TB7004FL TOSHIBA Multi-Chip Module TB7004FL Synchronous Buck Converter Module for High-Current and Low-Voltage Applications The TB7004FL is a synchronous buck converter (step-down chopper) module. A DC-DC converter can be formed by combining the TB7004FL with a PWM control IC, inductors, and input and output capacitors. Features • Operating frequency: up to 1 MHz • Incorporates 5-V regulator (output current: 10 mA.) • VCIN undervoltage lockout (UVLO) In UVLO mode, the GH and GL outputs are set Low and REG5V is set to 0 V. (The internal voltage regulator is shut down.) • Thermal shutdown (TSD) • Low-side MOSFET gate drive voltage: 5 to 12 V (max 16 V) The low-side MOSFET gate drive voltage is supplied externally via VGIN. • DISBL# is a digital input and can receive either a 12-V or 5-V logic High signal. • DISBL#: H = Enables the internal circuitry. L = Disables the internal circuitry and turns off both the high-side and low-side MOSFETs (GH = Low, GL = Low). The internal 5-V regulator remains active. • The PWM input provides for 3-state output control. H: GH = H, GL = L L: GH = L, GL = H If the PWM input stays between the rising and falling threshold voltages for the 200-ns hold-off time, the TB7004FL turns off both the high-side and low-side MOSFETs. Thereafter, setting the PWM input High causes the TB7004FL to resume normal operation. • The internal dead time control circuitry optimizes the switching of the high-side and low-side MOSFETs. • Incorporates boot switch. Charge switch for the bootstrap capacitor (The boot switch behaves like a Schottky barrier diode.) QFN56-P-0808-0.85A Weight: 0.19 g (typ.) Marking #1 pin index TOSHIBA TB7004FL MANUFACTURING CODE MANUFACTURING CODE (10 or 11 characters) Internal management code (may be null) Production week (The first week of the year is 01, and the last week of the year is 52 or 53.) Production year (last digit of the year) Assembly lot code (7 characters) Care should be taken for static electricity when handling this product since it has a MOS structure. 1 2007-11-13 TB7004FL Simplified Block Diagram VCIN BOOT GH VIN 1 14 56 15 High-side MOS tab Driver tab THDN REG5V MOSFET gate driver DISBL# VSWH Low-side MOS tab PWM 28 43 29 42 CGND VGIN (Bottom view) GL PGND Detailed Block Diagram 12 V ± 2 V Up to 19 V REG5V VCIN DISBL# On/Off control GH BOOT Boot switch 5 V Reg. VIN UVLO THDN High-side driver TSD PWM 1.3 V/30 A 3-state control VSWH Dead-time control VGIN 5 to 16 V Low-side driver Driver IC CGND PGND GL Undervoltage Lockout Circuit Output Signal H UVLO Normal operation L VL VH 2 VCIN (V) 2007-11-13 TB7004FL BOOT CGND GH VIN VIN VIN 4 5 6 7 8 9 10 11 12 13 14 15 VIN VCIN 3 VIN VGIN 2 VIN NC 1 VIN CGND Pin Configuration VIN DISBL# 55 16 VIN REG5V 54 17 VIN THDN 53 18 VIN GL 52 19 VIN CGND 51 20 VIN VSWH 50 21 VSWH VSWH 49 22 PGND VSWH 48 23 PGND VSWH 47 24 PGND VSWH 46 25 PGND VSWH 45 26 PGND VSWH 44 27 PGND VSWH 43 28 42 41 40 39 38 37 36 35 34 33 32 31 30 29 PGND CGND VIN PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND VSWH VSWH VSWH PGND 56 VSWH PWM (Bottom View) Pin Description Symbol Pin No. Description CGND 1, 6, 51, Tab Signal ground for control circuitry NC 2 No-connect pin VGIN 3 Power supply for low-side MOSFET gate drive VCIN 4 Power supply