ONSEMI NCN1188

NCN1188
3:1 High Speed USB Switch
with Audio and MHL
Capability
The NCN1188 allows portable systems to share a single USB 2.0 or
3.0 receptacle to transmit and receive paired signals from three
separate locations. All of the three differential channels are compliant
to High Speed USB 2.0, Full Speed USB 1.1, Low Speed USB 1.0 and
any generic UART protocol. The two dedicated high speed data paths
also support Mobile High Definition Link (MHL) video up to 720p,
60fps and 1080i, 30fps. The multi−purpose audio path is capable of
passing signals with negative voltages as low as 2 V below ground and
features shunt resistors to reduce Pop and Click noise in the audio
system. The NCN1188 is housed in a space saving, ultra low profile
2.0 x 1.7 x 0.5 mm, 12 pins UQFN package.
Features
•
•
•
•
•
•
•
•
•
High Bandwidth of 1.8 GHz
VCC Operating Range from 2.7 V to 5.5 V
VIS Signal from 0 V to 3.7 V for Data Transfer
VIS Signal from −2 V to 2 V for Stereo Headphone Connection
Audio Shunt resistor for Pop & Click Noise Reduction
VIO Control Pins Compatible to 1.8V Interfaces
Low Power Consumption of 23 mA
Small UQFN 2.0 x 1.7 x 0.5 mm Package
These Devices are Pb−Free and are RoHS Compliant
•
•
•
•
•
USB 2.0 / 3.0 Micro−B Applications
USB to HDMI Video Interfaces via MHL
Features Phones and Smart Phones
Digital Cameras
Handset Media Players
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MARKING
DIAGRAM
UQFN12
MU SUFFIX
CASE 523AE
1
AGM
G
AG = Specific Device Code
M = Date Code
G
= Pb−Free Package
PIN ASSIGNMENTS
Typical Applications
(Top View)
ORDERING INFORMATION
Device
Package
Shipping†
NCN1188MUTAG
UQFN12
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Figure 1. NCN1188 Typical Application Schematic
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 1
1
Publication Order Number:
NCN1188/D
NCN1188
NCN1188 TRUTH TABLE
IN1
IN2
Shunt
Hi−Z
Function
0
0
Enable
DN / DP
0
1
Enable
AUDN / AUDP
1
0
Disable
HDN / HDP
1
1
Enable
SIMPLIFIED BLOCK DIAGRAM
D+
VCC
IN1
IN2
D−
Charge
Pump
Logic
Control
DN
DP
HDN
HDP
AUDN
AUDP
GND
Figure 2. Simplified Block Diagram
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NCN1188
PIN DIAGRAM
Figure 3. Pin Assignments (Top View)
PIN DESCRIPTION
Name
Pin
Description
DP
1
USB Positive Path. If active, this pin is connected to D+ pin.
HDP
2
HD Positive Path. If active, this pin is connected to D+ pin.
VCC
3
Analog Supply. This pin is the analog and digital supply of the device. A 100 nF ceramic capacitor or
larger must bypass this input to the ground. This capacitor should be placed as close a possible to this
input.
HDN
4
HD Negative Path. If active, this pin is connected to D− pin.
DN
5
USB Negative Path. If active, this pin is connected to D− pin.
AUDN
6
Audio N. If active, this pin is connected to D− pin.
IN2
7
Input Selection 2. Do not float this pin.
D−
8
Negative data line. Must be connected to the D− pin of USB receptacle.
GND
9
Ground Reference. Must be connected to the system ground.
D+
10
Positive data line. Must be connected to the D+ pin of USB receptacle.
IN1
11
Input Selection 1. Do not float this pin.
AUDP
12
Audio P. If active, this pin is connected to D+ pin.
