ONSEMI NLAS7222A

NLAS7222A
High−Speed USB 2.0
(480 Mbps) DPDT Switch
ON Semiconductor’s NLAS7222A series of analog switch circuits
are produced using the company’s advanced sub−micron CMOS
technology, achieving industry−leading performance.
The NLAS7222A is a 2− to 1−port analog switch. Its wide
bandwidth and low bit−to−bit skew allow it to pass high−speed
differential signals with good signal integrity. The switch is
bidirectional and offers little or no attenuation of the high−speed
signals at the outputs. Industry−leading advantages include a
propagation delay of less than 250 ps, resulting from its low channel
resistance and low I/O capacitance. Its high channel−to−channel
crosstalk rejection results in minimal noise interference. Its bandwidth
is wide enough to pass High−Speed USB 2.0 differential signals
(480 Mb/s).
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MARKING
DIAGRAM
•
•
•
•
•
•
•
XX M G
G
UQFN−10
CASE 488AT
XX M G
G
1
Features
•
•
•
•
WQFN−10
CASE 488AQ
1
RON is Typically 6.5 at VCC = 3 V
Low Bit−to−Bit Skew: Typically 50 ps
OVT on D+ and D− up to 3.6 V
Power OFF Protection:
When VCC = 0 V, D+ and D− Can Tolerate up to 3.6 V
Low Crosstalk: −45 dB @ 250 MHz
Low Current Consumption: 1 A
Near−Zero Propagation Delay: 250 ps
Channel On−Capacitance: 6.5 pF (Typical)
VCC Operating Range: +3.0 V to +3.6 V
> 700 MHz Bandwidth (or Data Frequency)
This is a Pb−Free Device
XX
=
Device Code
xx = 2A or Y
= Date Code
M
G
= Pb−Free Device
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Typical Applications
• Differential Signal Data Routing
• USB 2.0 Signal Routing
Important Information
• Continuous Current Rating Through Each Switch ±50 mA
• 8 kV I/O to GND ESD Protection
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 1
1
Publication Order Number:
NLAS7222A/D
NLAS7222A
HSD1−
7
HSD2−
Table 1. PIN DESCRIPTION
6
Pin
Function
S
OE
8
VCC
9
S
10
5
CONTROL
1
2
HSD1+
HSD2+
D−
Select Input
OE
4
GND
3
D+
Output Enable
HSD1+, HSD1−, HSD2+,
HSD2−, D+, D−
Data Ports
Table 2. TRUTH TABLE
OE
S
HSD1+,
HSD1−
HSD2+,
HSD2−
1
0
0
X
0
1
OFF
ON
OFF
OFF
OFF
ON
Figure 1. Pin Connections and Logic Diagram
(Top View)
MAXIMUM RATINGS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIS
Analog Switch Input Voltage
HSD1+, HSD1−, HSD2+, HSD2−
D+, D−
VIN
Digital Select Input Voltage
ID
PD
TS
Storage Temperature
ESD
Human Body Model
I/O to GND
All Pins
Value
Unit
−0.5 to +4.6
V
V
−0.5 to VCC + 0.3
−0.5 to +4.6
−0.5 to +4.6
V
Continuous DC Current (Through Analog Switch)
50
mA
Power Dissipation
0.5
W
−65 to +150
°C
kV
8
2
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
3.0
3.6
V
VCC
V
VCC
Positive DC Supply Voltage
VIS
Analog I/O Voltage (HSD1+, HSD1−, HSD2+, HSD2−)
GND
VOS
Analog Common Output Voltage (D+, D−)
GND
3.6
V
VIN
Digital Select Input Voltage
GND
VCC
V
TA
Operating Temperature Range
−40
+85
°C
tr, tf
Input Rise or Fall Time
0
15
ns
VCC = 3.3 V ± 0.3 V
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2
NLAS7222A
DC ELECTRICAL CHARACTERISTICS FOR USB 2.0 SWITCHING OVER OPERATIONAL RANGE
−40°C to +85°C
Symbol
Parameter
Test Conditions
VCC (V)
Min
Typ
(Note 1)
Max
Unit
VIH
Input HIGH Voltage (VIN)
3.0 to 3.6
1.3
−
−
V
VIL
Input LOW Voltage (VIN)
3.0 to 3.6
−
−
0.5
V
VIK
Clamp Diode Voltage
IIS = −18 mA
3.0
−
−
−1.2
V
ICC
Quiescent Supply Current
VIS = VCC or GND; ID = 0 A
3.6
−
−
1.0
A
ICCT
Increase in ICC per
Control Voltage
VIN = 2.6 V
3.6
−
−
10.0
A
II
Input Leakage Current
0 ≤ VIS ≤ VCC
3.6
−
−
±1.0