for control circuitry BOOT 5 Bootstrap capacitor connection GH 7 High-side MOSFET gate signal VIN 8 to 20, Tab Input pins. Connected to an input of the on-chip the DC-DC converter. Notes Connect to PGND. For monitoring purposes VSWH 21, 40 to 50, Tab Output pins. Output inductor connection PGND 22 to 39 Power ground GL 52 Low-side MOSFET gate signal THDN 53 Open-drain output that indicates that thermal shutdown (TSD) has been tripped. An external pull-up resistor should be added to the THDN pin. Held Low in thermal shutdown mode. REG5V 54 Internal 5-V regulator output DISBL# 55 Disable signal for internal circuitry. Setting DISBL# High enables internal circuitry. Setting DISBL# Low disables internal circuitry. PWM 56 3-state enable input For monitoring purposes 3 Accepts both 5-V and 12-V signals. 2007-11-13 TB7004FL Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VIN 30 V VCIN to CGND voltage VCIN −0.3 to 16 V VSWH to PGND voltage VSWH −2 to 30 V VIN to PGND voltage VGIN to CGND voltage VGIN −0.3 to 16 V BOOT to VSWH voltage VBOOT-VSWH −0.3 to REG5V + 0.3 V BOOT to CGND voltage VBOOT −0.3 to 30 V PWM to CGND voltage VPWM −0.3 to 5.3 V VDISBL# −0.3 to VCIN + 0.3 V VTHDN −0.3 to 6 V Output RMS current IOUT 35 A Operating duty cycle D 70 % IREG5V −10 to 0.1 mA Tpcb = 25°C PD (25) 25 W Tpcb = 110°C PD (110) 8 W Channel temperature Tch −40 to 150 °C Storage temperature Tstg −55 to 150 °C DISBL# to CGND voltage THDN to CGND voltage REG5V current Power dissipation Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 4 2007-11-13 TB7004FL Electrical Characteristics (VCIN = 12 V, VGIN = 5 V, VDISBL# = 12 V, Ta = 25°C, unless otherwise specified) Characteristics Symbol Pin Test Condition Min Typ. Max Unit Operating input voltage VIN (OPR) VIN ⎯ ⎯ ⎯ 19 V Operating input voltage VCIN (OPR) VCIN ⎯ 10 12 14 V Power supply Quiescent current ICIN (OFF) VCIN VDISBL# = 0, VPWM = 0 ⎯ ⎯ 1.3 mA Operating VGIN current IGIN (OPR) VGIN fC = 1 MHz, duty = 10% ⎯ ⎯ 60 mA Undervoltage lockout threshold VUVLO VCIN ⎯ 6.5 7.2 7.9 V Undervoltage lockout hysteresis Vhys-UVLO VCIN ⎯ ⎯ 2.0 ⎯ V PWM input rising threshold VH (PWM) PWM ⎯ 3.2 3.5 3.8 V PWM input falling threshold VL (PWM) PWM ⎯ 1.3 1.5 1.7 V RPWM PWM 33 50 77 kΩ VW (PWM) PWM VL (PWM) ⎯ VH (PWM) V thold PWM ⎯ ns DISBL# input rising threshold VH (DISBL#) DISBL# ⎯ 3.2 3.5 3.8 V DISBL# input falling threshold VL (DISBL#) DISBL# ⎯ 1.3 1.5 1.7 V IDISBL# DISBL# VDISBL# = 0 ⎯ ⎯ 5.0 μA VOUT(REG5V) REG5V IREG5V = −10 mA 4.75 5.0 5.25 V Line regulation Reg ⋅ line REG5V ⎯ ⎯ 20 mV Load regulation Reg ⋅ load REG5V ⎯ ⎯ 20 mV Ttsdn ⎯ 150 ⎯ ⎯ °C PWM signal input PWM input resistance 3-state window 3-state shutdown hold-off time VPWM = 5 V ⎯ VPWM = VW (PWM) ⎯ 200 (Note 1) DISBL# signal input DISBL# input current REG5V output REG5V output voltage IREG5V = −10 mA, VCIN = 10 to 14 V IREG5V = 0 to −10 mA Thermal shutdown Thermal shutdown threshold Thermal shutdown hysteresis THDN output low voltage THDN sink current ⎯ Thys - tsdn ⎯ ⎯ ⎯ 15 ⎯ °C VOUT (THDN) THDN ITHDN = 2 mA ⎯ ⎯ 0.4 V ITHDN THDN ⎯ ⎯ ⎯ 5 mA Note 1: Design target only. Not 100% tested in production. Note 2: Don’t use the TB7004FL after thermal shutdown is tripped, because the thermal shutdown circuitry operates beyond the rated absolute maximum temperature. The thermal shutdown circuitry cannot always protect the device from failure. The device may be permanently damaged before thermal shutdown is tripped, depending on usage conditions. Refer to the description of thermal shutdown on page 13. 