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NCN1188
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Maximum Supply Voltage Range on VCC pin
VCCMAX
− 0.3 to 6.0
V
Maximum Analog Signal Voltage Range on DN, DP, HDN, HDP pins
VISMAX
− 0.3 to 5.5
V
Maximum Analog Signal Voltage Range on D+, D− pins
VCOMMAX
− 2.5 to 5.5
V
Maximum Analog Signal Voltage Range on IN1, IN2 pins
VIOMAX
−0.3 to VCC+ 0.3
V
VAUDMAX
−2.5 to VCC+ 0.3
V
Maximum Analog Signal Voltage Range on AUDN, AUDP pins
Latch up Current (Note 2)
ILU
±100
mA
Human Body Model (HBM) ESD Rating (Note 3)
ESD HBM
4000
V
Machine Model (MM) ESD Rating (Note 3)
ESD MM
100
V
Maximum Junction Temperature
TJMAX
+150
°C
Storage Temperature Range
TSTG
−55 to + 150
°C
Moisture Sensitivity (Note 4)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±4.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±100 V per JEDEC standard: JESD22−A115 for all pins.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.7
−
5.5
V
0
−2.0
−
−
3.7
2.0
V
VOLTAGE RANGES
VCC
VCC pin operating range
VIS
Analog Signal Voltage range (Note 5)
High Speed Data
Audio
TEMPERATURE RANGES
TA
Operating Ambient Temperature
−40
−
85
°C
TJ
Operating Junction Temperature
−40
−
125
°C
5. If the audio channel is not in use, it is recommended that no signals are applied on the audio inputs AUDN and AUDP
ELECTRICAL CHARACTERISTICS
Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V,
TA = +25°C (unless otherwise noted).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
VCC = 4.2 V, IIS = 0
−
23
35
mA
CURRENT CONSUMPTION
ICC
Product Supply Current
CONTROL LOGIC (IN1, IN2 pins)
VIL
Low Voltage Input Threshold
VCC = 2.7 V
VCC = 3.6 V
VCC = 4.2 V
−
−
−
−
−
−
0.4
0.4
0.4
V
VIH
High Voltage Input Threshold
VCC = 2.7 V
VCC = 3.6 V
VCC = 4.2 V
1.3
1.4
1.5
−
−
−
−
−
−
V
Voltage Input Hysteresis
−
250
−
mV
Leakage Current
−
−
±100
nA
VIHYS
IIN
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NCN1188
ELECTRICAL CHARACTERISTICS
Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V,
TA = +25°C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On Resistance
VCC = 3.0 V
VIS from 0 V to 2.4 V, IIS = 15 mA
−
5
7.5
W
RON_MAT
On Resistance Matching
VCC = 3.0 V
VIS from 0 V to 1.7 V, IIS = 15 mA
−
0.09
−
W
RON_FLT
On Resistance Flatness
VCC = 3.0 V
VIS from 0 V to 1.7 V, IIS = 15 mA
−
0.06
−
W
ISW_OFF
Off State Leakage
VCC = 3.6 V
VIS From 0 V to 3.6 V
−
−
200
nA
ISW_ON
On State Leakage
VCC = 3.6 V
VIS From 0 V to 3.6 V
−
−
±200
nA
DATA SWITCHES DC CHARACTERISCTICS
RON
DATA SWITCHES AC CHARACTERISTICS
CON
Equivalent On Capacitance
Switch ON, f = 1 MHz
−
4.5
−
pF
COFF
Equivalent Off Capacitance
Switch OFF, f = 1 MHz
−
3
−
pF
Differential Insertion Loss
f = 10 MHz
f = 800 MHz
f = 1.1 GHz
−
−0.5
−1.8
−2.1
−
dB
DISO
Differential Off Isolation
f = 10 MHz
f = 800 MHz
f = 1.1 GHz
−
−53
−19
−18
−
dB
DCTK
Differential Crosstalk
f = 10 MHz
f = 800 MHz
f = 1.1 GHz
−
−55
−20
−18
−
dB
From VCC onto D+ / D−
f = 217 Hz, RL = 50 W
−
90
−
dB
On Resistance
VCC = 3.0 V
