NLAS325 Dual SPST Analog Switch, Low Voltage, Single Supply The NLAS325 is a dual SPST (Single Pole, Single Throw) switch, similar to 1/2 a standard 4066. The device permits the independent selection of 2 analog/digital signals. Available in the Ultra–Small 8 package. The use of advanced 0.6 µ CMOS process, improves the RON resistance considerably compared to older higher voltage technologies. • • • • • • • • • • • On Resistance is 20 Ω Typical at 5.0 V Matching is < 1 Ω Between Sections 2 – 6 V Operating Range Ultra Low < 5 pC Charge Injection Ultra Low Leakage < 1 nA at 5.0 V, 25 C Wide Bandwidth > 200 MHz, –3 dB CMOS/TTL Compatible 2000 V ESD (HBM) Ron Flatness +/– 6 Ω at 5.0 V US8 Package Independent Enables; One Positive, One Negative http://onsemi.com MARKING DIAGRAM 8 8 1 L7 US8 US SUFFIX CASE 493 D 1 L7 = Device Code D = Date Code PIN ASSIGNMENT 1 NO1 COM1 1 8 2 7 VCC IN1 IN2 3 6 COM2 GND 4 5 NC2 NO1 2 COM1 3 IN2 4 GND 5 NC2 6 COM2 7 IN1 8 VCC FUNCTION TABLE Figure 1. Pinout On/Off Enable Input Analog Switch 1 Analog Switch 2 L H Off On On Off ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Semiconductor Components Industries, LLC, 2002 January, 2002 – Rev. 2 1 Publication Order Number: NLAS325/D NLAS325 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) 260 C 150 C 250 C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V–0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow. 2. Tested to EIA/JESD22–A114–A. 3. Tested to EIA/JESD22–A115–A. 4. Tested to JESD22–C101–A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 5.5 V VCC DC Supply Voltage VIN Digital Select Input Voltage GND 5.5 V VIS Analog Input Voltage (NC, NO, COM) GND VCC V TA Operating Temperature Range 55 125 C tr, tf Input Rise or Fall Time, SELECT 0 0 100 20 ns/V VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80C 117.8 419,300 TJ = 90C 1,032,200 90 TJ = 100C 80 TJ = 110C Time, Years TJ = 120C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 2. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 NLAS325 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) Guaranteed Limit Symbol VIH VIL Parameter Condition Minimum High–Level Input Voltage, Select Inputs Maximum Low–Level Input Voltage, Select Inputs IIN Maximum Input Leakage Current, Select Inputs VIN = 5.5 V or GND ICC Maximum Quiescent Supply Current Select and VIS = VCC or GND VCC 55C to 25C 85C 125C Unit 2.0 1.5 1.5 1.5 V 2.5 1.9 1.9 1.9 3.0 2.1 2.1 2.1 4.5 3.15 3.15 3.15 5.5 3.85 3.85 3.85 2.0 0.5 0.5 0.5 2.5 0.6 0.6 0.6 3.0 0.9 0.9 0.9 4.5 1.35 1.35 1.35 V 5.5 1.65 1.65 1.65 0 V to 5.5 V 0.2 2.0 2.0 A 5.5 4.0 4.0 8.0 A DC ELECTRICAL CHARACTERISTICS – Analog Section Guaranteed Limit Symbol RON Parameter Maximum “ON” Resistance (Figures 16 – 22) Condition VIN = VIL or VIH VIS = GND to VCC IINI 10.0 mA VCC 55C to 25C 85C 125C Unit 2.5 85 95 105 3.0 45 50 55 4.5 30 35 40 5.5 25 30 35 RFLAT (ON) ON Resistance Flatness (Figures 16 – 22) VIN = VIL or VIH IINI 10.0 mA VIS = 1 V, 2 V, 3.5 V 4.5 4 4 5 INC(OFF) INO(OFF) NO or NC Off Leakage Current (Figure 8) VIN = VIL or VIH VNO or VNC = 1.0 VCOM 4.5 V 5.5 1 10 100 nA ICOM(ON) COM ON Leakage Current (Figure 8) VIN = VIL