Application Notes on EM55M450 V.S EM55450 Document Number : Date of Issue : Issue Version : Supported Chips : Applicable Software : AP-EM55-0006C 24 October 2002 1.0 EM55450 1.0 Electrical Characteristics: Item Operating Voltage Operating current Operating current Reset voltage level R osc F osc I/P pull low impedance Output current Vo (Current DAC) 55M450 2 6V 1.775mA 2.522mA 1.5V 100KΩ 1.2MHz 10.353uA (≅435KΩ) 3.934uA (≅763KΩ) 11.3uA (≅44KΩ) 6.328uA (≅79KΩ) 2.2V 1.4V 21.2mA 10.25mA 16.87mA 7.653mA 4.51mA 4.2 5.8mA EM55450 1.5 6.2 V 200uA 1.778 mA 1.5V 100KΩ 1.2MHz 10uA (≅450 KΩ) 3.889uA (≅771KΩ) 11.5uA (≅43KΩ) 6.98uA (≅75KΩ) 2.5V 1.8V 18.35mA 7.7mA 17.2mA 7.4mA 5.2mA typ. 4 6.1mA Output current of Vo1, Vo (Direct drive) 147.8mA typ 140 160mA 150 mA typ 146 156mA I/P pull low impedance I/P Trans Voltage ViH O/P Sink current O/P Drive current 1 of 5 memo Tradition D/A Push-pull @Vcc=3V @4.5Vcc,Vi=Vcc @3Vcc,Vi=Vcc @4.5Vcc,Vi=0.5V @3Vcc,Vi=0.5V @4.5Vcc @3Vcc @4.5Vcc,Vo=Vcc @3Vcc,Vo=Vcc @4.5Vcc,Vo=0V @3Vcc,Vo=0V @3Vcc Full-silence, Vo=0 @3Vcc Sink current of Vo,Vo1=1/2VCC 2.0 Pin Assignment: Item Pad number Must Bounding Pads Die diagram 55M450 27 Pads VDD、VPP、GND、VSS、OSC P1.0 P1.3、P3.0 P3.3 EM55450 26 Pads Used pads Test pin Open meno (0,0) (0,0) EM55M450 VCC 27 VO 28 VSSC 29 VO1 30 7 9 10 OSCI 12 OSCO 11 26 60 OSCI VO 27 59 OSCO VSS 28 58 VSS VO1 29 57 TEST 56 RESET VDD1 35 VSSD 8 P1.0 6 TEST/VPP 5 P1.1 4 RESET 3 P2.0 2 P2.1 1 P1.2 40 P1.3 39 P2.3 38 P2.2 37 P3.2 36 P3.0 35 P3.1 34 P4.2 P4.3 VDD Pad location 33 P4.1 32 P3.3 31 P4.0 CIN 13 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 VDD P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 P1.1 P1.0 U 形排列 U 形排列 Die size 2920x3020 55450= 2300x2020 Substrate Vss Vss Pin’s sequence is same as um*um PCB layout notes: 1. 由於 EM55M450 的 Die size 較大, 因此應採用 EM55M450 的 Die size 為 layout 依據. 才能放的下 EM55450 2. 為執行燒錄動作, 因此 EM55M450 的 Vpp, 必須打線出來, 其他相關燒 錄 Pad 亦需打線出來以便燒錄. 2 of 5 PCB layout examples: 1. Bounding Pad diagram: Vcc Vo Vssc Vo1 CIN OSCI OSCO Vss Vdd P4 3 P4 2 P4 1 P4 0 VPP/Test RST P1 0 P1 1 P1 2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 2. Bounding for EM55M450 : EM55M450 Vcc Vo Vssc Vo1 CIN OSCI OSCO Vss Vdd P4 3 P4 2 P4 1 P4 0 VPP/Test RST P1 0 P1 1 P1 2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 3 of 5 3. Bounding for EM55450 : Vcc Vo Vssc Vo1 CIN EM55450 OSCI OSCO Vss Vdd P4.3 P4.2 P4.1 P4.0 Test RST P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 4 of 5 3.0 Program interface : MTP WRITER #1 D0 #2 D1 #3 D2 #4 D3 #5 D4 #6 D5 #7 D6 #8 D7 #9 VDD #10 OEB #11 VPP #12 ACLK #13 VNN #14 PGMB #15 GND #16 DCLK #17 RDY #18 R1 #19 R2 #20 R3 EM55M450 P2.0 P2.1 P2.2 P2.3 N.C N.C N.C N.C VDD P3.2 VPP P3.3 N.C P3.1 GND OSC P3.0 N.C N.C N.C *Vo,Vo1 P1.0 ~P1.3 P4.0~P4..3 These Pins must keep open at programming . NOTE The EM55M450 can Not connect to other component except MTP WRITER with any pins at programming! 5 of 5