5 2007-11-13 TB7004FL Typical Application VIN = 12 V VGIN = 5 V VCIN = 12 V VCIN DISBL# PWM CGND VCIN DISBL# PWM PWM controller CGND VGIN VIN TB7004FL REG5V VSWH PGND VGIN VIN TB7004FL REG5V BOOT BOOT VSWH PGND PWM1 PWM2 PWM3 VCIN PWM4 DISBL# PWM CGND VCIN DISBL# PWM Signal GND Power GND CGND 6 VGIN VIN TB7004FL REG5V VSWH PGND VGIN VIN TB7004FL REG5V BOOT BOOT VSWH VOUT = 1.3 V PGND 2007-11-13 TB7004FL Test Circuit VIN A VGIN A VCIN A IIN ICIN VGIN VCIN V V V VCIN 5 V pulse VIN IGIN DISBL# PWM CGND VGIN VIN BOOT TB7004FL VSWH REG5V Signal GND PGND Power GND Electric load Averaging circuit IOUT Averaging V output voltage VOUT PIN = IIN × VIN + ICIN × VCIN + IGIN × VGIN POUT = IOUT × VOUT Efficiency = POUT/PIN PLOSS = PIN − POUT 7 2007-11-13 TB7004FL Performance Characteristics PLOSS – IOUT PLOSS – VIN 20 16 (W) VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz L = 0.6 μH Power loss PLOSS Power loss PLOSS (W) 20 12 8 4 0 0 4 8 12 16 Output current 20 IOUT 24 28 16 12 IOUT = 30 A 8 IOUT = 25 A 4 0 32 VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz L = 0.6 μH 4 6 (A) 8 Input voltage PLOSS – VOUT 12 IOUT = 30 A 8 IOUT = 25 A 4 0 0.6 1.4 1.8 2.2 2.6 Output voltage VOUT 16 (V) VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V L = 0.6 μH 16 12 IOUT = 30 A 8 IOUT = 25 A 4 1.0 VIN 14 PLOSS – fC (W) 16 12 20 VIN = 12 V VCIN = 12 V VGIN = 5 V fC = 1 MHz L = 0.6 μH Power loss PLOSS Power loss PLOSS (W) 20 10 3.0 3.4 0 200 3.8 (A) 400 600 800 1000 Switching frequency fC 8 1200 1400 1600 (kHz) 2007-11-13 TB7004FL PLOSS – L PLOSS – VGIN 20 16 (W) VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz Power loss PLOSS Power loss PLOSS (W) 20 12 IOUT = 30 A 8 IOUT = 25 A 4 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 16 12 IOUT = 30 A 8 IOUT = 25 A 4 0 1.2 VIN = 12 V VCIN = 12 V VOUT = 1.3 V fC = 1 MHz L = 0.6 μH 4 6 8 Output inductance L (μH) (mA) (mA) Average IGIN Average IGIN VIN=12 V VCIN = 12 V VOUT = 1.3 V IOUT = 0 A L = 0.6 μH 80 300 VGIN = 16 V VGIN = 12 V 60 VGIN = 5 V VGIN = 12 V 40 20 VGIN = 5 V 400 600 800 1000 Switching frequency fC 16 ICIN – fC 400 0 200 14 (V) 100 VIN = 12 V VCIN = 12 V VOUT = 1.3 V IOUT = 0 A L = 0.6 μH 100 12 VGIN IGIN – fC 500 200 10 1200 1400 VGIN = 16 V 0 200 1600 (kHz) 400 600 800 1000 Switching frequency fC 9 1200 1400 1600 (kHz) 2007-11-13 TB7004FL 安全動作範囲 Safe Operting Area 40 平均出力電流 (A) Output current (A) 35 30 25 20 15 10 5 0 0 25 50 75 100 125 150 基板温度 (℃) PCB temperature ( C) o VIN = 12 V, VCIN = 12 V, VGIN = 5 V, VOUT = 1.3 V, fC = 1 MHz, L = 0.6 μH Note: This safe operating area was obtained using the following evaluation board. The safe operating area varies with board conditions. Board conditions Material: FR-4 Number of layers: 4 Copper thickness: 35 μm Board size: 75 mm × 55 mm Board thickness: 2.4 mm 10 2007-11-13 TB7004FL Operational Description Power Supplies VGIN: Power supply for low-side MOSFET gate drive The low-side gate drive voltage can be selected, independent of VCIN. Supply