or VIH VNO 1.0 V or 4.5 V with VNC floating or VNO 1.0 V or 4.5 V with VNO floating VCOM = 1.0 V or 4.5 V 5.5 1 10 100 nA http://onsemi.com 3 NLAS325 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Maximum Limit Symbol tON tOFF tBBM Turn–On Time (Figures 11 and 12) Turn–Off Time (Figures 11 and 12) Minimum Break–Before–Make Time 55C to 25C 85C 125C VCC VIS Test Conditions (V) (V) Min Typ* Max Min Max Min Max Unit RL = 300 CL = 35 pF (Figures 4 and 5) 2.5 2.0 5 23 35 5 38 5 41 ns 3.0 2.0 5 16 24 5 27 5 30 4.5 3.0 2 11 16 2 19 2 22 5.5 3.0 2 9 14 2 17 2 20 2.5 2.0 1 7 12 1 15 1 18 3.0 2.0 1 5 10 1 13 1 16 4.5 3.0 1 4 6 1 9 1 12 5.5 3.0 1 3 5 1 8 1 11 2.5 2.0 1 12 1 1 3.0 2.0 1 11 1 1 4.5 3.0 1 6 1 1 5.5 3.0 1 5 1 1 Parameter RL = 300 CL = 35 pF (Figures 4 and 5) VIS = 3.0 V (Figure 3) RL = 300 CL = 35 pF ns ns *Typical Characteristics are at 25C. Typical @ 25, VCC = 5.0 V CIN CNO or CNC CCOM C(ON) Maximum Input Capacitance, Select Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) 8 pF 10 10 20 ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) Symbol BW VONL VISO Q THD VCT Parameter Condition VCC Typical V 25°C Unit MHz Maximum On–Channel –3dB Bandwidth or Minimum Frequency Response (Figure 10) VIN = 0 dBm VIN centered between VCC and GND (Figure 6) 3.0 145 4.5 170 5.5 175 Maximum Feedthrough On Loss VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 6) 3.0 2 4.5 2 5.5 2 f = 100 kHz; VIS = 1 V RMS VIN centered between VCC and GND (Figure 6) 3.0 93 4.5 93 5.5 93 3.0 1.5 5.5 3.0 5.5 0.1 5.5 90 3.0 90 Off–Channel Isolation (Figure 9) Charge Injection Select Input to Common I/O (Figure 14) VIN = VCC to GND, FIS = 20 kHz tr = tf = 3 ns RIS = 0 , CL = 1000 pF Q = CL * VOUT (Figure 7) Total Harmonic Distortion THD + Noise (Figure 13) FIS = 20 Hz to 100 kHz, RL = Rgen = 600 , CL = 50 pF VIS = 5.0 VPP sine wave Channel–to–Channel Crosstalk f = 100 kHz; VIS = 1 V RMS VIN centered between VCC and GND (Figure 6) http://onsemi.com 4 dB dB pC % dB NLAS325 VCC DUT VCC Input Output GND VOUT 0.1 F 300 Ω tBMM 35 pF 90% of VOH 90% Output Switch Select Pin GND Figure 3. tBBM (Time Break–Before–Make) VCC DUT VCC 0.1 F 50% Input Output VOUT Open 50% 0V 300 Ω VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 4. tON/tOFF VCC VCC 50% Input DUT Output 0V 300 Ω VOUT Open 50% VOH 35 pF Output Input tOFF Figure 5. tON/tOFF http://onsemi.com 5 10% 10% VOL tON NLAS325 50 Ω DUT Reference Transmitted Input Output 50 Ω Generator 50 Ω Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VVOUT for VIN at 100 kHz IN VOUT for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off On VIN Figure 7. Charge Injection: (Q) 100 LEAKAGE (nA) 10 1 ICOM(ON) 0.1 ICOM(OFF) 0.01 VCC = 5.0 V INO(OFF) 0.001 –55 –20 25 70 85 TEMPERATURE (°C) Figure 8. Switch Leakage vs. Temperature http://onsemi.com 6 125 Off ∆VOUT NLAS325 +15 0 1.0 2.0 –20 +10 Bandwidth (ON–RESPONSE) +5 3.0 0 PHASE SHIFT 4.0 –40 (dB) (dB) Off Isolation –60 VCC = 5.0 V TA = 25C –80 –100 0.01 0.1 –10 6.0 –15 7.0 –20 8.0 –25 9.0 10.0 0.01 100 200 1 10 FREQUENCY (MHz) –5 5.0 PHASE (°) 0 VCC = 5.0 V TA = 25°C –30 0.1 1 –35 100 300 10 FREQUENCY (MHz) Figure 9. Off–Channel Isolation Figure 