VIS from −2.0 V to 2.0 V, IIS =
50 mA
−
3
5
W
RON_MAT
On Resistance Matching
VCC = 3.0 V
VIS from −2.0 V to 2.0 V, IIS =
50 mA
−
0.04
−
W
RON_FLT
On Resistance Flatness
VCC = 3.0 V
VIS from −2.0 V to 2.0 V, IIS =
50 mA
−
0.02
−
W
VCC = 3.6 V
−
125
200
W
Audio THD
From 20 Hz to 20 kHz
VIS = 0.4 VRMS, DC bias = 0V,
Load = 16 W
−
0.01
−
%
Power Supply Ripple Rejection
From VCC onto AUDN / AUDP
f = 217 Hz, RL = 16 W
−
90
−
dB
DIL
PSRRSW
Power Supply Ripple Rejection
AUDIO SWITCHES DC CHARACTERISCTICS
RON
RSH
Shunt Resistance
AUDIO SWITCHES AC CHARACTERISTICS
THDAUD
PSRRAUD
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NCN1188
ELECTRICAL CHARACTERISTICS
Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V,
TA = +25°C (unless otherwise noted).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
(Notes 6 and 7)
−
0.25
−
ns
SWITCHES TIMING CHARACTERISCTICS
tPD
Propagation Delay
tON
Turn On Time
VIS = 1 V, RL = 50 W, CL = 7 pF
(fixture only)
−
2.2
−
ms
tOFF
Turn Off Time
VIS = 1 V, RL = 50 W, CL = 7 pF
(fixture only)
−
67
−
ns
tb−b
Bit−to−Bit Skew
Within the same differential
channel
−
5
−
ps
Channel−to−Channel Skew
Maximum skew between all
channels
−
15
−
ps
tch−ch
6. Specification guarantee by design
7. No other delays than the RC network formed by the load resistance and the load capacitance of the switch are added on the bus. For a 10 pF
load, this delay is 5 ns which is much smaller than rise and fall time of typical driving systems. Propagation delays on the bus are determined
by the driving circuit on the driving side and its interactions with the load of the driven side.
TABLE OF GRAPHS
Symbol
Parameter
Figure
480pEYE
MHL Video 480p, 60fps Eye Diagram
5, 6
720pEYE
1080iEYE
MHL Video 720p, 60fps Eye Diagram
MHL Video 1080i, 30fps Eye Diagram
7, 8
USB2.0EYE
USB 2.0 High Speed 480 Mbps Eye Diagram
9, 10
USB1.1EYE
USB 1.1 Full Speed 12 Mbps Eye Diagram
11, 12
USB1.0EYE
USB 1.0 Low Speed 1.5 Mbps Eye Diagram
13, 14
ICC
Product Supply Current
vs. VCC
15
RON
Data Path On Resistance
vs. VIS
16
DIL
Data Switch Differential Insertion Loss
vs. Frequency
17
DISO
Data Switch Differential Off Isolation
vs. Frequency
18
DCTK
Data Switch Differential Crosstalk
vs. Frequency
19
RON
Audio Path On Resistance
vs. VIS
20
Audio THD
vs. Frequency
21
THDAUD
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NCN1188
TYPICAL OPERATING CHARACTERISTICS
Figure 4. MHL Video 480p, 60fps Eye Diagram
Figure 5. MHL Video 480p, 60fps Single−Ended
Waveforms
Figure 6. MHL Video 720p, 60fps and 1080i, 30fps Eye
Diagram
Figure 7. MHL Video 720p, 60fps and 1080i, 30fps
Single−Ended Waveforms
Figure 8. USB 2.0 High Speed Eye Diagram
Figure 9. USB 2.0 High Speed Pattern
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NCN1188
TYPICAL OPERATING CHARACTERISTICS
Figure 10. USB 1.1 Full Speed Eye Diagram
Figure 11. USB 1.0 Full Speed Pattern
Figure 12. USB 1.0 Low Speed Eye Diagram
Figure 13. USB 1.0 Low Speed Pattern
6.3
DATA PATH ON RESISTANCE (W)
QUIESCENT CURRENT (mA)
35
30
25
20
15
10
5
0
2
2.5
3
3.5