A
IOZ
OFF State Leakage
0 ≤ VIS; VOS ≤ VCC
3.6
−
−
±1.0
A
IOFF
Power OFF Leakage Current
(D+, D−)
0 ≤ VIS; VOS ≤ VCC
0
−
−
±1.0
A
RON
Switch On−Resistance
VIS = 0 to 0.4 V; ID = 8 mA
3.0
−
6.5
9.0
RFLAT(ON)
On−Resistance Flatness
VIS = 0 to 1.0 V; ID = 8 mA
3.0
−
2.0
−
RON
On−Resistance match from
center ports to any other ports
VIS = 0 to 0.4 V; ID = 8 mA
3.0
−
0.35
−
1. Typical values are at VCC = 3.3 V and TA = +25°C
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
Parameter
Test Conditions
VCC (V)
Min
Typ
(Note 2)
Max
Unit
tON
Turn−ON Time
VIS = 0.8 V
3.0 to 3.6
−
13.0
30.0
ns
tOFF
Turn−OFF Time
VIS = 0.8 V
3.0 to 3.6
−
12.0
25.0
ns
tBBM
Break−Before−Make Delay
VIS = 0.8 V
3.0 to 3.6
2.0
4.7
6.5
ns
Propagation Delay
CL = 10 pF
3.0 to 3.6
−
0.25
−
ns
OIRR
tPD
OFF−Isolation
f = 250 MHz; RL = 50 3.0 to 3.6
−
−28
−
dB
XTALK
Non−Adjacent Channel Crosstalk
f = 250 MHz; RL = 50 3.0 to 3.6
−
−45
−
dB
−3 dB Bandwidth
RL = 50 ; CL = 0 pF
−
700
−
MHz
−
500
−
BW
RL = 50 ; CL = 5 pF
3.0 to 3.6
AC ELECTRICAL CHARACTERISTICS FOR USB 2.0 SWITCHING OVER OPERATIONAL RANGE
tSK(O)
TJITTER
Channel−to−Channel Skew
CL = 10 pF
3.0 to 3.6
−
0.05
−
ns
Total Jitter
RL = 50 ; CL = 10 pF
tr = tf = 500 ps at 480 Mbps
3.0 to 3.6
−
0.2
−
ns
2. Typical values are at VCC = 3.3 V and TA = +25°C
CAPACITANCE
−405C to +855C
Symbol
Parameter
Test Conditions
Min
Typ
(Note 3)
Max
Unit
CIN
Control Pin Input Capacitance
VCC = 0 V
−
4.5
−
pF
CON
HSD+, HSD− ON Capacitance
VCC = 3.3 V; OE = 0 V
−
14
−
pF
COFF
HSD+, HSD− OFF Capacitance
VCC = VIS = 3.3 V; OE = 3.3 V
−
12
−
pF
3. Typical values are at VCC = 3.3 V and TA = +25°C
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3
NLAS7222A
VCC
DUT
VCC
Input
Output
GND
VOUT
0.1 F
50 35 pF
tBMM
Output
50 % OF
DROOP
VOLTAGE
DROOP
Switch Select Pin
Figure 2. tBBM (Time Break−Before−Make)
VCC
Input
DUT
VCC
0.1 F
50%
Output
VOUT
Open
50%
0V
50 VOH
90%
35 pF
90%
Output
VOL
Input
tON
tOFF
Figure 3. tON/tOFF
VCC
VCC
Input
DUT
Output
50 50%
0V
VOUT
Open
50%
VOH
35 pF
Output
Input
tOFF
Figure 4. tON/tOFF
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4
10%
10%
VOL
tON
NLAS7222A
50 DUT
Reference
Transmitted
Input
Output
50 Generator
50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss
is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction.
ǒVVOUT
Ǔ for VIN at 100 kHz
IN
VOUT
Ǔ for VIN at 100 kHz to 50 MHz
VONL = On Channel Loss = 20 Log ǒ
VIN
VISO = Off Channel Isolation = 20 Log
Bandwidth (BW) = the frequency 3 dB below VONL
VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/VONL
DUT
VCC
VIN
Output
Open
GND
CL
Output
Off
VIN
Figure 6. Charge Injection: (Q)
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5
On
Off
VOUT
NLAS7222A
APPLICATIONS INFORMATION
(www.usb.org), the industry group responsible for defining
the USB certification requirements. The test patterns were
generated by a PC and MATLAB software, and were
inputted to the analog switch through USB connectors J1
(HSD1) or J2 (HSD2). A USB certified device was plugged
into connector J4 to function as a data transceiver. The high
speed and full speed tests used a flash memory device, while
the low speed tests used a mouse. Test connectors J3 and J5
provide a direct connection of the USB device and were used
to verify that the analog switch does not distort the data
signals.
The low on resistance and capacitance of the
NLAS7222A provides for a high bandwidth analog switch
suitable for applications such as USB data switching.