voltage: 5 to 16 V VCIN: Power supply for the internal control circuitry Incorporates undervoltage lockout (UVLO.) UVLO threshold voltage: 7.2 V (typ.) UVLO hysteresis voltage: 2.0 V (typ.) In UVLO mode, the TB7004FL turns off both the high-side and low-side MOSFETs and shuts down the internal 5-V regulator. UVLO Normal operation 7.2 9.2 VCIN (V) DISBL# The DISBL# input enables and disables the MOSFET drivers. H: Normal operation L: Turns off both the high-side and low-side MOSFETs. Rising threshold voltage: 3.5 V (typ.) Falling threshold voltage: 1.5 V (typ.) While the MOSFET drivers are disabled, the 5-V regulator remains active. Disabled Enabled 3.5 1.5 DISBL# (V) PWM Control input for the internal power MOSFET drivers H: Turns on the high-side MOSFET and turns off the low-side MOSFET. L: Turns off the high-side MOSFET and turns on the low-side MOSFET. Rising threshold voltage: 3.5 V (typ.) Falling threshold voltage: 1.5 V (typ.) If the PWM input stays between the rising and falling threshold voltages for the 200-ns hold-off time, the TB7004FL turns off both the high-side and low-side MOSFETs. Thereafter, setting the PWM input High causes the TB7004FL to resume normal operation. 11 2007-11-13 TB7004FL 200 ns 200 ns 3.5 V PWM 1.5 V ON High-side MOSFET OFF ON Low-side MOSFET OFF 200 ns 200 ns 3.5 V PWM 1.5 V ON High-side MOSFET OFF ON Low-side MOSFET OFF Inputs Outputs VCIN DISBL# PWM REG5V High-Side MOSFET Low-Side MOSFET L ⎯ ⎯ OFF OFF OFF H L ⎯ ON OFF OFF H Open ⎯ ON OFF OFF H H L ON OFF ON H H H ON ON OFF 12 2007-11-13 TB7004FL Thermal Shutdown If the integrated driver IC temperature exceeds 165°C, thermal shutdown is tripped. TSD hysteresis: 15°C (typ.) If the integrated MOS chip is the heating source, it takes some time for the overtemperature to be detected at the sensor due to the distance between them. The chip temperature might exceed the TSD threshold before the thermal shutdown circuitry is tripped. In the TSD mode, the TB7004FL turns off both the low-side and high-side MOSFETs and keeps the internal 5-V regulator active. Thermal shutdown Normal operation 135 150 TIC (°C) THDN THDN is an open-drain output that indicates thermal shutdown. An external pull-up resistor should be connected to this pin. During normal operation, the internal switch is off, causing THDN to be High. In thermal shutdown mode, the internal switch is on, causing THDN to be Low. BOOT BOOT is an input pin from which the bootstrap capacitor is charged. The bootstrap capacitor should be connected between this pin and VSWH. While the PWM signal is Low (i.e., the high-side MOSFET is off), the bootstrap capacitor is charged from the internal 5-V regulator. Be sure to use a sufficiently large capacitor. Typical capacitance: > 0.2 μF (VIN = 12 V, VOUT = 1.3 V, fC = 1 MHz) 13 2007-11-13 TB7004FL Package Dimensions Top View Bottom View Side View Weight: 0.19 g (typ.) 14 2007-11-13 TB7004FL Recommended PCB Footprint Unit: mm 7.80 3.55 0.55 14 2.20 0.75 1 56 28 43 0.30 29 0.75 3.50 7.80 0.55 2.25 15 0.75 0.75 42 0.23 0.50 Note On Drypacking After the drypack is opened, the devices should be soldered within 168 hours of exposure to 30°C / 60% RH. 15 2007-11-13 TB7004FL RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 16 2007-11-13