10. Typical Bandwidth and Phase Shift 30 30 25 25 20 20 TIME (ns) TIME (ns) VCC = 4.5 V 15 tON (ns) 10 tOFF (ns) 5 0 2.5 3 3.5 4 4.5 10 tON 5 tOFF 0 –55 5 –40 85 25 125 VCC (VOLTS) Temperature (°C) Figure 11. tON and tOFF vs. VCC at 25C Figure 12. tON and tOFF vs. Temp 1 3.0 VINpp = 3.0 V VCC = 3.6 V 2.5 2.0 Q (pC) THD + NOISE (%) 15 0.1 VINpp = 5.0 V VCC = 5.5 V VCC = 5 V 1.5 1.0 0.5 VCC = 3 V 0 –0.5 0.01 1 10 100 0 1 2 3 4 FREQUENCY (kHz) VCOM (V) Figure 13. Total Harmonic Distortion Plus Noise vs. Frequency Figure 14. Charge Injection vs. COM Voltage http://onsemi.com 7 5 NLAS325 100 100 VCC = 2.0 V 10 80 RON (Ω) ICC (nA) 1 0.1 0.01 60 VCC = 2.5 V 40 VCC = 3.0 V 0.001 VCC = 3.0 V VCC = 4.0 V 20 0.0001 VCC = 5.0 V 0.00001 –40 –20 0 20 60 VCC = 5.5 V 80 100 0 0.0 120 3.0 4.0 5.0 VIS (VDC) Figure 15. ICC vs. Temp, VCC = 3 V & 5 V Figure 16. RON vs. VCC, Temp = 25C 90 90 80 80 70 70 60 60 RON (Ω) 100 RON (Ω) 2.0 Temperature (°C) 100 50 40 125°C 30 20 40 25°C –55°C 10 85°C 0.5 50 20 –55°C 10 6.0 30 25°C 0 0.0 1.0 1.0 1.5 2.0 0 0.0 2.5 85°C 125°C 0.5 1.0 1.5 VIS (VDC) 2.0 2.5 3.0 VIS (VDC) Figure 17. RON vs Temp, VCC = 2.0 V Figure 18. RON vs. Temp, VCC = 2.5 V 50 30 45 25 40 20 30 RON (Ω) RON (Ω) 35 25 20 125°C 10 15 0 0.0 25°C 85°C 10 5 15 5 25°C 85°C 125°C –55°C –55°C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VIS (VDC) VIS (VDC) Figure 20. RON vs. Temp, VCC = 4.5 V Figure 19. RON vs. Temp, VCC = 3.0 V http://onsemi.com 8 4.5 NLAS325 25 25 125°C 20 20 RON (Ω) RON (Ω) 125°C 15 25°C 10 –55°C 85°C 25°C 10 –55°C 85°C 5 0 0.0 15 5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.0 VIS (VDC) VIS (VDC) Figure 21. RON vs. Temp, VCC = 5.0 V Figure 22. RON vs. Temp, VCC = 5.5 V DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Technology Device Function Package Suffix Package Type Tape and Reel Size NL AS 325 US US8 178 mm (7″) 3000 Unit NLAS325US CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 23. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.25 0.30 8.00 + – 0.10 1 1.00 ± 0.25 TYP DIRECTION OF FEED Figure 24. US8 Reel Configuration/Orientation http://onsemi.com 9 NLAS325 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm 0.2 mm (0.512 in 0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 25. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm US 178 mm (7 in) 8.4 mm, + 1.5 mm, –0.0 (0.33 in + 0.059 in, –0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 26. Reel Winding Direction http://onsemi.com 10 HOLE NLAS325 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0. 0203 MM. (300-800 INCH). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002"). –X– A 8 J –Y– 5 DETAIL E B L 1 4 R S G P U C –T– SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M T X Y R 0.10 TYP V M F DETAIL E 3.8 0.5 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.8 TYP 1.0 http://onsemi.com 11 0.3 TYP (mm) DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.28 0.44 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.011 0.017 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NLAS325 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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