Results for the USB 2.0 signal quality tests will be shown in
this section, along with a description of the evaluation test
board. The data for the eye diagram signal quality and jitter
tests verifies that the NLAS7222A can be used as a data
switch in low, full and high speed USB 2.0 systems.
Figures 7, 8 and 9 provide a description of the test
evaluation board. The USB tests were conducted per the
procedures provided by the USB Implementers Forum
Figure 7. Schematic of the NLAS7222A USB Demo Board
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6
NLAS7222A
Figure 8. Block Diagram of the NLAS7222A USB Demo Board
Figure 9. Photograph of the NLAS7222A USB Demo Board
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7
NLAS7222A
AND8267/D – NLAS7222A USB 2.0 Signal Quality Compliance Tests
Figures 10, 11 and 12 show the test results for USB eye
diagram tests. A summary of the USB tests is provided in
Table 3. The NLAS7222A passes the low, full and high
speed signal quality, eye diagram and jitter tests.
Application note AND8267/D provides a detailed
description of the USB 2.0 test results.
Figure 10. Low Speed Signal Quality Eye Diagram Test (NLAS7222A with VCC = 3.6 V)
Figure 11. Full Speed Signal Quality Eye Diagram Test (NLAS7222A with VCC = 3.6 V)
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8
NLAS7222A
Figure 12. High Speed Signal Quality Eye Diagram Test (NLAS7222A with VCC = 3.0 V)
Table 3. Summary of the USB 2.0 Signal Quality Tests Results
Compliance Test
Low Speed
Full Speed
High Speed
Signal Quality Test
Pass
Pass
Pass
Signal Eye Test
Pass
Pass
Pass
EOP Width
1.29 ms
166.86 ns
7.98 bits
Measured Signal Rate
1.5140 MHz
12.0016 MHz
480.0685 MHz
Crossover Voltage Range
1.75 to 1.83 V,
mean crossover = 1.78 V
1.70 to 1.73 V,
mean crossover = 1.71 V
N/A
Connective Jitter Range
−2.2 to 2.2 ns,
RMS jitter = 1.3 ns
−0.2 to 0.2 ns,
RMS jitter = 0.1 ns
−79.4 to 77.4 ps,
RMS jitter = 35.0 ps
Paired JK Jitter Range
−1.4 to 2.7 ns,
RMS jitter = 1.3 ns
−0.1 to 0.1 ns,
RMS jitter = 0.1 ns
−93.2 to 78.7 ps,
RMS jitter = 24.4 ps
Paired KJ Jitter Range
−1.9 to 1.1 ns,
RMS jitter = 1.0 ns
−0.2 to 0.1 ns,
RMS jitter = 0.1 ns
−72.8 to 50.9 ps,
RMS jitter = 15.6 ps
ORDERING INFORMATION
Device
Package
NLAS7222AMTR2G
WQFN−10
(Pb−Free)
NLAS7222AMUR2G
UQFN−10
(Pb−Free)
Shipping†
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
NLAS7222A
PACKAGE DIMENSIONS
WQFN10, 1.4x1.8x0.4P
CASE 488AQ−01
ISSUE B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN 1 REFERENCE
2X
2X
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
A
E
0.15 C
DIM
A
A1
A3
b
D
E
e
L
L1
B
A
0.10 C
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.050
0.20 REF
0.15
0.25
1.40 BSC
1.80 BSC
0.40 BSC
0.30
0.50
0.40
0.60
A1
A3
3
9X
5
C
SOLDERING FOOTPRINT*
e/2
1.700
0.0669
L
6
e
1
0.663
0.0261
0.200
0.0079
10
L1
10 X
b
0.10 C A B
0.05 C
9X
0.563
0.0221
1
2.100
0.0827
NOTE 3
0.400
0.0157
PITCH
10 X
0.225
0.0089
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
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10
NLAS7222A
PACKAGE DIMENSIONS
10 PIN UQFN, 1.4x1.8, 0.4P
CASE 488AT−01
ISSUE O
ÉÉÉ
ÉÉÉ
ÉÉÉ
D
PIN 1 REFERENCE
2X
2X
0.10 C
E
0.10 C
DIM
A
A1
b
D
E
e
L
L3
B
0.05 C
10X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
A
0.05 C
A1
C
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.15
0.25
1.40 BSC
1.80 BSC
0.40 BSC
0.30
0.50
0.40
0.60
MOUNTING FOOTPRINT*
SEATING
PLANE
1.700
0.0669
3
9X
5
0.663
0.0261
e/2
L
6
10
L3
0.200
0.0079
e
1
10 X
b
1
2.100
0.0827
0.10 C A B
0.05 C
9X
0.563
0.0221
NOTE 3
0.400
0.0157
PITCH
10 X
0.225
0.0089
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your local
Sales Representative
NLAS7222A/D