NSC LM1921

LM1921 1 Amp Industrial Switch
General Description
Features
The LM1921 Relay Driver incorporates an integrated power
PNP transistor as the main driving element. The advantages
of this over previous integrated circuits employing NPN
power elements are several. Greater output voltages are
available off the same supply for driving grounded loads;
typically 4.5 volts for a 500 mA load from a 5.0 volt supply.
The output can swing below ground potential up to 57 volts
negative with respect to the positive power supply. This can
be used to facilitate rapid decay times in inductive loads.
Also, the IC is immune to negative supply voltages or transients. The inherent Safe Operating Area of the lateral PNP
allows use of the IC as a bulb driver or for capacitive loads.
Familiar integrated circuit features such as short circuit protection and thermal shutdown are also provided. The input
voltage threshold levels are designed to be TTL, CMOS,
and LSTTL compatible over the entire operating temperature range. If several drivers are used in a system, their
inputs and/or outputs may be combined and wired together
if their supply voltages are also common.
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
1 Amp output drive
Load connected to ground
Low input-output voltage differential
a 60 volt positive transient protection
b 50 volt negative transient protection
Automotive reverse battery protection
Short circuit proof
Internal thermal overload protection
Unclamped output for fast decay times
TTL, LSTTL, CMOS compatible input
Plastic TO-220 package
100% electrical burn-in
Applications
Y
Y
Y
Y
Y
Y
Relays
Solenoids
Valves
Motors
Lamps
Heaters
Typical Application Circuit
*Required for stability
TL/H/5271 – 1
FIGURE 1. Test and Application Circuit
Connection Diagram
TL/H/5271 – 2
Front View
Order Number LM1921T
See NS Package Number T05A
C1995 National Semiconductor Corporation
TL/H/5271
RRD-B30M115/Printed in U. S. A.
LM1921 1 Amp Industrial Switch
February 1995
Absolute Maximum Ratings
Internal Power Dissipation
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage
Operating Range
Overvoltage Protection (100 ms)
Internally Limited
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temp. (Soldering, 10 seconds)
4.75V to 26V
b 50V to a 60V
b 40§ C to a 125§ C
150§ C
b 65§ C to a 150§ C
230§ C
Electrical Characteristics (VCC e 12V, IOUT e 500 mA, TJ e 25§ C, VON/OFF e 2V, unless otherwise specified.)
Parameter
Supply Voltage
Operational
Survival
Transient
Supply Current
VON/OFF e 0
VON/OFF e 2V
Input to Output
Voltage Drop
Conditions
Typ
Tested Limits
(Note 1)
Design Limits
(Note 2)
Min
Max
Min
Max
4.75
26
60
6
24
V
VDC
V
1.5
mA
mA
mA
mA
A
b 15
b 50
100 ms, 1% Duty Cycle
IOUT e 0 mA
IOUT e 250 mA
IOUT e 500 mA
IOUT e 1A
0.6
6
285
575
1.3
IOUT e 500 mA
IOUT e 1A
0.5
1.0
Short Circuit Current
1.4
10
350
700
1.5
0.8
1.0
Output Leakage Current
VON/OFF e 0
ON/OFF Voltage
Threshhold
6VsVCCs24V
V
V
2.0
6VsVCCs24V
3.0
A
A
50
mA
0.8
2.0
V
V
26
36
.75
0.1
1.3
ON/OFF Current
15
Overvoltage Shutdown
32
Thermal Resistance
junction-case
case-ambient
ijc
ica
Inductive Clamp
Output Voltage
VON/OFF e 0, IOUT e 100 mA
b 60
Fault Conditions
Output Current
ON/OFF Floating
Ground Floating
Reverse Voltage
Reverse Transient
Overvoltage
Supply Current
Pin 5 Open
Pin 3 & Pin 4 Open
VCC eb15V
VCC eb50V
VCC e a 60V
Pin 1 & Pin 2 Short, No load
0.1
0.1
b 0.01
b 100
0.01
10
0.8
10
Units
2.0
30
mA
3
50
V
§ C/W
§ C/W
b 120
b 45
V
50
50
mA
mA
mA
mA
mA
mA
b1
1
40
Note 1: Guaranteed and 100% production tested.
Note 2: Guaranteed, not necessarily 100% production tested. Not used to calculate outgoing AQL . Limits are for the temperature range of b 40§ C s Tj s 150§ C.