4
4.5
5
6.1
5.9
5.7
5.5
5.3
5.1
4.9
4.7
4.5
5.5
0
1
2
3
VCC (V)
VIS (V)
Figure 14. Product Supply Current
Figure 15. Data Path On Resistance
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4
NCN1188
TYPICAL OPERATING CHARACTERISTICS
0
−5
−10
−15
−1
−3
MAGNITUDE (dB)
MAGNITUDE (dB)
−2
−4
−5
−6
−7
−8
−9
−10
10000000
100000000
1E+09
1E+10
−30
−35
−40
−45
−50
−55
−60
−65
10000000
100000000
1E+09
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 16. Data Switch Differential Insertion
Loss
Figure 17. Data Switch Differential Off
Isolation
1E+10
5
AUDIO PATH ON RESISTANCE (W)
0
−10
−20
−30
−40
−50
−60
−70
10000000
100000000
1E+09
1E+10
4.5
4
3.5
3
2.5
2
−2
−1
0
1
FREQUENCY (Hz)
VIS (V)
Figure 18. Data Switch Differential Crosstalk
Figure 19. Audio Path On Resistance
0.03
0.025
0.02
%THD+N
MAGNITUDE (dB)
−20
−25
0.015
0.01
0.005
0
10
100
1000
FREQUENCY (Hz)
Figure 20. Audio THD
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10000
2
NCN1188
PARAMETER MEASUREMENT INFORMATION
Figure 21. Differential Insertion Loss (SDD21)
Figure 22. Differential Off Isolation (SDD21)
Figure 23. Differential Crosstalk (SDD21)
Figure 24. Bit−to−Bit and Channel−to−Channel Skew
tskew = |tPLH1-tPLH2| or |tPHL1-tPHL2|
Figure 25. tON and tOFF
Figure 27. On State Leakage
Figure 26. Off State Leakage
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NCN1188
DETAILED APPLICATION
from 3.0 V to 4.2 V. The NCN1188 switch connects a 5−pin
micro−USB connector to a Communication Processor, an
MHL Application Processor, and the Audio Management IC
headphone amplifier. Each function is active pending on
power management IC accessory detection to control IN1
and IN2. This decision is usually made on the D−, D+, and
ID pins to detect and differentiate accessory types such as
USB cable, USB to HDMI MHL cable and micro−USB
stereo headset.
For solutions related to portable devices accessory
detection, contact your ON Semiconductor Field
Applications Engineer.
The USB 3.0 Micro−B receptacle may be considered a
combination of the USB 2.0 Micro−B interface and USB 3.0
SuperSpeed contacts and maintains backward compatibility
with USB 2.0 Micro−B plugs. As a consequence, the
NCN1188’s USB 2.0 capability is fully compatible to the
USB 3.0 Micro−B receptacle, as well as USB 2.0
accessories.
The NCN1188 voltage range and high bandwidth
performance permits switching between audio, video and
data signals on a portable device. It allows D+ and D− data
pins of a single USB connector to be used for many different
functions as pictured by Figure 1:
• USB 2.0 data transfer with backward compatibility to
USB 1.1 and USB 1.0
• MHL high definition video transfer up to 1080i, 30fps
and 720p, 60fps
• Audio headset with negative voltage capability to
connect true ground audio amplifier
• UART to address programming and testing in factory
• Any other analog or digital data sources within the
recommended operating conditions
Figures 28 and 29 detail two design examples with
different switching combinations using NCN1188.
