ONSEMI NUF6001MUT2G

NUF6001MU
6 Line EMI Filter with ESD
Protection in UDFN
Package
This device is a 6 line EMI filter array for wireless applications.
Greater than −30 dB attenuation is obtained at frequencies from 800 MHz
to 3.0 GHz. The NUF6001MU has a cut−off frequency of 120 MHz and
can be used in applications for data rate up to 50 Mbps. This UDFN
package is specifically designed to enhance EMI filtering for low−profile
or slim design electronics especially where space and height is a
premium. It also offers ESD protection clamping transients from static
discharges. ESD protection is provided across all capacitors.
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1
•
EMI Filtering and ESD Protection
Integration of 30 Discrete Components
UDFN Package, 1.2 x 2.5 mm
Moisture Sensitivity Level 1
ESD Ratings: IEC61000−4−2 (Level 4)
Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
Cd
11
3
10
4
9
5
8
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Low Profile Package; Typical Height of 0.5 mm
• Design−Friendly and Easy−to−Use Pin Configurations,
6
7
Particularly for Portable Electronics
(Top View)
• Integrated Solution Offers Cost and Space Savings in UDFN Package
• Excellent S21 Characteristics with very Low Parasitic Inductances
• Integrated Solution Improves System Reliability
EMI Filtering and ESD Protection for Data Lines
Keypad Interface and Protection for Portable Electronics
Bottom Connector Interface for Mobile Handsets
Notebook Computers and Digital Cameras
LCD Display Interface in Mobile Handsets
Camera Display Interface in Mobile Handsets
MARKING
DIAGRAM
12
Applications
•
•
•
•
•
•
Cd
2
Features
•
•
•
•
•
Cd
1
UDFN12
MU SUFFIX
CASE 517AE
601
M
G
601M
G
1
= Specific Device Code
= Month Code
= Pb−Free Package
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 0
1
Device
Package
Shipping †
NUF6001MUT2G
UDFN12
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF6001MU/D
NUF6001MU
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
Contact Discharge
Unit
kV
18
DC Power per Resistor
PR
100
mW
DC Power per Package
PT
600
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Test Conditions
Min
Typ
VBR
IR = 1.0 mA
6.0
7.0
Leakage Current
IR
VRWM = 3.3 V
Resistance
RA
IR = 20 mA
Capacitance (Notes 1 and 2)
Cd
Cut−Off Frequency (Note 3)
f3dB
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Max
Unit
5.0
V
8.0
V
10
100
nA
100
115
VR = 2.5 V, f = 1.0 MHz
17
22
pF
Above this frequency,
appreciable attenuation occurs
120
VRWM
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
85
MHz
NUF6001MU
0
0
−10
−10
−20
S41 (dB)
S21 (dB)
−20
−30
−40
−30
−40
−50
−60
−50
−60
−70
−80
1.0E+6
10E+6
100E+6
1.0E+9
10E+6
10E+9
100E+6
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss Curve
10E+9
Figure 2. Typical Analog Crosstalk
2
110
108
106
1.5
RESISTANCE ()
NORMALIZED CAPACITANCE
1.0E+9
FREQUENCY (Hz)
1
0.5
104
102
100
98
96
94
92
0
0
1
2
3
4
90
−40
5
REVERSE VOLTAGE (V)
Figure 3. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
−20
0
20
40
TEMPERATURE (°C)
60
80
Figure 4. Typical Resistance over Temperature
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NUF6001MU
PACKAGE DIMENSIONS
UDFN12, 2.5x1.2, 0.4P
CASE 517AE−01
ISSUE O
0.15 C
PIN ONE
REFERENCE
2X
ÉÉ
ÉÉ
ÉÉ
ÇÇ
ÉÉ
A3
A
B
D
2X
E
A1
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.15 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
(A3)
DETAIL A
A
0.10 C
12X
SEATING
PLANE
0.08 C
SIDE VIEW
D2
12X
C
A1
MILLIMETERS
MIN
NOM MAX
0.45
0.50
0.55
0.00
0.03
0.05
0.127 REF
0.15
0.20
0.25
2.50 BSC
1.70
1.80
1.90
1.20 BSC
0.20
0.30
0.40
0.40 BSC
0.20
−−−
−−−
0.20
0.25
0.30
10X
e
L
1
6
E2
SOLDERING FOOTPRINT*
12X
K
12
7
12X
BOTTOM VIEW
1.50
b
0.10 C A B
0.05 C
0.40
NOTE 3
0.35
11X
0.30
12 X
0.45
1.95
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF6001MU/D