2
Typical Performance Characteristics
Output Voltage Drop
Device Operating Current
TL/H/5271 – 4
TL/H/5271–3
Output Voltage Drop
Output Voltage (VOUT)
TL/H/5271–6
ON/OFF Current vs.
Junction Temperature
TL/H/5271 – 7
Threshold Voltage vs.
Supply Voltage
TL/H/5271–13
TL/H/5271 – 14
Peak Output Current (VOUT)
TL/H/5271 – 5
Maximum Power
Dissipation (TO-220)
TL/H/5271 – 8
ON/OFF Current vs.
ON/OFF Voltage
TL/H/5271 – 15
Equivalent Block Diagram
TL/H/5271 – 12
FIGURE 1
3
TL/H/5271 – 9
Circuit Schematic
4
Application Hints
combined zener and diode breakdown should be less than
45 volts.
HIGH CURRENT OUTPUT
The 1 Amp output is fault protected against overvoltage. If
the supply voltage rises above approximately 30 volts, the
output will automatically shut down. This protects the internal circuitry and enables the IC to survive higher voltage
transients than would otherwise be expected. The 1921 will
survive transients and DC voltages up to 60 volts on the
supply. The output remains off during this time, independent
of the state of the input logic voltage. This protects the load.
The high current output is also protected against short circuits to either ground or supply voltage. Standard thermal
shutdown circuits are employed to protect the 1921 from
over heating.
The LM1921 can be used alone as a simple relay or solenoid driver where a rapid decay of the load current is desired, but the exact rate of decay is not critical to the system. If the output is unclamped as in Figure 1 , and the load
is inductive enough, the negative flyback transient will cause
the output of the IC to breakdown and behave similarly to a
zener clamp. Relying upon the IC breakdown is practical,
and will not damage or degrade the IC in any way. There are
two considerations that must be accounted for when the
driver is operated in this mode. The IC breakdown voltage is
process and lot dependent. Clamp voltages ranging from
b 60 to b 120 volts (with respect to the supply voltage) will
be encountered over time on different devices. This is not at
all critical in most applications. An important consideration,
however, is the additional heat dissipated in the IC as a
result. This must be added to normal device dissipation
when considering junction temperatures and heat sinking
requirements. Worst case for the additional dissipation can
be approximated as:
Additional PD e I2 x L x f (Watts)
FLYBACK RESPONSE
Since the 1921 is designed to drive inductive as well as any
other type of load, inductive kickback can be expected
whenever the output changes state from on to off (see
waveforms on Figure 1 ). The driver output was left unclamped since it is often desirable in many systems to
achieve a very rapid decay in the load current. In applications where this is not true, such as in Figure 2 , a simple
external diode clamp will suffice. In this application, the integrated current in the inductive load is controlled by varying
the duty cycle of the input to the driver IC. This technique
achieves response characteristics that are desirable for certain automotive transmission solenoids, for example.
For applications requiring a rapid controlled decay in the
solenoid current, such as fuel injector drivers, an external
zener and diode can be used as in Figure 3 . The voltage
rating of the zener should be such that it breaks down before the output of the LM1921. The minimum output breakdown voltage of the IC output is rated at b57 volts with
respect to the supply voltage. Thus, on a 12 volt supply, the
I e peak solenoid current (Amps)
L e solenoid inductance (Henries)
f e maximum frequency input signal (Hz)
For solenoids where the inductance is less than ten millihenries, the additional power dissipation can be ignored.
Overshoot, undershoot, and ringing can occur on certain
loads. The simple solution is to lower the Q of the load by
the addition of a resistor in parallel or series with the load. A
value that draws one tenth of the current or DC voltage of
the load is usually sufficient.
where:
TL/H/5271 – 10
TL/H/5271 – 11
FIGURE 2. Diode Clamp
FIGURE 3
Zener clamp for rapid controlled current decay
5
LM1921 1 Amp Industrial Switch
Physical Dimensions inches (millimeters)
5-Lead TO-220 Power Package (T)
Order Number LM1921T
NS Package Number T05A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Europe
Fax: (a49) 0-180-530 85 86
Email: cnjwge @ tevm2.nsc.com
Deutsch Tel: (a49) 0-180-530 85 85
English Tel: (a49) 0-180-532 78 32
Fran3ais Tel: (a49) 0-180-532 93 58
Italiano Tel: (a49) 0-180-534 16 80
National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
National Semiconductor
Japan Ltd.
Tel: 81-043-299-2309
Fax: 81-043-299-2408
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.