NUF6001MU 6 Line EMI Filter with ESD Protection in UDFN Package This device is a 6 line EMI filter array for wireless applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. The NUF6001MU has a cut−off frequency of 120 MHz and can be used in applications for data rate up to 50 Mbps. This UDFN package is specifically designed to enhance EMI filtering for low−profile or slim design electronics especially where space and height is a premium. It also offers ESD protection clamping transients from static discharges. ESD protection is provided across all capacitors. http://onsemi.com 12 1 • EMI Filtering and ESD Protection Integration of 30 Discrete Components UDFN Package, 1.2 x 2.5 mm Moisture Sensitivity Level 1 ESD Ratings: IEC61000−4−2 (Level 4) Machine Model = C Human Body Model = 3B This is a Pb−Free Device* Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd 11 3 10 4 9 5 8 Benefits • Reduces EMI/RFI Emissions on a Data Line • Low Profile Package; Typical Height of 0.5 mm • Design−Friendly and Easy−to−Use Pin Configurations, 6 7 Particularly for Portable Electronics (Top View) • Integrated Solution Offers Cost and Space Savings in UDFN Package • Excellent S21 Characteristics with very Low Parasitic Inductances • Integrated Solution Improves System Reliability EMI Filtering and ESD Protection for Data Lines Keypad Interface and Protection for Portable Electronics Bottom Connector Interface for Mobile Handsets Notebook Computers and Digital Cameras LCD Display Interface in Mobile Handsets Camera Display Interface in Mobile Handsets MARKING DIAGRAM 12 Applications • • • • • • Cd 2 Features • • • • • Cd 1 UDFN12 MU SUFFIX CASE 517AE 601 M G 601M G 1 = Specific Device Code = Month Code = Pb−Free Package ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 July, 2006 − Rev. 0 1 Device Package Shipping † NUF6001MUT2G UDFN12 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF6001MU/D NUF6001MU MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol ESD Discharge IEC61000−4−2 Value VPP Contact Discharge Unit kV 18 DC Power per Resistor PR 100 mW DC Power per Package PT 600 mW Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Test Conditions Min Typ VBR IR = 1.0 mA 6.0 7.0 Leakage Current IR VRWM = 3.3 V Resistance RA IR = 20 mA Capacitance (Notes 1 and 2) Cd Cut−Off Frequency (Note 3) f3dB Maximum Reverse Working Voltage Breakdown Voltage Symbol Max Unit 5.0 V 8.0 V 10 100 nA 100 115 VR = 2.5 V, f = 1.0 MHz 17 22 pF Above this frequency, appreciable attenuation occurs 120 VRWM 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 85 MHz NUF6001MU 0 0 −10 −10 −20 S41 (dB) S21 (dB) −20 −30 −40 −30 −40 −50 −60 −50 −60 −70 −80 1.0E+6 10E+6 100E+6 1.0E+9 10E+6 10E+9 100E+6 FREQUENCY (Hz) Figure 1. Typical Insertion Loss Curve 10E+9 Figure 2. Typical Analog Crosstalk 2 110 108 106 1.5 RESISTANCE () NORMALIZED CAPACITANCE 1.0E+9 FREQUENCY (Hz) 1 0.5 104 102 100 98 96 94 92 0 0 1 2 3 4 90 −40 5 REVERSE VOLTAGE (V) Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V) −20 0 20 40 TEMPERATURE (°C) 60 80 Figure 4. Typical Resistance over Temperature http://onsemi.com 3 NUF6001MU PACKAGE DIMENSIONS UDFN12, 2.5x1.2, 0.4P CASE 517AE−01 ISSUE O 0.15 C PIN ONE REFERENCE 2X ÉÉ ÉÉ ÉÉ ÇÇ ÉÉ A3 A B D 2X E A1 DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 0.15 C DIM A A1 A3 b D D2 E E2 e K L TOP VIEW (A3) DETAIL A A 0.10 C 12X SEATING PLANE 0.08 C SIDE VIEW D2 12X C A1 MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.00 0.03 0.05 0.127 REF 0.15 0.20 0.25 2.50 BSC 1.70 1.80 1.90 1.20 BSC 0.20 0.30 0.40 0.40 BSC 0.20 −−− −−− 0.20 0.25 0.30 10X e L 1 6 E2 SOLDERING FOOTPRINT* 12X K 12 7 12X BOTTOM VIEW 1.50 b 0.10 C A B 0.05 C 0.40 NOTE 3 0.35 11X 0.30 12 X 0.45 1.95 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NUF6001MU/D