In the first example shown in Figure 28, the device is
directly supplied from a single Li−Ion battery, typically
Single Cell Li−ion
3.0V to 4.2V
Power Management IC
Battery Charger
D−
D+
ID
100n
Vcc_IO
3
9
ID_in
USB 2.0
Communication Processor
USB−
5
USB+
1
MHL−
4
MHL+
2
6
Vcc_core
Vcc_IO
HD
ID_out
Video
12
11
IN1
Vcc_core
IN2
7
Accessory Detect
VCC
USB2.0_MICROB
GND
DN
DP
HDN
D−
8
D+
10
VBUS
D−
D+
ID
1
2
3
4
5
HDP
AUDN
AUDP
NCN1188
CBUS
MHL Application Processor
Control
Audio Left
Headset
Amps
Audio Right
Audio Management IC
Figure 28. Schematic Example for USB 2.0, MHL, and Audio Combination; NCN1188 being supplied from battery
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NCN1188
Power Management IC
Over Voltage Protection
Protected 5V
D−
D+
ID
OVP 28V
Vcc_core
3
100n
Vcc_IO
9
ID_in
USB 2.0
USB−
5
USB+
1
4
MicB_SSTX−
2
MicB_SSTX+
USB 3.0
6
MicB_SSRX−
12
MicB_SSRX+
UART
IN2
7
Accessory Detect
11
Battery Charger
IN1
Single Cell Li−ion
3.0V to 4.2V
VCC
USB3.0_MICROB
GND
DN
DP
HDN
HDP
AUDN
D−
8
D+
10
VBUS
D−
D+
ID
MicB_SSTX−
MicB_SSTX+
MicB_SSRX−
MicB_SSRX+
1
2
3
4
5
6
7
8
9
10
AUDP
NCN1188
Rx
Tx
Communication Processor
Vcc_core
MHL−
Vcc_IO
HD
ID_out
Video
MHL+
CBUS
MHL Application Processor
Figure 29. Schematic Example for USB 2.0, MHL, and UART Combination; NCN1188 Being Supplied by Protected
VBUS 5 V
Micro−B topology: USB 2.0, UART and MHL Video pairs
remain multiplexed with D− and D+ while the two USB 3.0
differential pairs are directly connected to the main
communication processor.
The flexibility of the NCN1188 offers many extra
application and design combinations.
In this second design proposal, as NCN1188 must be
active only when VBUS accessories are connected (USB
cable, UART cable and MHL cable), the device is supplied
from a protected VBUS 5 V. This design arrangement limits
the system’s overall quiescent current and saves battery life.
Figure 29 also pictures NCN1188 around a USB 3.0
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NCN1188
PCB DESIGN PROCEDURE
• Make the signal traces as short as possible to reduce
Implementing a high speed device requires careful design
of signal traces to preserve signal integrity. The following
electrical layout guidelines are basic rules to follow when
designing boards capable of high speed transmission.
• The bypass capacitor must be placed as close as
possible to the VCC input pin for noise immunity.
• The characteristic impedance of each High Speed USB
segment must be 45 W. The characteristic impedance of
each line is determined by (1) the distance between the
signal trace and the inner layer ground plane of the
PCB, as well as (2) the signal trace width.
•
losses through the PCB. Furthermore, all corresponding
D+ / D− line segment pairs should be the same length.
Route D+ / D− line segment pairs as close as possible
for good common mode rejection.
The use of turns or bends to route these signals should
be avoided when possible. Use 45° bends instead of 90°
bends where bends are needed. The use of vias to route
these signals should be avoided when possible.
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NCN1188
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
D
PIN 1 REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
ÉÉ
ÉÉ
L1
DETAIL A
E
NOTE 5
TOP VIEW
DIM
A
A1
A3
b
D
E
e
K
L
L1
L2
DETAIL B
A
0.05 C
12X
OPTIONAL
CONSTRUCTION
0.05 C
A1
A3
8X
C
SIDE VIEW
SEATING
PLANE
K
5
7
DETAIL A
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
e
2.00
1
12X
DETAIL B
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.70 BSC
2.00 BSC
0.40 BSC
0.20
---0.45
0.55
0.00
0.03
0.15 REF
11
L
12X
L2
BOTTOM VIEW
1
b
0.10
M
C A B
0.05
M
C
NOTE 3
0.32
2.30
0.40
PITCH
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCN1188/D