 Repetitive Peak Reverse Voltage VRRM V 1500 Conditions VRSM = VRRM + 100V Outline type code: Y Outline type code: V Outline type code: Y or V See Package Details for further information. Fig. 1 Package outline Lower voltage grades available. ORDERING INFORMATION When ordering, use part number shown in the Voltage Ratings selection table. If a lower voltage grade is required, then use two a digit abbreviation for the grade required (VRRM/100) e.g.: DS2101SY14 for a 1400V deivce. If the device is required in the slim 'V' package then substitute the 'Y' shown in the part number in the Voltage Ratings table for 'V', i.e.: DS2101SV15 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. 1/8 www.dynexsemi.com DS2101SY / DS2101SV CURRENT RATINGS Tcase = 75oC unless otherwise stated Symbol Parameter Conditions Max. Units 7810 A Double Side Cooled Half wave resistive load IF(AV) Mean forward current IF(RMS) RMS value - 12268 A Continuous (direct) forward current - 11091 A 5035 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 7909 A Continuous (direct) forward current - 6579 A Conditions Max. Units 6630 A IF Half wave resistive load Tcase = 100oC unless otherwise stated Symbol Parameter Double Side Cooled Half wave resistive load IF(AV) Mean forward current IF(RMS) RMS value - 10400 A Continuous (direct) forward current - 8600 A 4220 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 6630 A Continuous (direct) forward current - 5190 A IF Half wave resistive load 2/8 www.dynexsemi.com DS2101SY / DS2101SV SURGE RATINGS Parameter Symbol IFSM I2t IFSM I2t Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current Conditions Max. Units 10ms half sine; Tcase = 190oC 72.0 kA VR = 50% VRRM - 1/4 sine 25.9 x 106 A2s 10ms half sine; Tcase = 190oC 79.0 kA VR = 0 31.2 x 106 A2s I2t for fusing THERMAL AND MECHANICAL DATA Parameter Symbol Conditions Min. Max. dc - 0.0095 o Anode dc - 0.019 o Cathode dc - 0.019 o C/W Double side - 0.002 o C/W Single side - 0.004 o C/W Forward (conducting) - 200 o Reverse (blocking) - 190 o –55 190 o 38 47 Double side cooled Rth(j-c) Thermal resistance - junction to case Units C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 43kN with mounting compound C Virtual junction temperature Storage temperature range Clamping force C C kN 3/8 www.dynexsemi.com DS2101SY / DS2101SV CHARACTERISTICS Symbol Conditions Parameter Min. Max. Units VFM Forward voltage At 3000A peak, Tcase = 25oC - 0.95 V IRRM Peak reverse current At VRRM, Tcase = 190oC - 100 mA QS Total stored charge IF = 2000A, dIRR/dt = 3A/µs - 1600 µC IRM Peak recovery current Tcase = 175˚C, VR = 100V - 90 A VTO Threshold voltage At Tvj = 190˚C - 0.67 V Slope resistance At Tvj = 190˚C - 0.038 mΩ rT CURVES 10000 16000 Measured under pulse conditions 8000 Mean power dissipation - (W) Instantaneous forward current, IF - (A) 12000 6000 Tj = 190˚C Tj = 25˚C 4000 8000 4000 2000 dc Half wave 3 phase 6 phase 0 0 0.5 1.0 Instantaneous forward voltage, VF -(V) Fig.2 Maximum (limit) forward characteristics 1.5 0 0 4000 8000 12000 Mean forward current, IF(AV) - (A) 16000 Fig.3 Dissipation curves VFM Equation:VFM = A + Bln (IF) + C.IF+D.√IF Where A = 0.081707 B = 0.100349 C = 5.72 x 10–5 D = –0.00529 These values are valid for Tj = 190˚C for IF 500A to 10000A 4/8 www.dynexsemi.com DS2101SY / DS2101SV 100000 IF 175 Conditions: Tj = 175˚C VR = 100V IF = 2000A QS I2t = Î2 x t 2 150 dIF/dt Stored charge, QS - (µC) 10000 125 100 30 75 25 50 I2t 20 25 1000 0.1 1.0 10 Rate of decay of forward current, dIF/dt - (A/µs) 100 15 0 1 10 ms Fig.4 Total stored charge 1 2 3 5 10 20 I2t value - (A2s x 106) Peak half sine forward current - (kA) IRR 10 50 Cycles at 50Hz Duration Fig.5 Surge (non-repetitive) forward current vs time (with 50% VRRM at Tcase 190˚C) 0.1 Thermal impedance - (˚C/W) Anode side cooled 0.01 Double side cooled 0.001 Conduction d.c. Halfwave 3 phase 120˚ 6 phase 60˚ 0.0001 0.001 0.01 0.1 1 Time - (s) Effective thermal resistance Junction to case ˚C/W Double side 0.0095 0.0105 0.0112 0.0139 10 Single side 0.019 0.020 0.0207 0.0234 100 Fig.6 Maximum (limit) transient thermal impedance junction to case 5/8 www.dynexsemi.com DS2101SY / DS2101SV PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hole Ø3.6 x 2.0 deep (One in each electrode) Cathode 37.7 36.0 Ø112.5 max Ø73 nom Ø73 nom Anode Nominal weight: 1600g Clamping force: 43kN ±10% Package outline type code: Y Note: Some packages may be supplied with gate pins and/or tags. 6/8 www.dynexsemi.com DS2101SY / DS2101SV PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Holes Ø3.6 x 2.0 deep (In both electrodes) Cathode 27.0 25.4 Ø112.5 max Ø73 nom Ø73 nom Anode Nominal weight: 1100g Clamping force: 43kN ±10% Package outline type code: V Note: Some packages may be supplied with gate pins and/or tags. 7/8 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com